Communication connector with crosstalk compensation

• US 9,356,396 B2
• Filed: 09/11/2015
• Issued: 05/31/2016
• Est. Priority Date: 06/01/2012
• Status: Active Grant

• Current Assignee: Panduit Corporation
• Original Assignee: Panduit Corporation
• Inventors: Bolouri-Saransar, Masud, Nordin, Ronald A.
• Primary Examiner(s): Takaoka, Dean
• Assistant Examiner(s): Wong, Alan
• Application Number:
  US14/851,271
• Publication Number:
  US 20160006180A1
• Time in Patent Office: 263 Days
• Field of Search: 333/1, 333/5, 333/24.C, 333/260, 439/676, 439/941, 439/620.11, 439/660
• US Class Current: 1/1
• CPC Class Codes: H01F 2038/146 in combination with capacitive coupling
• CPC Class Codes: H01F 38/14 Inductive couplings for wireless supply or distribution of electric power using inductive coupling H02J50/10
• CPC Class Codes: H01R 13/6466 on substrates, e.g. printed circuit boards [PCB]
• CPC Class Codes: H01R 13/6469 on substrates
• CPC Class Codes: H01R 13/665 with built-in electronic circuit H01R13/70, H01R13/719 take precedence
• CPC Class Codes: H01R 2107/00 Four or more poles
• CPC Class Codes: H01R 24/62 Sliding engagements with one side only, e.g. modular jack coupling devices
• CPC Class Codes: H01R 4/2416 the contact members having insulation-cutting edges, e.g. of tuning fork type
• CPC Class Codes: H05K 1/0228 Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors balanced signal pairs H05K1/0245
• CPC Class Codes: H05K 1/0239 Signal transmission by AC coupling
• CPC Class Codes: H05K 2201/10189 Non-printed connector

Abstract

A communication connector comprising plug interface contacts having a plurality of conductor pairs, and corresponding cable connector contacts. A printed circuit board connects the plug interface contacts to respective cable connector contacts. The printed circuit board includes circuitry between a first conductor pair and a second conductor pair. The circuitry has a first mutually inductive coupling between a first conductor of the first conductor pair and a first conductor of the second conductor pair, a first capacitive coupling between the first conductor of the first conductor pair and the first conductor of the second conductor pair. The first capacitive coupling is approximately concurrent with the first mutually inductive coupling. A shunt capacitive coupling connects the first conductor of the second conductor pair to a second conductor of the second conductor pair.

Claims

1. A circuit for crosstalk compensation, said circuit comprising:

a first, a second, a third, and a fourth signal conductors,

said first and said fourth signal conductors forming a first signal-pair, and said

second and said third signal conductors forming a second signal-pair,

a first offshoot conductor having a first end and a second end; and

a second offshoot conductor having a first end and a second end,

said first end of said first offshoot conductor being connected to said second signal conductor, said first end of said second offshoot conductor being connected to said third signal conductor, and said second end of said first offshoot conductor being capacitively coupled to said second end of said second offshoot conductor,

wherein a first capacitive coupling and a first mutual inductive coupling occur between at least a portion of said first signal conductor and at least a portion of said first offshoot conductor, and wherein a second capacitive coupling and a second mutual inductive coupling occur between at least a portion of said fourth signal conductor and at least a portion of said second offshoot conductor.

2. The circuit of claim 1, wherein said second end of said first offshoot conductor is capacitively coupled to said second end of said second offshoot conductor via a capacitor.

3. The circuit of claim 2, wherein said capacitor includes a first capacitor member and a second capacitor member, said first capacitor member being connected to said second end of said first offshoot conductor and said second capacitor member being connected to said second end of said second offshoot conductor.

4. The circuit of claim 2, wherein said capacitor is at least one of a finger capacitor and a pad capacitor.

5. The circuit of claim 1, wherein at least one of said first capacitive coupling and said first mutual inductive coupling is achieved by at least one of distributed coupling and discrete coupling element.

6. The circuit of claim 1, wherein said first capacitive coupling and said first mutual inductive coupling occur at an approximately same time.

7. The circuit of claim 6, wherein said second capacitive coupling and said second mutual inductive coupling occur at an approximately same time.

8. The circuit of claim 7, wherein said first capacitive coupling, said first mutual inductive coupling, said second capacitive coupling, and said second mutual inductive coupling occur at an approximately same time.

9. The circuit of claim 1, wherein a signal produced by said first mutual inductive coupling is phase-shifted approximately 90 degrees relative to a signal produced by said first capacitive coupling.

10. The circuit of claim 1, wherein a combined signal produced by said first mutual inductive coupling and said second mutual inductive coupling is phase-shifted approximately 90 degrees relative to a combined signal produced by said first capacitive coupling and said second capacitive coupling.

11. The circuit of claim 1, wherein

said second signal conductor is connected to a first source impedance,

said third signal conductor is connected to a second source impedance, and

said first source impedance, said second source impedance, and said capacitive coupling between said second end of said first offshoot conductor and said second end of said second offshoot conductor forming a resistor-capacitor circuit,

said resistor-capacitor circuit being excited in response to a signal transmitted on said first signal conductor and said fourth signal conductor.

12. The circuit of claim 1, wherein said circuit is implemented on at least one of a printed circuit board and a lead frame.

13. A communication jack, comprising:

a first, a second, a third, and a fourth signal conductors,

each of said first, said second, said third, and said fourth signal conductors having a respective plug interface contact, a respective insulation displacement contact, and a respective signal trace connecting said respective plug interface contact to said respective insulation displacement contact,

said first and said fourth signal conductors forming a first signal-pair, and said

second and said third signal conductors forming a second signal-pair;

a first offshoot conductor having a first end and a second end; and

a second offshoot conductor having a first end and a second end,

said first end of said first offshoot conductor being connected to said second signal conductor, said first end of said second offshoot conductor being connected to said third signal conductor, and said second end of said first offshoot conductor being capacitively coupled to said second end of said second offshoot conductor,

wherein a first capacitive coupling and a first mutual inductive coupling occur between at least a portion of said first signal conductor and at least a portion of said first offshoot conductor, and wherein a second capacitive coupling and a second mutual inductive coupling occur between at least a portion of said fourth signal conductor and at least a portion of said second offshoot conductor.

14. The communication jack of claim 13, wherein said second end of said first offshoot conductor is capacitively coupled to said second end of said second offshoot conductor via a capacitor.

15. The communication jack of claim 14, wherein said capacitor includes a first capacitor member and a second capacitor member, said first capacitor member being connected to said second end of said first offshoot conductor and said second capacitor member being connected to said second end of said second offshoot conductor.

16. The communication jack of claim 14, wherein said capacitor is at least one of a finger capacitor and a pad capacitor.

17. The communication jack of claim 13, wherein at least one of said first capacitive coupling and said first mutual inductive coupling is achieved by at least one of distributed coupling and discrete coupling element.

18. The communication jack of claim 13, wherein said first capacitive coupling and said first mutual inductive coupling occur at an approximately same time.

19. The communication jack of claim 18, wherein said second capacitive coupling and said second mutual inductive coupling occur at an approximately same time.

20. The communication jack of claim 19, wherein said first capacitive coupling, said first mutual inductive coupling, said second capacitive coupling, and said second mutual inductive coupling occur at an approximately same time.

21. The communication jack of claim 13, wherein a signal produced by said first mutual inductive coupling is phase-shifted approximately 90 degrees relative to a signal produced by said first capacitive coupling.

22. The communication jack of claim 13, wherein a combined signal produced by said first mutual inductive coupling and said second mutual inductive coupling is phase-shifted approximately 90 degrees relative to a combined signal produced by said first capacitive coupling and said second capacitive coupling.

23. The communication jack of claim 13, wherein

said second signal conductor is connected to a first source impedance,

said third signal conductor is connected to a second source impedance, and

said first source impedance, said second source impedance, and said capacitive coupling between said second end of said first offshoot conductor and said second end of said second offshoot conductor forming a resistor-capacitor circuit,

said resistor-capacitor circuit being excited in response to a signal transmitted on said first signal conductor and said fourth signal conductor.

24. The communication jack of claim 13, further comprising a printed circuit board, wherein at least a part of each of said first, said second, said third, and said fourth signal traces is positioned on said printed circuit board, and

wherein at least a part of said first offshoot conductor and at least a part of said second offshoot conductor is positioned on said printed circuit board.

25. The communication jack of claim 13, wherein said jack is mateable to a corresponding plug producing some amount of plug crosstalk, and wherein said first capacitive coupling and said first mutual inductive coupling occur at an approximately same distance from said plug crosstalk.

26. The communication jack of claim 13, wherein said respective signal traces are formed as at least one of printed circuit board traces and leadframe traces.

27. A communication system comprising:

a communication equipment; and

a communication jack installed in said communication equipment, said communication jack including;

a first, a second, a third, and a fourth signal conductors,

each of said first, said second, said third, and said fourth signal conductors having a respective plug interface contact, a respective insulation displacement contact, and a respective signal trace connecting said respective plug interface contact to said respective insulation displacement contact,

said first and said fourth signal conductors forming a first signal-pair, and said second and said third signal conductors forming a second signal-pair;

a first offshoot conductor having a first end and a second end; and

a second offshoot conductor having a first end and a second end,

said first end of said first offshoot conductor being connected to said second signal conductor, said first end of said second offshoot conductor being connected to said third signal conductor, and said second end of said first offshoot conductor being capacitively coupled to said second end of said second offshoot conductor,

wherein a first capacitive coupling and a first mutual inductive coupling occur between at least a portion of said first signal conductor and at least a portion of said first offshoot conductor, and wherein a second capacitive coupling and a second mutual inductive coupling occur between at least a portion of said fourth signal conductor and at least a portion of said second offshoot conductor.