Optical isolator preventive measure indicator

• US 9,356,693 B1
• Filed: 12/26/2013
• Issued: 05/31/2016
• Est. Priority Date: 04/12/2013
• Status: Active Grant

• Current Assignee: Maxim Integrated Products, Inc. (Analog Devices, Inc.)
• Original Assignee: Maxim Integrated Products, Inc. (Analog Devices, Inc.)
• Inventors: Hematy, Arman
• Primary Examiner(s): Woldekidan, Hibret
• Application Number:
  US14/140,746
• Time in Patent Office: 887 Days
• Field of Search: 398/25, 398/37, 398/38, 398/140, 398/154, 398/155, 398/202, 398/208, 398/210, 398/10, 398/17, 398/20, 398/24, 398/28, 398/21, 398/137, 398/163
• US Class Current: 1/1
• CPC Class Codes: H04B 10/07955 Monitoring or measuring power
• CPC Class Codes: H04B 10/25 Arrangements specific to fibre transmission
• CPC Class Codes: H04B 10/802 for isolation, e.g. using optocouplers

Abstract

A system includes a light emitting device on a first side of electrically isolated circuitry for transmitting an optical signal to a second side of the electrically isolated circuitry. The system also includes an optical receiver on the second side of the electrically isolated circuitry for receiving the optical signal from the light emitting device. The system further includes a sensor coupled with the optical receiver for sampling the intensity of the optical signal received by the optical receiver.

Claims

1. A system comprising:

a light emitting diode on a first side of electrically isolated circuitry for transmitting a digital optical signal to a second side of the electrically isolated circuitry;

an optical receiver on the second side of the electrically isolated circuitry for receiving the digital optical signal from the light emitting diode; and

a sensor coupled with the optical receiver for periodically sampling the intensity of the digital optical signal received by the optical receiver to determine a health of the link between the light emitting diode and the optical receiver; and

a sigma-delta modulator and an oscillator disposed on the first side of the electrically isolated circuitry and configured to provide a clock signal to the light emitting diode.

2. The system as recited in claim 1, wherein the first side of the electrically isolated circuitry is configured to operate at a higher voltage than the second side of the electrically isolated circuitry.

3. The system as recited in claim 1, further comprising clock and data recovery circuitry disposed on the second side of the electrically isolated circuitry and configured to receive the clock signal.

4. The system as recited in claim 1, wherein the sensor comprises a current sensor.

5. The system as recited in claim 4, wherein the current sensor comprises an analog-to-digital converter.

6. A system comprising:

a light emitting device on a first side of electrically isolated circuitry for transmitting a digital optical signal to a second side of the electrically isolated circuitry;

an optical receiver on the second side of the electrically isolated circuitry for receiving the digital optical signal from the light emitting device; and

a current sensor coupled with the optical receiver for periodically sampling the intensity of the digital optical signal received by the optical receiver to determine a health of the link between the light emitting diode and the optical receiver; and

a sigma-delta modulator and an oscillator disposed on the first side of the electrically isolated circuitry and configured to provide a clock signal to the light emitting device.

7. The system as recited in claim 6, wherein the first side of the electrically isolated circuitry is configured to operate at a higher voltage than the second side of the electrically isolated circuitry.

8. The system as recited in claim 6, further comprising clock and data recovery circuitry disposed on the second side of the electrically isolated circuitry and configured to receive the clock signal.

9. The system as recited in claim 6, wherein the current sensor comprises an analog-to-digital converter.

10. A chip package comprising:

a first integrated circuit chip comprising a light emitting device on a first side of electrically isolated circuitry for transmitting a digital optical signal to a second side of the electrically isolated circuitry, and an optical receiver on the second side of the electrically isolated circuitry for receiving the digital optical signal from the light emitting device; and

a second integrated circuit chip comprising a current sensor coupled with the optical receiver for periodically sampling the intensity of the digital optical signal received by the optical receiver to determine a health of the link between the light emitting device and the optical receiver; and

a third integrated circuit chip comprising a sigma-delta modulator and an oscillator disposed on the first side of the electrically isolated circuitry and configured to provide a clock signal to the light emitting device.

11. The chip package as recited in claim 10, wherein the first side of the electrically isolated circuitry is configured to operate at a higher voltage than the second side of the electrically isolated circuitry.

12. The chip package as recited in claim 10, wherein the second integrated circuit chip comprises clock and data recovery circuitry disposed on the second side of the electrically isolated circuitry and configured to receive the clock signal.

13. The chip package as recited in claim 10, wherein the current sensor comprises an analog-to-digital converter.