Molding method for COB-EUSB devices and metal housing package

• US 9,357,658 B2
• Filed: 02/27/2015
• Issued: 05/31/2016
• Est. Priority Date: 12/02/2003
• Status: Expired due to Fees

• Current Assignee: Super Talent Technology, Corporation
• Original Assignee: Super Talent Technology, Corporation
• Inventors: Ni, Jim Chin-Nan, Nan, Nan, Ma, Abraham C.
• Primary Examiner(s): Kim, Paul D
• Application Number:
  US14/634,269
• Publication Number:
  US 20150173210A1
• Time in Patent Office: 459 Days
• Field of Search: 361/737, 361/748, 361/761, 361/752, 361/730, 361/727, 361/715, 361/800, 439/55, 439/76.1, 439/660, 298/40
• US Class Current: 1/1
• CPC Class Codes: G06F 1/1632 External expansion units, e.g. docking stations
• CPC Class Codes: H01L 2223/5442 comprising non digital, non alphanumeric information, e.g. symbols
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01077 : Iridium [Ir]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01R 12/57 : surface mounting terminals
• CPC Class Codes: H01R 12/71 : for rigid printing circuits or like structures
• CPC Class Codes: H05K 1/117 : Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
• CPC Class Codes: H05K 2201/0311 : Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact
• CPC Class Codes: H05K 2201/09472 : Recessed pad for surface mounting recess in pad H05K2201/09745; Recessed electrode of component
• CPC Class Codes: H05K 2203/1316 : Moulded encapsulation of mounted components
• CPC Class Codes: H05K 3/0052 : Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
• CPC Class Codes: H05K 3/284 : for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 3/326 : the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits H05K3/365 takes precedence
• CPC Class Codes: H05K 3/3485 : Applying solder paste, slurry or powder thick film methods for applying conductive paste or ink patterns H05K3/12
• CPC Class Codes: H05K 3/361 : Assembling flexible printed circuits with other printed circuits
• CPC Class Codes: H05K 3/4007 : Surface contacts, e.g. bumps H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3457
• CPC Class Codes: H05K 3/4046 : using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
• CPC Class Codes: H05K 5/0278 : of USB type details relating to connectors H01R27/00
• CPC Class Codes: Y10T 29/49128 : Assembling formed circuit to base

Abstract

A dual-personality extended USB (EUSB) system supports both USB and EUSB devices using an extended 9-pin EUSB socket. Each EUSB device includes a PCBA having four standard USB metal contact pads, and several extended purpose contact springs disposed on an upper side of a PCB. A single-shot molding process is used to form a molded housing over passive components and IC dies disposed on the lower PCB surface. The passive components are mounted using SMT methods, and the IC dies are mounted using COB methods. The extended 9-pin EUSB socket includes standard USB contacts and extended use contacts that communicate with the PCBA through the standard USB metal contacts and the contact springs. The EUSB device is optionally used as a modular insert that is mounted onto a metal or plastic case to provide a EUSB assembly having a plug shell similar to a standard USB male connector.

Claims

1. A method for producing an Extended Universal-Serial-Bus (EUSB) device comprising:

producing a printed circuit board (PCB) including opposing first and second surfaces, a plurality of input/output contact pads disposed on the first surface, a plurality of first contact pads disposed on the second surface;

mounting a plurality of contact springs onto the first surface of the PCB such that said contact springs are electrically connected to corresponding input/output contact pads of said plurality of input/output contact pads, wherein each of the plurality of contact springs includes a raised contact portion that protrudes above the first surface of said PCB;

attaching at least one integrated circuit (IC) to the first contact pads; and

forming a single-shot molded housing only on and entirely covering the second surface of the PCB such that said at least one IC is encased by said housing, and such that said PCB is disposed between an entirety of said housing and said contact springs, to produce said EUSB.

2. The method of claim 1,

wherein producing said PCB comprises forming a plurality of second contact pads on the second surface, and

wherein the method further comprises attaching at least one passive component to the second contact pads before forming said single-shot molded housing.

3. The method of claim 2, wherein attaching said at least one passive component comprises:

printing a solder paste on said second contact pads;

mounting said at least one passive component on said second contact pads; and

reflowing the solder paste such that said at least one passive component is fixedly soldered to said second contact pads.

4. The method of claim 1,

wherein producing said PCB comprises forming a plurality of second contact pads on the first surface, and

wherein the method further comprises attaching at least one passive component to the second contact pads.

5. The method of claim 1, wherein mounting said plurality of contact springs comprises forming a spring assembly by attaching each of said plurality of contact springs to a spring guide block, and then mounting said spring assembly onto the first surface of the PCB.

6. The method of claim 5, wherein mounting said spring assembly onto the first surface of the PCB comprises soldering at least one base portion of each of said contact springs to a corresponding input/output contact pad disposed on the first surface of the PCB.

7. The method of claim 6,

wherein forming the spring block assembly comprises disposing four standard USB contact pads on the spring guide block adjacent to the plurality of contact springs, and

wherein mounting said spring assembly onto the first surface of the PCB comprises soldering a portion of each of said four standard USB contact pads to a corresponding input/output contact pad disposed on the first surface of the PCB.

8. The method of claim 1, further comprising

grinding a wafer including said at least one IC such that a thickness of said wafer is reduced during said grinding, and then dicing said wafer to provide said at least one IC, wherein attaching the at least one IC comprises bonding said at least one IC to the second surface of the PCB and wire bonding the at least one IC to said second contact pad.