Liquid-cooling apparatus with integrated coolant filter

• US 9,357,674 B2
• Filed: 12/18/2013
• Issued: 05/31/2016
• Est. Priority Date: 12/18/2013
• Status: Active Grant

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Campbell, Levi A., Chu, Richard C., David, Milnes P., Ellsworth, Michael J. Jr., Iyengar, Madhusudan K., Schmidt, Roger R., Simons, Robert E.
• Primary Examiner(s): Haughton, Anthony
• Assistant Examiner(s): Dhillon, Matt
• Application Number:
  US14/132,230
• Publication Number:
  US 20150173251A1
• Time in Patent Office: 895 Days
• Field of Search: 361/696, 361/697.47, 361/697.53, 361/695, 361/698, 361/699, 361/700, 165/45, 165/185, 298/900.3
• US Class Current: 1/1
• CPC Class Codes: H05K 7/20218 using a liquid coolant without phase change in electronic enclosures in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954
• CPC Class Codes: H05K 7/2039 characterised by the heat transfer by conduction from the heat generating element to a dissipating body arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00
• CPC Class Codes: H05K 7/20772 within server blades for removing heat from heat source
• CPC Class Codes: Y10T 29/4935 Heat exchanger or boiler making

Abstract

Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from an electronic component(s). The cooling apparatus includes a liquid-cooled heat sink with a thermally conductive structure having a coolant-carrying compartment including a region of reduced cross-sectional coolant flow area. The heat sink includes a coolant inlet and outlet in fluid communication with the compartment, and the region of reduced cross-sectional coolant flow area provides an increased effective heat transfer coefficient between a main heat transfer surface of the conductive structure and the coolant. The cooling apparatus further includes a coolant loop coupled to the coolant inlet and outlet to facilitate flow of coolant through the coolant-carrying compartment, and a coolant filter positioned to filter contaminants from the coolant passing through the heat sink. The coolant filter has a larger cross-sectional coolant flow area than the region of reduced cross-sectional coolant flow area.

Claims

1. A cooling apparatus comprising:

a liquid-cooled heat sink configured to cool at least one electronic component, the liquid-cooled heat sink comprising;

a thermally conductive structure with a coolant-carrying compartment comprising, at least in part, a region of reduced cross-sectional coolant flow area through which coolant flows;

a coolant inlet and a coolant outlet associated with the thermally conductive structure and in fluid communication with the coolant-carrying compartment of the thermally conductive structure to facilitate coolant flow therethrough;

wherein the region of reduced cross-sectional coolant flow area of the coolant-carrying compartment provides an increased effective heat transfer coefficient between a main heat transfer surface of the thermally conductive structure and the coolant within the coolant-carrying compartment;

a coolant loop coupled to the coolant inlet and the coolant outlet of the liquid-cooled heat sink to facilitate flow of coolant through the coolant-carrying compartment thereof;

a coolant filter positioned to filter contaminants from the coolant passing through the liquid-cooled heat sink, the coolant filter having a larger cross-sectional coolant flow area than the region of reduced cross-sectional coolant flow area of the coolant-carrying compartment within the thermally conductive structure of the liquid-cooled heat sink; and

wherein the coolant filter is associated with the coolant loop for filtering the coolant before ingressing via the coolant inlet into the coolant-carrying compartment of the thermally conductive structure of the liquid-cooled heat sink; and

wherein the coolant filter is disposed upstream of the liquid-cooled heat sink within a coolant loop connection subassembly, wherein the cross-sectional coolant flow area of the coolant filter is larger than a cross-sectional coolant flow area of the coolant loop.

2. The cooling apparatus of claim 1, wherein the coolant filter is positioned within the thermally conductive structure of the liquid-cooled heat sink upstream of the region of reduced cross-sectional coolant flow area of the coolant-carrying compartment.

3. The cooling apparatus of claim 2, wherein the cross-sectional coolant flow area of the coolant filter is at least twice as large as the cross-sectional coolant flow area of the region of reduced cross-sectional coolant flow area of the coolant-carrying compartment within the thermally conductive structure of the liquid-cooled heat sink.

4. The cooling apparatus of claim 2, wherein the coolant filter is replaceable, with the liquid-cooled heat sink coupled to the at least one electronic component to be cooled.

5. The cooling apparatus of claim 2, wherein the coolant-carrying compartment comprises a converging inlet plenum converging towards the region of reduced cross-sectional coolant flow area, and wherein the coolant filter is disposed within the converging inlet plenum.

6. The cooling apparatus of claim 2, wherein the coolant filter encircles the region of reduced cross-sectional coolant flow area.

7. The cooling apparatus of claim 6, wherein the coolant traverses through at least a portion of the reduced cross-sectional coolant flow area of the coolant-carrying compartment of the thermally conductive structure and exhausts from the thermally conductive structure over the region of reduced cross-sectional coolant flow area.

8. The cooling apparatus of claim 1, wherein the coolant filter subassembly comprises a first end and a second end which couple in fluid communication with the coolant loop to facilitate flow of coolant within the coolant loop through the coolant filter, the first end and the second end comprising a first quick connect coupler and a second quick connect coupler, respectively.

9. A cooling apparatus comprising:

a liquid-cooled heat sink configured to cool at least one electronic component, the liquid-cooled heat sink comprising;

a thermally conductive structure with a coolant-carrying compartment comprising, at least in part, a region of reduced cross-sectional coolant flow area through which coolant flows;

a coolant inlet and a coolant outlet associated with the thermally conductive structure and in fluid communication with the coolant-carrying compartment of the thermally conductive structure to facilitate coolant flow therethrough;

wherein the region of reduced cross-sectional coolant flow, area of the coolant-carrying compartment provides an increased effective heat transfer coefficient between a main heat transfer surface of the thermally conductive structure and the coolant within the coolant-carrying compartment;

a coolant loop coupled to the coolant inlet and the coolant outlet of the liquid-cooled heat sink to facilitate flow of coolant through the coolant-carrying compartment thereof; and

a coolant filter positioned to filter contaminants from the coolant passing through the liquid-cooled heat sink, the coolant filter having a larger cross-sectional coolant flow area than the region of reduced cross-sectional coolant flow area of the coolant-carrying compartment within the thermally conductive structure of the liquid-cooled heat sink, wherein the region of reduced cross-sectional coolant flow area comprises a coolant flow opening with a critical coolant flow dimension less than 0.5 mm.

10. A cooled electronic module comprising;

at least one electronic component to be cooled; and

a cooling apparatus to facilitate cooling of the at least one electronic component, the cooling apparatus comprising;

a liquid-cooled heat sink coupled to the at least one electronic component to be cooled, the liquid-cooled heat sink comprising;

a thermally conductive structure with a coolant-carrying compartment comprising, at least in part, a region of reduced cross-sectional coolant flow area through which coolant flows;

a coolant inlet and a coolant outlet associated with the thermally conductive structure and in fluid communication with the coolant-carrying compartment of the thermally conductive structure to facilitate coolant flow therethrough;

wherein the region of reduced cross-sectional coolant flow area of the coolant-carrying compartment provides an increased effective heat transfer coefficient between a main heat transfer surface of the thermally conductive structure and the coolant within the coolant-carrying compartment;

a coolant loop coupled to the coolant inlet and the coolant outlet of the liquid-cooled heat sink to facilitate flow of coolant through the coolant-carrying compartment thereof; and

a coolant filter positioned to filter contaminants from the coolant passing through the liquid-cooled heat sink, the coolant filter having a larger cross-sectional coolant flow area than the region of reduced cross-sectional coolant flow area of the coolant-carrying compartment within the thermally conductive structure of the liquid-cooled heat sink.

11. The cooled electronic module of claim 10, wherein the coolant filter is positioned within the thermally conductive structure of the liquid-cooled heat sink upstream of the region of reduced cross-sectional coolant flow area of the coolant-carrying compartment.

12. The cooled electronic module of claim 11, wherein the cross-sectional coolant flow area of the coolant filter is at least twice as large as the cross-sectional coolant flow area of the region of reduced cross-sectional coolant flow area of the coolant-carrying compartment within the thermally conductive structure of the liquid-cooled heat sink.

13. The cooled electronic module of claim 11, wherein the coolant filter is replaceable, with the liquid-cooled heat sink coupled to the at least one electronic component to be cooled.

14. The cooled electronic module of claim 11, wherein the coolant-carrying compartment comprises a converging inlet plenum converging towards the region of reduced cross-sectional coolant flow area, and wherein the coolant filter is disposed within the converging inlet plenum.

15. The cooled electronic module of claim 11, wherein the coolant filter encircles the region of reduced cross-sectional coolant flow area.

16. The cooled electronic module of claim 15, wherein the coolant traverses through at least a portion of the reduced cross-sectional coolant flow area of the coolant-carrying compartment of the thermally conductive structure and exhausts from the thermally conductive structure over the region of reduced cross-sectional coolant flow area.

17. The cooled electronic module of claim 10, wherein the coolant filter is disposed within a coolant filter subassembly, the coolant filter subassembly comprising a first end and a second end which couple in fluid communication with the coolant loop to facilitate flow of coolant within the coolant loop through the coolant filter, the first end and the second end comprising a first quick connect coupler and a second quick connect coupler, respectively.