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Microelectromechanical systems (MEMS) devices with control circuits and methods of fabrication

  • US 9,359,192 B1
  • Filed: 01/09/2015
  • Issued: 06/07/2016
  • Est. Priority Date: 01/09/2015
  • Status: Active Grant
First Claim
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1. A method of forming microelectromechanical systems (MEMS) devices comprising:

  • providing a carrier wafer having a carrier wafer first side and a carrier wafer second side;

    providing a control-circuit wafer having a control-circuit wafer first side and a control-circuit wafer second side, the control-circuit wafer including a plurality of integrated MEMS control circuits formed at the control-circuit wafer first side;

    bonding the carrier wafer first side to the control-circuit wafer first side with bonding agent applied at locations corresponding to die boundaries on the control-circuit wafer;

    providing a sensor wafer having a first side and second side, the sensor wafer including a plurality of MEMS sensors;

    bonding the sensor wafer first side to the control-circuit wafer second side; and

    sawing the carrier wafer through the bonding agent at the locations corresponding to the die boundaries to separate the carrier wafer from the control-circuit wafer.

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