Laser die and photonics die package

• US 9,360,644 B2
• Filed: 09/08/2014
• Issued: 06/07/2016
• Est. Priority Date: 09/08/2014
• Status: Active Grant

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Fasano, Benjamin V., Fortier, Paul F.
• Primary Examiner(s): Ullah, Akm Enayet
• Assistant Examiner(s): MOONEY, MICHAEL P
• Application Number:
  US14/480,461
• Publication Number:
  US 20160070061A1
• Time in Patent Office: 638 Days
• Field of Search: 385/14, 385/50, 385/52, 385129-132, 438/25, 438 31- 33, 438/462, 257/E21.002
• US Class Current: 1/1
• CPC Class Codes: G02B 2006/12097 Ridge, rib or the like
• CPC Class Codes: G02B 2006/121 Channel; buried or the like
• CPC Class Codes: G02B 2006/12121 Laser
• CPC Class Codes: G02B 6/12 of the integrated circuit kind electric integrated circuits H01L27/00
• CPC Class Codes: G02B 6/12004 Combinations of two or more optical elements
• CPC Class Codes: G02B 6/122 Basic optical elements, e.g. light-guiding paths
• CPC Class Codes: G02B 6/13 Integrated optical circuits characterised by the manufacturing method
• CPC Class Codes: G02B 6/4224 using visual alignment markings, e.g. index methods
• CPC Class Codes: G02B 6/4249 comprising arrays of active devices and fibres
• CPC Class Codes: G02B 6/43 Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/49175 Parallel arrangements

Abstract

A multi semiconductor device package includes a laser die and a photonics die. The laser die generates light and includes a laser facet that emits light from a light emitting surface. The photonics die modulates light emitted from the laser light emitting surface and includes a device side cavity that exposes an embedded waveguide optically connected with the laser facet. A laser die and photonics die attachment method includes positioning a device side of the laser die relative to a device side of the photonics die, engaging an alignment feature of the photonics die with an alignment feature of the laser die, installing the laser die within a device side recess of photonics die, electrically connecting the laser die with the photonics die, and optically connecting a laser facet of the laser die with an embedded waveguide of the phonics die.

Claims

1. A multi semiconductor device package comprising:

a laser die that generates light, the laser die comprising a laser facet that emits light from a light emitting surface, and;

a photonics die that modulates light emitted from the light emitting surface, the photonics die comprising a device side embedded waveguide optically connected with the laser facet wherein a device side of the laser die is joined to the photonics die within the device side cavity.

2. The multi semiconductor device package of claim 1, wherein the laser die further comprises one or more electrical contacts and wherein the photonics die further comprises one or more electrical contacts.

3. The multi semiconductor device package of claim 1, wherein the one or more electrical contacts of the photonics die are positioned within the device side cavity.

4. The multi semiconductor device package of claim 2, wherein the one or more electrical contacts of the laser die and the one or more electrical contacts of the photonics die are electrically connected by an interconnect.

5. The multi semiconductor device package of claim 1, wherein the laser die further comprises an alignment feature and wherein the photonics die comprises an alignment feature.

6. The multi semiconductor device package of claim 5, wherein the laser die alignment feature is a protrusion, wherein the photonics die alignment feature is a receptacle, and wherein the protrusion is accepted by the receptacle to position the laser die with the photonics die to optically connect the laser facet with the embedded waveguide.

7. The multi semiconductor device package of claim 5, wherein the laser die alignment feature is a receptacle, wherein the photonics die alignment feature is a protrusion, and wherein the protrusion is accepted by the receptacle to position the laser die with the photonics die to optically connect the laser facet with the embedded waveguide.

8. The multi semiconductor device package of claim 1, wherein the laser facet is aligned with the embedded waveguide along an axis parallel with the device side of photonics die.

9. A design structure tangibly embodied in a non-transitory machine readable storage medium for designing, manufacturing, or testing a multi semiconductor device package, the design structure comprising:

a laser die that generates light, the laser die comprising a laser facet that emits light from a light emitting surface, and;

a photonics die that modulates light emitted from the light emitting surface, the photonics die comprising a device side embedded waveguide optically connected with the laser facet wherein a device side of the laser die is joined to the photonics die within the device side cavity.

10. The design structure of claim 9, wherein the laser die further comprises one or more electrical contacts and wherein the photonics die further comprises one or more electrical contacts.

11. The design structure of claim 9, wherein the one or more electrical contacts of the photonics die are positioned within the device side cavity.

12. The design structure of claim 10, wherein the one or more electrical contacts of the laser die and the one or more electrical contacts of the photonics die are electrically connected by an interconnect.

13. The design structure of claim 9, wherein the laser die further comprises an alignment feature and wherein the photonics die comprises an alignment feature.

14. The design structure of claim 13, wherein the laser die alignment feature is a protrusion, wherein the photonics die alignment feature is a receptacle, and wherein the protrusion is accepted by the receptacle to position the laser die with the photonics die to optically connect the laser facet with the embedded waveguide.

15. The design structure of claim 14, wherein the laser die alignment feature is a receptacle, wherein the photonics die alignment feature is a protrusion, and wherein the protrusion is accepted by the receptacle to position the laser die with the photonics die to optically connect the laser facet with the embedded waveguide.

16. The design structure of claim 9, wherein the laser facet is aligned with the embedded waveguide along an axis parallel with the device side of photonics die.

17. A laser die and photonics die attachment method comprising:

positioning a device side of the laser die relative to a device side of the photonics die;

engaging an alignment feature of the photonics die with an alignment feature of the laser die;

installing the laser die within a device side recess of the photonics die;

electrically connecting the laser die with the photonics die, and;

optically connecting a laser facet of the laser die with an embedded waveguide of the phonics die.

18. The laser die and photonics die attachment method of claim 17 further comprising:

electrically connecting the device side of the photonics die with external circuitry.