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Plasma processing apparatus, plasma processing method, and storage medium

  • US 9,362,090 B2
  • Filed: 12/20/2010
  • Issued: 06/07/2016
  • Est. Priority Date: 03/22/2006
  • Status: Active Grant
First Claim
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1. A plasma processing apparatus for performing a method on a substrate having an inorganic film and an organic film formed thereon, the plasma processing apparatus comprising:

  • a substrate processing chamber that has therein a processing space into which the substrate is transferred and which carries out the plasma processing on the substrate in the processing space;

    a first electrode that is disposed in the substrate processing chamber and is connected to a radio frequency power source;

    a second electrode that has an exposed portion exposed to the processing space and is electrically insulated from the substrate processing chamber and the first electrode, the exposed portion comprising a silicon-based material;

    wherein the second electrode is connected to a DC power source;

    a switching device disposed between the second electrode and the DC power source,anda controller configured to control the apparatus to perform;

    a first step of carrying out plasma processing on the inorganic film under a condition where a potential difference between a plasma generated in the processing space and the second electrode is set to a value of the DC power source which enables the exposed portion of the second electrode to be sputtered by the generated plasma, anda second step of carrying out plasma processing on the organic film under a condition where the switching device cuts off electrical connection between the second electrode and the DC power source so as to electrically insulate the second electrode in a floating state and the potential difference between the generated plasma and the second electrode is set to a value which avoids the exposed portion of the second electrode from being sputtered by the generated plasma.

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