Power quad flat no-lead (PQFN) semiconductor package with leadframe islands for multi-phase power inverter
First Claim
1. A power quad flat no-lead (PQFN) package comprising:
- a U-phase output node situated on a first leadframe island of a leadframe;
a V-phase output node situated on a second leadframe island of said leadframe;
a W-phase output node situated on a W-phase die pad of said leadframe;
wherein said first leadframe island is on a corresponding first leadframe strip, said corresponding first leadframe strip being connected to a U-phase die pad.
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Abstract
According to an exemplary implementation, a power quad flat no-lead (PQFN) package includes a U-phase output node situated on a first leadframe island of a leadframe, a V-phase output node situated on a second leadframe island of said leadframe, and a W-phase output node situated on a W-phase die pad of said leadframe. The first leadframe island can be on a first leadframe strip of the leadframe, where the first leadframe strip is connected to a U-phase die pad of the leadframe. The second leadframe island can be on a second leadframe strip of the leadframe, where the second leadframe strip is connected to a V-phase die pad of the leadframe. A first W-phase power switch is situated on the W-phase die pad. Furthermore, at least one wirebond is connected to the W-phase die pad and to a source of a second W-phase power switch. The W-phase die pad can be a W-phase output terminal of the PQFN package.
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Citations
19 Claims
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1. A power quad flat no-lead (PQFN) package comprising:
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a U-phase output node situated on a first leadframe island of a leadframe; a V-phase output node situated on a second leadframe island of said leadframe; a W-phase output node situated on a W-phase die pad of said leadframe; wherein said first leadframe island is on a corresponding first leadframe strip, said corresponding first leadframe strip being connected to a U-phase die pad. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A power quad flat no-lead (PQFN) package comprising:
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a U-phase output node situated on a first leadframe island; wherein said first leadframe island is on a corresponding first leadframe strip, said corresponding first leadframe strip being connected to a U-phase die pad; a V-phase output node situated on a second leadframe strip of said leadframe, said second leadframe strip connected to a V-phase die pad of said leadframe; a W-phase output node situated on a W-phase die pad of said leadframe. - View Dependent Claims (17, 18, 19)
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Specification