FETs and methods for forming the same
First Claim
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1. A method comprising:
- forming a channel region on a substrate, wherein the forming the channel region comprises;
forming a fin on the substrate; and
epitaxially growing a quantum well structure on the fin, the channel region comprising the quantum well structure;
after forming the channel region, re-shaping the channel region to have a major surface portion of a sidewall with a plurality of lattice shift locations in stair-step increments, each of the plurality of lattice shift locations comprising an inward or outward lattice shift relative to a center of the channel region;
forming a dielectric on the major surface portion of the sidewall; and
forming a gate electrode on the dielectric.
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Abstract
FETs and methods for forming FETs are disclosed. A structure comprises a substrate, a gate dielectric and a gate electrode. The substrate comprises a fin, and the fin comprises an epitaxial channel region. The epitaxial channel has a major surface portion of an exterior surface. The major surface portion comprising at least one lattice shift, and the at least one lattice shift comprises an inward or outward shift relative to a center of the fin. The gate dielectric is on the major surface portion of the exterior surface. The gate electrode is on the gate dielectric.
34 Citations
17 Claims
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1. A method comprising:
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forming a channel region on a substrate, wherein the forming the channel region comprises;
forming a fin on the substrate; and
epitaxially growing a quantum well structure on the fin, the channel region comprising the quantum well structure;after forming the channel region, re-shaping the channel region to have a major surface portion of a sidewall with a plurality of lattice shift locations in stair-step increments, each of the plurality of lattice shift locations comprising an inward or outward lattice shift relative to a center of the channel region; forming a dielectric on the major surface portion of the sidewall; and forming a gate electrode on the dielectric. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method comprising:
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forming a channel region of a device on a substrate, the channel region comprising a semiconductor material, the channel region having a first exterior surface shape, wherein the channel region comprises a quantum well; after forming the channel region, etching the channel region to form a second exterior surface shape different from the first exterior surface shape, wherein the second exterior surface shape comprises a plurality of lattice shift locations in stair-step increments; forming a gate dielectric on the second exterior surface shape of the channel region; and forming a gate electrode on the gate dielectric. - View Dependent Claims (8, 9, 10, 11, 12, 13)
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14. A method comprising:
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forming a device structure on a substrate, the device structure comprising a first source/drain region, a second source/drain region, and a channel region disposed between the first source/drain region and the second source/drain region; forming a dielectric layer on the first source/drain region; after forming the dielectric layer, re-shaping the channel region using an etching process; forming a gate dielectric on the re-shaped channel region; forming a gate electrode on the gate dielectric; forming a fin on the substrate; forming the first source/drain region and the second source/drain region in the fin, an intermediate fin portion of the fin being disposed between the first source/drain region and the second source/drain region; after forming the dielectric layer, exposing the intermediate fin portion of the fin; after exposing the intermediate fin portion, recessing the intermediate fin portion to form a V-shaped recess; epitaxially growing the channel region in the recess; and etching a portion of the fin under the channel region to form a void, wherein the gate dielectric and the gate electrode are formed in the void. - View Dependent Claims (15, 16, 17)
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Specification