Package-in-package semiconductor sensor device
First Claim
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1. A semiconductor sensor device, comprising:
- a device substrate;
a micro controller unit (MCU) die attached to the device substrate;
a pressure sensor package having a sensor substrate and a pressure sensor die electrically connected to the sensor substrate, the sensor substrate having a front side with the pressure sensor die attached thereto, a back side, and an opening from the front side to the back side, wherein the pressure sensor die is flip-chip mounted to the sensor substrate using conductive bumps, and the sensor device further comprises a pressure-sensitive gel covering the conductive bumps and the pressure sensor die, and at least partially filling the opening in the sensor substrate; and
a molding compound encapsulating the MCU die, the device substrate, and the pressure sensor package, the molding compound having an outer surface;
wherein the back side of the sensor substrate and the opening in the sensor substrate are exposed on the outer surface of the molding compound.
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Abstract
A semiconductor sensor device includes a device substrate, a micro-controller unit (MCU) die attached to the substrate, and a packaged pressure sensor having a sensor substrate and a pressure sensor die. The sensor substrate has a front side with the pressure sensor die attached to it, a back side, and an opening from the front side to the back side. A molding compound encapsulates the MCU die, the device substrate, and the packaged pressure sensor. A back side of the sensor substrate and the opening in the sensor substrate are exposed on an outer surface of the molding compound.
55 Citations
7 Claims
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1. A semiconductor sensor device, comprising:
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a device substrate; a micro controller unit (MCU) die attached to the device substrate; a pressure sensor package having a sensor substrate and a pressure sensor die electrically connected to the sensor substrate, the sensor substrate having a front side with the pressure sensor die attached thereto, a back side, and an opening from the front side to the back side, wherein the pressure sensor die is flip-chip mounted to the sensor substrate using conductive bumps, and the sensor device further comprises a pressure-sensitive gel covering the conductive bumps and the pressure sensor die, and at least partially filling the opening in the sensor substrate; and a molding compound encapsulating the MCU die, the device substrate, and the pressure sensor package, the molding compound having an outer surface; wherein the back side of the sensor substrate and the opening in the sensor substrate are exposed on the outer surface of the molding compound. - View Dependent Claims (2, 3, 4)
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5. A semiconductor sensor device comprising:
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a device substrate; a micro controller unit (MCU) die attached to the device substrate; a pressure sensor package having a sensor substrate and a pressure sensor die electrically connected to the sensor substrate, the sensor substrate having a front side with the pressure sensor die attached thereto, a back side, and an opening from the front side to the back side; and a molding compound encapsulating the MCU die, the device substrate, and the pressure sensor package, the molding compound having an outer surface, wherein the back side of the sensor substrate and the opening in the sensor substrate are exposed on the outer surface of the molding compound, and wherein the sensor substrate comprises; first and second insulating layers; patterned traces disposed between the first and second insulating layer; a first set of metal vias disposed in the first insulating layer and connecting to the patterned traces, the first set of metal vias having exposed ends on the front side of the sensor substrate; and metal bumps on the exposed ends of the first set of metal vias, wherein the metal bumps electrically connect the pressure sensor die to exposed ends of the first set of metal vias on the sensor substrate. - View Dependent Claims (6, 7)
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Specification