Method for manufacturing display panel

• US 9,362,504 B2
• Filed: 07/09/2014
• Issued: 06/07/2016
• Est. Priority Date: 11/20/2013
• Status: Active Grant

• Current Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Original Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Inventors: Lee, Hong Ro, Jeong, Beung Hwa, Hong, Sung Hoon
• Primary Examiner(s): GHYKA, ALEXANDER G
• Application Number:
  US14/327,175
• Publication Number:
  US 20150140705A1
• Time in Patent Office: 699 Days
• Field of Search: None
• US Class Current: 1/1
• CPC Class Codes: H10K 71/80 using temporary substrates

Abstract

A method for manufacturing a display panel, including defining a desorbing area of a support substrate by forming one of a release layer or a recess portion in the desorbing area, cleaning a surface of the support substrate, disposing a thin film substrate on the support substrate, directly bonding, in an adsorbing area external to the desorbing area, the thin film substrate to the support substrate, forming a pixel and a sealing member on the thin film substrate, cutting the sealing member and the thin film substrate at a location that corresponds to the desorbing area, and separating the support substrate from the thin film substrate.

Claims

1. A method of manufacturing a display panel, comprising:

defining a desorbing area surrounded by an absorbing area in a support substrate by forming one of a release layer and a recess portion in the desorbing area of the support substrate;

cleaning a surface of the support substrate;

disposing a thin film substrate on the support substrate;

bonding directly and covalently the thin film substrate to the absorbing area of the support substrate;

forming a pixel and a sealing member on the thin film substrate;

cutting the sealing member and the thin film substrate at a location that corresponds to the desorbing area; and

separating the support substrate from the thin film substrate.

2. The method of claim 1, wherein the cleaning being achieved by a process selected from a group consisting of UV cleaning, ultrasonic wave cleaning, waterjet cleaning, hydrogen water cleaning, and ozone (O₃) cleaning.

3. The method of claim 1, wherein the desorbing area is defined by the recess portion, the recess portion being produced by etching the support substrate via a process selected from plasma etching and sandblasting.

4. The method of claim 3, wherein a depth of the recess portion is 2 nm to 200 μ

m.

5. The method of claim 1, wherein the desorbing area is defined by the release layer, the forming of the release layer comprises:

forming one of an indium tin oxide (ITO) layer and an indium zinc oxide (IZO) layer on the support substrate;

forming a reserved release layer by patterning the one of the ITO layer and the IZO layer; and

crystallizing the reserved release layer.

6. The method of claim 5, wherein the release layer is formed to have a thickness of 100 Å

to 1,000 Å

.

7. The method of claim 1, wherein the thin film substrate comprises an ultrathin glass having a thickness of 0.01 mm to 0.1 mm.

8. The method of claim 1, wherein a surface roughness of the support substrate at a location corresponding to the adsorbing area is equal to or less than 0.2 nm.

9. The method of claim 1, wherein the bonding being absent of an intervening adhesive layer.

10. The method of claim 1, wherein the pixel includes an organic light emitting element.

11. A method of manufacturing a display panel, comprising:

cleaning a surface of a support substrate;

defining a desorbing area surrounded by an absorbing area in the support substrate by forming one of a release layer and a recess portion in the desorbing area of the support substrate;

disposing a thin film substrate on the support substrate;

bonding directly and covalently the thin film substrate to the absorbing area of the support substrate;

forming a pixel and a sealing member on the thin film substrate;

cutting the sealing member and the thin film substrate at a location that corresponds to the desorbing area; and

separating the support substrate from the thin film substrate.

12. The method of claim 11, wherein the cleaning comprises a process selected from a group consisting of UV cleaning, ultrasonic wave cleaning, waterjet cleaning, hydrogen water cleaning, and ozone (O₃) cleaning, wherein the thin film substrate is bonded to the support substrate without an intervening adhesive layer.

13. The method of claim 11, wherein the desorbing area is defined by the recess portion, the recess portion being produced by etching the support substrate via a process selected from a group consisting of plasma etching and sandblasting.

14. The method of claim 13, wherein a depth of the recess portion is 2 nm to 200 μ

m.

15. The method of claim 11, wherein the forming of the release layer comprises:

forming one of an indium tin oxide (ITO) layer and an indium zinc oxide (IZO) layer on the support substrate;

forming a reserved release layer by patterning the one of the ITO layer and the IZO layer; and

crystallizing the reserved release layer.

16. The method of claim 15, wherein the release layer is formed to have a thickness of 100 Å

to 1000 Å

.

17. The method of claim 11, wherein the thin film substrate is an ultrathin glass having a thickness of 0.01 mm to 0.1 mm.

18. The method of claim 11, wherein a surface roughness of the support substrate at a location corresponding to the adsorbing area is equal to or less than 0.2 nm.

19. The method of claim 11, wherein the pixel includes an organic light emitting element.