Method for bonding substrates, method for manufacturing sealing structure, and method for manufacturing light-emitting device

• US 9,362,522 B2
• Filed: 10/22/2013
• Issued: 06/07/2016
• Est. Priority Date: 10/26/2012
• Status: Active Grant

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Kubota, Yusuke, Jikumaru, Mika, Nagano, Yoji, Fukai, Shuji, Nishi, Takeshi, Shimomura, Akihisa, Nakamura, Daiki
• Primary Examiner(s): McNally, Daniel
• Application Number:
  US14/059,660
• Publication Number:
  US 20140116614A1
• Time in Patent Office: 959 Days
• US Class Current: 1/1
• CPC Class Codes: C03C 8/24 Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 59/8722 Peripheral sealing arrangements, e.g. adhesives, sealants

Abstract

An object is to improve productivity related to a laser light irradiation step in a bonding technique of substrates using glass frit. A highly airtight sealing structure or a highly airtight light-emitting device, which can be manufactured with high productivity, is provided. When a glass layer by melting glass frit or a sintered body by sintering glass frit is irradiated with laser light, in order to increase the efficiency, a light-absorbing material is attached to a surface of the glass layer. The laser light irradiation is performed on the light-absorbing material and the glass layer. The substrates are fixed with the glass layer therebetween.

Claims

1. A method for bonding substrates, comprising the steps of:

forming a glass layer comprising a glass frit over a first substrate;

applying a resin including a light-absorbing material over the glass layer and the first substrate;

removing the resin partially so that the light-absorbing material is put on a portion of an uneven surface of the glass layer;

attaching the glass layer to a second substrate; and

irradiating the glass layer and the light-absorbing material with laser light so that the glass layer is welded to the first substrate and the second substrate.

2. The method for bonding the substrates according to claim 1, wherein the light-absorbing material is an organic pigment, an inorganic pigment, or a color filter material.

3. The method for bonding the substrates according to claim 1, wherein an end portion of the glass layer has a tapered shape.

4. The method for bonding the substrates according to claim 1, wherein the laser light is scanned along the glass layer.

5. A method for manufacturing a light-emitting device, comprising the steps of:

forming a glass layer comprising a glass frit over a first substrate;

applying a resin including a light-absorbing material over the glass layer and the first substrate,

removing the resin partially so that the light-absorbing material is put on a portion of an uneven surface of the glass layer, and a light-absorbing layer including the light-absorbing material is formed over the first substrate;

forming a light-emitting element over a second substrate;

attaching the glass layer to the second substrate; and

irradiating the glass layer and the light-absorbing material with laser light so that the glass layer is welded to the first substrate and the second substrate,

wherein the glass layer surrounds the light-emitting element without an endpoint.

6. The method for manufacturing the light-emitting device according to claim 5, wherein the light-absorbing layer including the light-absorbing material is a color filter.

7. The method for manufacturing the light-emitting device according to claim 5, wherein an end portion of the glass layer has a tapered shape.

8. The method for manufacturing the light-emitting device according to claim 5, wherein the laser light is scanned along the glass layer.