Composite material and electronic device

• US 9,363,884 B2
• Filed: 11/05/2013
• Issued: 06/07/2016
• Est. Priority Date: 05/06/2011
• Status: Active Grant

• Current Assignee: Huawei Device Company Limited (Huawei Investment & Holding Co., Ltd.)
• Original Assignee: Huawei Device Company Limited (Huawei Investment & Holding Co., Ltd.)
• Inventors: Yang, Jun, Zhou, Liechun, Li, Hualin, Wu, Xijie
• Primary Examiner(s): Datskovskiy, Michail V
• Application Number:
  US14/072,199
• Publication Number:
  US 20140055957A1
• Time in Patent Office: 945 Days
• Field of Search: 36167946-67954, 361700-712, 361715-721, 361/800, 361/812, 361/816, 361/818, 257/706, 257/707, 257/713, 257/718, 257/719, 257/723, 257/724, 257/698, 174/350, 174/351, 174/377, 174/378, 174/254, 174/547, 165/80.2, 165/104.33, 165/185
• US Class Current: 1/1
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/18 High density interconnect [HDI] connectors; Manufacturing methods related thereto interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H05K 1/0204 using means for thermal conduction connection in the thickness direction of the substrate H05K1/0207 takes precedence
• CPC Class Codes: H05K 1/0216 Reduction of cross-talk, noise or electromagnetic interference grounding H05K1/0215
• CPC Class Codes: H05K 2201/0715 provided by an outer layer of PCB
• CPC Class Codes: H05K 2201/2018 Presence of a frame in a printed circuit or printed circuit assembly
• CPC Class Codes: H05K 7/20472 Sheet interfaces
• CPC Class Codes: H05K 9/003 made from non-conductive materials comprising an electro-conductive coating H05K9/0031 takes precedence
• CPC Class Codes: H05K 9/0031 combining different shielding materials
• CPC Class Codes: H05K 9/0032 having multiple parts, e.g. frames mating with lids
• CPC Class Codes: Y02D 30/70 in wireless communication networks
• CPC Class Codes: Y10T 428/264 Up to 3 mils
• CPC Class Codes: Y10T 428/30 Self-sustaining carbon mass or layer with impregnant or other layer
• CPC Class Codes: Y10T 428/31504 Composite [nonstructural laminate]
• CPC Class Codes: Y10T 428/31678 Of metal

Abstract

A composite material and an electronic device are disclosed in embodiments of the present invention, relating to the field of electronic assembly technologies. The technical problem of the existing electronic device with an excessively complicated internal structure is solved. The composite material includes an electrically and thermally conductive layer, a viscose glue layer, and an insulating layer, where the electrically and thermally conductive layer and the insulating layer are pasted at two sides of the viscose glue layer; the viscose glue layer is electrically conductive. The electronic device includes a circuit board and the composite material. Gaps are formed at the insulating layer in positions corresponding to electronic components and/or shielding frames, with the viscose glue layer exposed, the composite material is pasted onto the electronic components and/or the shielding frames via the viscose glue layer. The present invention is applied to simplify the structure of an electronic device.

Claims

1. An electronic device, comprising:

a circuit board; and

a composite material,

wherein electronic components and shielding frames are provided on the circuit board,

wherein the composite material comprises an electrically and thermally conductive layer, a viscose glue layer, and an insulating layer,

wherein the electrically and thermally conductive layer and the insulating layer are respectively attached to two sides of the viscose glue layer,

wherein the viscose glue layer is electrically conductive,

wherein gaps are formed at the insulating layer to expose the viscose glue layer in positions corresponding to the electronic components when the electrical components are electrical components that require heat dissipation and are in positions corresponding to the shielding frames,

wherein the composite material is adhered onto the electronic components via the viscose glue layer when the electrical components are electrical components that require heat dissipation, and

wherein the composite material is adhered onto the shielding frames via the viscose glue layer when the electrical components are electrical components that require electromagnetic shielding.

3. The electronic device according to claim 1, wherein the composite material is extended to other heat generating portions out of the circuit board.

4. The electronic device according to claim 1, wherein, in the composite material, a second insulating layer is also provided on one side of the electrically and thermally conductive layer opposite to the viscose glue layer.

5. The electronic device of claim 1, wherein the composite material has a thermal conductivity coefficient greater than 50 watts per meter kelvin (W/m·

K).

6. The electronic device of claim 1, wherein the electrically and thermally conductive layer comprises at least one of copper, graphite, aluminum, and porcelain.

2. An electronic device, comprising:

a circuit board; and

a composite material,

wherein electronic components and shielding frames are provided on the circuit board.

wherein the composite material comprises an electrically and thermally conductive layer, a viscose glue layer, and an insulating layer,

wherein the electrically and thermally conductive layer and the insulating layer are respectively attached to two sides of the viscose glue layer,

wherein the viscose glue layer is electrically conductive,

wherein gaps are formed at the insulating layer with the viscose glue layer exposed in positions corresponding to the electronic components and/or the shielding frames,

wherein the composite material is adhered onto the electronic components and/or the shielding frames via the viscose glue layer,

wherein the electronic components and the shielding frames are arranged on two sides of the circuit board,

wherein the composite material is adhered onto the electronic components and/or the shielding frames on the two sides of the circuit board, and

wherein the composite material, in one piece, is bent and wrapped on the two sides of the circuit board.

7. The electronic device of claim 2, wherein the composite material has a thermal conductivity coefficient greater than 50 watts per meter kelvin (W/m·

K).

8. The electronic device of claim 2, wherein the electrically and thermally conductive layer comprises at least one of copper, graphite, aluminum, and porcelain.