Structure and method for motion sensor

• US 9,365,416 B2
• Filed: 03/29/2012
• Issued: 06/14/2016
• Est. Priority Date: 08/15/2011
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Shu, Chia-Pao, Tai, Wen-Chuan, Hung, Chia-Ming, Chen, Hsiang-Fu
• Primary Examiner(s): Such, Matthew W
• Assistant Examiner(s): STOWE, SCOTT C
• Application Number:
  US13/433,906
• Publication Number:
  US 20130043510A1
• Time in Patent Office: 1,538 Days
• Field of Search: 257/254, 257415-420, 438 50- 53
• US Class Current: 1/1
• CPC Class Codes: B81C 1/00269 Bonding of solid lids or wafers to the substrate
• CPC Class Codes: B81C 2203/036 Fusion bonding

Abstract

The present disclosure provides one embodiment of a motion sensor structure. The motion sensor structure includes a first substrate having an integrated circuit formed thereon; a second substrate bonded to the first substrate from a first surface, wherein the second substrate includes a motion sensor formed thereon; and a third substrate bonded to a second surface of the second substrate, wherein the third substrate includes a recessed region aligned with the motion sensor.

Claims

1. A sensor structure, comprising:

a first substrate having an integrated circuit formed thereon;

a second substrate bonded to the first substrate from a first surface, wherein the second substrate comprises a sensor formed thereon; and

a third substrate bonded to a second surface of the second substrate using a bonding layer, wherein the third substrate includes a recessed region aligned with the sensor,

wherein;

the first substrate includes a silicon oxide layer;

the second substrate includes silicon adjacent to the first surface and the second substrate is bonded to the first substrate between the silicon and silicon oxide layer by fusion bonding;

the second substrate includes a trench adjacent to the second surface that is filled, at least in part, with material from the bonding layer.

2. The sensor structure of claim 1, wherein the third substrate is bonded to the second substrate by a eutectic bond.

3. The sensor structure of claim 1, wherein the the material of the bonding layer includes aluminum and copper.

4. The sensor structure of claim 1, wherein the first substrate includes at least one stopper configured to constrain the sensor.

5. The sensor structure of claim 1, wherein the third substrate includes at least one stopper configured to constrain the sensor.

6. The sensor structure of claim 1, wherein the second substrate further includes vias configured to electrically couple the sensor to the integrated circuit of the first substrate.

7. A sensor structure, comprising:

a first substrate having an integrated circuit formed thereon;

a second substrate bonded to the first substrate from a first surface, wherein the second substrate comprises a sensor formed thereon; and

a third substrate bonded to a second surface of the second substrate, wherein the third substrate includes a recessed region aligned with the sensor,

wherein;

the first substrate includes a silicon oxide layer;

the second substrate includes silicon;

the second substrate is bonded to the first substrate between the silicon and silicon oxide layer by a fusion bond;

the third substrate includes a germanium layer;

the second substrate includes an aluminum copper layer on the second surface; and

the third substrate is bonded to the second substrate between the germanium layer and the aluminum copper layer by eutectic bonding.

8. An micro-electro mechanical system (MEMS) structure, comprising:

a first silicon substrate having an integrated circuit formed thereon;

a second silicon substrate having a sensor formed thereon and a squish-prevention trench formed thereon; and

a third silicon substrate having a recessed region aligned with the sensor, wherein

the second substrate is configured between the first and third substrate;

the second substrate is fusion bonded to the first substrate and eutectic bonded to the third substrate,

wherein;

the first silicon substrate includes a silicon oxide layer; and

the second substrate is bonded to the first substrate between silicon and silicon oxide by fusion bonding; and

the second substrate is bonded to the third substrate with a bonding material, the bonding material existing, at least in part, in the squish-prevention trench.

9. The MEMS structure of claim 8, wherein the integrated circuit of the first silicon substrate includes complimentary metal-oxide-semiconductor (CMOS) transistors.

10. The MEMS structure of claim 8, wherein:

the first silicon substrate includes a first stopper configured to constrain the sensor; and

the third silicon substrate includes a second stopper configured to constrain the sensor.

11. The MEMS structure of claim 8, wherein the second silicon substrate further includes through silicon vias configured to electrically couple the sensor to the integrated circuit of the first silicon substrate.

12. An micro-electro mechanical system (MEMS) structure, comprising:

a first silicon substrate having an integrated circuit formed thereon;

a second silicon substrate having a sensor formed thereon and a squish-prevention trench formed thereon; and

a third silicon substrate having a recessed region aligned with the sensor, wherein

the second substrate is configured between the first and third substrate;

the second substrate is fusion bonded to the first substrate and eutectic bonded to the third substrate,

wherein;

the first silicon substrate includes a silicon oxide layer; and

the second substrate is bonded to the first substrate between silicon and silicon oxide by fusion bonding;

the third silicon substrate includes a germanium layer;

the second silicon substrate includes an aluminum copper layer; and

the third silicon substrate is bonded to the second silicon substrate between the germanium layer and the aluminum copper layer by eutectic bonding.

13. A method for manufacturing a micro-electro mechanical system (MEMS) device, comprising:

forming bonding pads on a first substrate;

forming a sensor on a second substrate;

bonding the second substrate to the first substrate through the bonding pads by fusion bonding;

bonding a capping substrate to the second substrate by eutectic bonding

forming a germanium layer on the capping substrate; and

forming an aluminum copper alloy layer on the second substrate, wherein the bonding of the capping substrate to the second substrate includes forming eutectic bonding between the germanium layer and the aluminum copper alloy layer.

14. The method of claim 13, further comprising forming a silicon oxide layer on the first substrate, wherein

the second substrate includes a silicon surface;

and

the bonding of the second substrate to the first substrate includes forming fusion bonding between the silicon oxide layer and the silicon surface of the second substrate.

15. The method of claim 13, further comprising forming tungsten plugs through the second substrate, wherein the tungsten plugs are configured to electrically couple the second substrate to the first substrate.

16. A sensor structure, comprising:

a first substrate having an integrated circuit formed thereon;

a second substrate bonded to the first substrate from a first surface, wherein the second substrate comprises a sensor formed thereon; and

a third substrate bonded to a second surface of the second substrate, wherein the third substrate includes a recessed region aligned with the sensor,

wherein;

the third substrate includes a germanium layer;

the second substrate includes an aluminum copper layer on the second surface; and

the third substrate is bonded to the second substrate between the germanium layer and the aluminum copper layer by eutectic bonding.

17. The sensor structure of claim 16, wherein the second substrate is bonded to the first substrate by fusion bonding.

18. The sensor structure of claim 17, wherein:

the first substrate includes a silicon oxide layer;

the second substrate includes silicon; and

the second substrate is bonded to the first substrate between the silicon and silicon oxide by fusion bonding.

19. The sensor structure of claim 16, wherein the second substrate further includes squish prevention trenches formed thereon and configured to prevent squish issue during an eutectic bonding between the second and third substrates.

20. The sensor structure of claim 16, wherein the first substrate includes complimentary metal-oxide-semiconductor (CMOS) transistors formed thereon.

21. The sensor structure of claim 16, wherein the first substrate includes at least one stopper configured to constrain the sensor.

22. The sensor structure of claim 16, wherein the third substrate includes at least one stopper configured to constrain the sensor.

23. The sensor structure of claim 16, wherein the second substrate further includes vias configured to electrically couple the sensor to the integrated circuit of the first substrate.

24. An micro-electro mechanical system (MEMS) structure, comprising:

a first silicon substrate having an integrated circuit formed thereon;

a second silicon substrate having a sensor formed thereon and a squish-prevention trench formed thereon; and

a third silicon substrate having a recessed region aligned with the sensor, wherein

the second substrate is configured between the first and third substrate;

the second substrate is fusion bonded to the first substrate and eutectic bonded to the third substrate,

wherein;

the third silicon substrate includes a germanium layer;

the second silicon substrate includes an aluminum copper layer; and

the third silicon substrate is bonded to the second silicon substrate between the germanium layer and the aluminum copper layer by eutectic bonding.

25. The MEMS structure of claim 24, wherein:

the first silicon substrate includes a silicon oxide layer; and

the second substrate is bonded to the first substrate between the silicon and silicon oxide by fusion bonding.

26. The MEMS structure of claim 24, wherein the integrated circuit of the first silicon substrate includes complimentary metal-oxide-semiconductor (CMOS) transistors.

27. The MEMS structure of claim 24, wherein:

the first silicon substrate includes a first stopper configured to constrain the sensor; and

the third silicon substrate includes a second stopper configured to constrain the sensor.

28. The MEMS structure of claim 24, wherein the second silicon substrate further includes through silicon vias configured to electrically couple the sensor to the integrated circuit of the first silicon substrate.

29. A method for manufacturing a micro-electro mechanical system (MEMS) device, comprising:

forming bonding pads on a first substrate;

forming a sensor on a second substrate;

bonding the second substrate to the first substrate through the bonding pads by fusion bonding;

bonding a capping substrate to the second substrate by eutectic bonding; and

forming a silicon oxide layer on the first substrate,

wherein;

the second substrate includes a silicon surface and the bonding of the second substrate to the first substrate includes forming fusion bonding between the silicon oxide layer and the silicon surface of the second substrate; and

the second substrate includes a trench and a bonding layer, and the bonding of the second substrate to the third substrate by eutectic bonding includes moving a portion of the bonding layer into the trench.

31. The method of claim 29, further comprising forming tungsten plugs through the second substrate, wherein the tungsten plugs are configured to electrically couple the second substrate to the first substrate.

30. A method for manufacturing a micro-electro mechanical system (MEMS) device, comprising:

forming bonding pads on a first substrate;

forming a sensor on a second substrate;

bonding the second substrate to the first substrate through the bonding pads by fusion bonding;

bonding a capping substrate to the second substrate by eutectic bonding; and

forming a silicon oxide layer on the first substrate,

forming a germanium layer on the capping substrate; and

forming an aluminum copper alloy layer on the second substrate, wherein the bonding of the capping substrate to the second substrate includes forming eutectic bonding between the germanium layer and the aluminum copper alloy layer.