Liquid composition used in etching copper- and titanium-containing multilayer film, etching method in which said composition is used, method for manufacturing multilayer-film wiring, and substrate

• US 9,365,934 B2
• Filed: 03/31/2014
• Issued: 06/14/2016
• Est. Priority Date: 04/12/2013
• Status: Active Grant

• Current Assignee: Mitsubishi Gas Chemical Company Incorporated (Mitsubishi Electric Corporation)
• Original Assignee: Mitsubishi Gas Chemical Company Incorporated (Mitsubishi Electric Corporation)
• Inventors: Adaniya, Tomoyuki, Yube, Kunio, Tamai, Satoshi
• Primary Examiner(s): Chen, Xiaoliang
• Application Number:
  US14/783,370
• Publication Number:
  US 20160053384A1
• Time in Patent Office: 806 Days
• Field of Search: 174/257, 510/175, 438/691, 252/79.1, 252/79.2, 252/79.4, 134/2, 134/3, 134/26
• US Class Current: 1/1
• CPC Class Codes: C23F 1/02 Local etching
• CPC Class Codes: C23F 1/18 for etching copper or alloys thereof
• CPC Class Codes: C23F 1/26 for etching refractory metals
• CPC Class Codes: C23F 1/44 Compositions for etching metallic material from a metallic material substrate of different composition
• CPC Class Codes: H01L 21/32134 by liquid etching only
• CPC Class Codes: H05K 1/0298 Multilayer circuits
• CPC Class Codes: H05K 1/09 Use of materials for the conductive, e.g. metallic pattern
• CPC Class Codes: H05K 2201/0338 Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
• CPC Class Codes: H05K 3/061 Etching masks
• CPC Class Codes: H05K 3/067 Etchants

Abstract

The present invention provides a liquid composition used for etching a copper- and titanium-containing multilayer film, a method for etching a copper- and titanium-containing multilayer film by using said liquid composition, a method for manufacturing multilayer-film wiring according to said etching method, and a substrate provided with multilayer-film wiring manufactured according to said manufacturing method. According to the present invention, a liquid composition comprising (A) a maleic acid ion source, (B) a copper ion source and (C) a fluoride ion source and having the pH value of 0-7 is used.

Claims

1. A liquid composition used for etching a multilayer film comprising a layer made of copper or a compound containing copper as a primary component and a layer made of titanium or a compound containing titanium as a primary component, the liquid composition comprising:

(A) a maleic acid ion source;

(B) a copper ion source; and

(C) a fluoride ion source,

wherein the pH value is 0-7.

2. The liquid composition according to claim 1, wherein the maleic acid ion source (A) is at least one species selected from the group consisting of maleic acid and maleic anhydride, where the concentration thereof is 0.01-5 mol/kg.

3. The liquid composition according to claim 1, wherein the copper ion source (B) is at least one species selected from the group consisting of copper, copper sulfate, copper nitrate, copper hydroxide and cupric chloride, where the concentration thereof is 0.01-5 mol/kg.

4. The liquid composition according to claim 1, wherein the mix proportion of the maleic acid ion source (A) to the copper ion source (B) is 0.01-40 on molar basis.

5. The liquid composition according to claim 1, wherein the fluoride ion source (C) is at least one species selected from the group consisting of hydrofluoric acid, ammonium fluoride, ammonium acid fluoride and buffered hydrogen fluoride, where the concentration thereof is 0.001-5 mol/kg.

6. The liquid composition according to claim 1, further comprising a carboxylic acid ion source (D) other than maleic acid ion.

7. The liquid composition according to claim 6, wherein the carboxylic acid ion source (D) other than maleic acid is at least one species selected from the group consisting of acetic acid, glycolic acid, malonic acid, succinic acid, lactic acid, citric acid, carboxylates thereof and acetic anhydride, where the concentration thereof is 0-5 mol/kg.

8. The liquid composition according to claim 1, further comprising a halide ion source (E) other than a fluoride ion.

9. The liquid composition according to claim 8, wherein the halide ion source (E) other than a fluoride ion is at least one species selected from the group consisting of hydrochloric acid, hydrobromic acid, ammonium chloride, potassium chloride, cupric chloride and potassium bromide, where the concentration thereof is 0-5 mol/kg.

10. The liquid composition according to claim 1, further comprising a pH adjuster.

11. A method for etching a multilayer film comprising a layer made of copper or a compound containing copper as a primary component and a layer made of titanium or a compound containing titanium as a primary component, the method comprising the step of bringing the multilayer film into contact with the liquid composition according to claim 1.

12. The etching method according to claim 11, wherein the multilayer film is a two-layer film in which a layer made of titanium or a compound containing titanium as a primary component is laminated with a layer made of copper or a compound containing copper as a primary component.

13. The etching method according to claim 11, wherein the multilayer film is a three-layer film in which a layer made of titanium or a compound containing titanium as a primary component, a layer made of copper or a compound containing copper as a primary component and a layer made of titanium or a compound containing titanium as a primary component are laminated in this order.

14. A method for manufacturing multilayer-film wiring comprising at least a layer made of titanium or a compound containing titanium as a primary component and a layer made of copper or a compound containing copper as a primary component on a substrate, the method comprising the steps of:

providing a layer made of titanium or a compound containing titanium as a primary component and a layer made of copper or a compound containing copper as a primary component on the substrate to form a multilayer film;

covering the multilayer film with a resist to form a resist film;

exposing and developing the resist film to form a predetermined resist pattern, thereby forming an object to be etched; and

bringing the object to be etched into contact with the liquid composition according to claim 1 to etch the multilayer film, thereby forming multilayer-film wiring.

15. A substrate provided with multilayer-film wiring comprising at least a layer made of titanium or a compound containing titanium as a primary component and a layer made of copper or a compound containing copper as a primary component, wherein the substrate is manufactured according to the method for manufacturing multilayer-film wiring according to claim 14.