Embedded heat spreader with electrical properties

• US 9,368,425 B2
• Filed: 12/20/2013
• Issued: 06/14/2016
• Est. Priority Date: 12/20/2013
• Status: Active Grant

• Current Assignee: Globalfoundries US Incorporated (GlobalFoundries, Inc.)
• Original Assignee: GlobalFoundries, Inc.
• Inventors: Graf, Richard S., Leonard, Jay F., West, David J., Wilson, Charles H.
• Primary Examiner(s): Huynh, Andy
• Application Number:
  US14/135,991
• Publication Number:
  US 20150179542A1
• Time in Patent Office: 907 Days
• Field of Search: 257/531, 257/704, 257/706, 438/122
• US Class Current: 1/1
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48235 connecting the wire to a via metallisation of the item
• CPC Class Codes: H01L 2224/49109 outside the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/73215 Layer and wire connectors
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/4334 Auxiliary members in encapsulations H01L23/49568 takes precedence
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/19042 being an inductor
• CPC Class Codes: H01L 2924/19104 on the semiconductor or solid-state device, i.e. passive-on-chip

Abstract

Embodiments of the invention relate to incorporating one or more antennas or inductor coils into a semi-conductor package. A heat spreader or metal sheet is embedded in the package and stamped or otherwise patterned into a spiral or serpentine form. The pattern enables the spreader to function as an inductor or antenna when connected to a semiconductor chip in communication with a printed circuit board.

Claims

1. A semiconductor package comprising:

a semiconductor chip, the chip having a first surface and an oppositely disposed second surface, wherein the first surface of the chip is in communication with a substrate;

a heat spreader disposed to be vertically adjacent to the chip and electrically connected thereto, the spreader having a first surface and an oppositely disposed second surface, wherein the spreader is electrically coupled with the chip, and wherein the spreader provides an electrical function through a pattern;

a stepped extension positioned between the heat spreader and the chip, wherein only a select area of the stepped extension maintains a direct interface with the chip; and

a non-conductive sealing compound having a first interior surface and an oppositely disposed second interior surface, wherein the chip and the spreader are enclosed within the compound, and the second surface of the spreader is adjacent to the second interior surface.

2. The package of claim 1, further comprising the spreader in direct physical contact with the chip.

3. The package of claim 1, further comprising the spreader in indirect physical contact with the chip, including a non-conductive material mounted adjacent to the second surface of the chip, wherein the first surface of the spreader is in direct physical contact with the material.

4. The package of claim 1, wherein the pattern is a spiral pattern forming an inductor coil, the spiral including a continuous winding around an origin.

5. The package of claim 4, further comprising the spreader in direct physical contact with the chip, wherein the direct physical contact consists of the origin.

6. The package of claim 4, further comprising the winding having a body having a first thickness and the origin having a second thickness, the first thickness being greater than the second thickness, and the second thickness having a wirebond connection with the chip.

7. The package of claim 1, further comprising the spreader having a surface area greater than the chip.

8. The package of claim 1, wherein the pattern is a serpentine pattern forming an antenna.

9. The package of claim 1, further comprising at least one additional heat spreader electrically coupled with the chip.

10. A method for fabricating a semiconductor package comprising:

providing a semi-conductor chip having a first surface and an oppositely disposed second surface, wherein the first surface of the chip is in communication with a substrate;

vertically disposing a heat spreader adjacent to the chip and electrically interfacing the spreader to the chip, the spreader having a first surface and an oppositely disposed second surface, wherein the spreader is electrically coupled with the chip, and wherein the spreader provides an electrical function;

attaching a silicon interposer to the chip by a first non-conductive paste and to the spreader by a second non-conductive paste so that the silicon interposer is positioned between the chip and the spreader; and

forming the package, including sealing the chip, the silicon interposer, and the spreader within an enclosure with a non-conductive sealing compound, wherein the compound has a first interior surface and an oppositely disposed second interior surface, and the second surface of the spreader is adjacent to the second interior surface.

11. The method of claim 10, further comprising patterning the spreader in a spiral form.

12. The method of claim 11, wherein the spiral pattern forms an inductor coil, and the spiral pattern including a continuous winding around an origin.

13. The method of claim 10, further comprising patterning the spreader in a serpentine pattern.

14. The method of claim 13, wherein the serpentine pattern forms an antenna.

15. The method of claim 10, wherein the spreader is exposed on a top side of the enclosure.

16. A semiconductor package comprising:

a semiconductor chip, the chip having a first surface and an oppositely disposed second surface, wherein the first surface of the chip is in communication with a substrate;

a heat spreader, the spreader having a first surface and an oppositely disposed second surface, wherein the spreader is electrically coupled with the chip, and wherein the spreader provides an electrical function;

an interposer, the interposer having a first surface covered with a first non-conductive paste that is in direct physical contact with the second surface of the chip and a second surface covered with a second non-conductive paste that is in direct physical contact with the first surface of the spreader, wherein the interposer provides for the electrical coupling between the spreader and the chip; and

a non-conductive sealing compound, wherein the chip and the spreader are enclosed within the compound.

17. The package of claim 16, wherein the spreader has a spiral pattern forming an inductor coil, and the spiral includes a continuous winding around an origin.

18. The package of claim 16, wherein the spreader has a serpentine pattern, and the spreader provides a function as an antenna.

19. The package of claim 16, wherein the second surface of the spreader is co-planar with an interior surface of the compound.

20. The package of claim 16, wherein the interposer is made of a silicon material.