Semiconductor component containing a highly refractive polymer material

• US 9,368,699 B2
• Filed: 05/25/2011
• Issued: 06/14/2016
• Est. Priority Date: 06/22/2010
• Status: Active Grant

• Current Assignee: OSRAM OLED GMBH (Ams-Osram AG)
• Original Assignee: Osram Opto Semiconductors GmbH (Ams-Osram AG)
• Inventors: Kruppa, Michael, Jerebic, Simon
• Primary Examiner(s): TRAN, MINH LOAN
• Application Number:
  US13/703,180
• Publication Number:
  US 20130240929A1
• Time in Patent Office: 1,847 Days
• Field of Search: 257/98, 257/99, 257/100, 257/E33.057, 257/E33.059, 257/E33.061, 257/E33.073
• US Class Current: 1/1
• CPC Class Codes: B29D 11/00442 Curing the lens material
• CPC Class Codes: C08L 63/00 Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• CPC Class Codes: C08L 75/00 Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
• CPC Class Codes: C08L 83/04 Polysiloxanes
• CPC Class Codes: G02B 1/04 made of organic materials, e.g. plastics G02B1/08 takes precedence
• CPC Class Codes: G02B 27/095 Refractive optical elements
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 2933/0058 relating to optical field-shaping elements
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/501 characterised by the materials, e.g. binder
• CPC Class Codes: H01L 33/507 : the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/52 : Encapsulations
• CPC Class Codes: H01L 33/54 : having a particular shape
• CPC Class Codes: H01L 33/56 : Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/58 : Optical field-shaping elements
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A semiconductor component includes an optoelectronic semiconductor chip and an optical element arranged on a radiation passage area of the semiconductor chip, wherein the optical element is based on a highly refractive polymer material.

Claims

1. A semiconductor component comprising an optoelectronic semiconductor chip and an optical element arranged on a radiation passage area of the semiconductor chip, whereinthe optical element is based on a highly refractive polymer material having a refractive index of at least 1.52, formed in one piece, directly adjoins the semiconductor chip, and convexly curved on a side facing away from the semiconductor chip, wherein the optical element extends in a lateral direction at most as far as a side area of the semiconductor chip,the semiconductor chip electrically connects to a contact of the semiconductor device via a connecting line, the optical element partly covers the connecting line, and the connecting line runs outside the optical element in selected locations, anda side area delimiting the semiconductor chip in a lateral direction is free of material for the optical element.

2. The semiconductor component according to claim 1, wherein the optical element contains a silicone, an epoxide or a hybrid material.

3. The semiconductor component according to claim 1, wherein nanoparticles that increase the refractive index are embedded into the highly refractive polymer material.

4. The semiconductor component according to claim 1, wherein the optical element is convexly curved on a side facing away from the semiconductor chip in a plan view of the semiconductor component.

5. The semiconductor component according to claim 1, wherein the optical element extends in a lateral direction at most as far as a side area of the semiconductor chip.

6. The semiconductor component according to claim 1, further comprising a luminescence conversion substance embedded into the optical element.

7. The semiconductor component according to claim 1, further comprising a luminescence conversion substance embedded into the optical element and a further optical element arranged on that side of the optical element which faces away from the semiconductor chip, said further optical element being based on a highly refractive polymer material and being convexly curved.

8. The semiconductor component according to claim 7, wherein a highly refractive connecting layer is arranged between the semiconductor chip and the optical element.

9. The semiconductor component according to claim 1, wherein the refractive index of the optical element is less than a refractive index of the semiconductor material of the semiconductor component facing the optical element.