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Methods of encapsulating an antenna

  • US 9,368,872 B2
  • Filed: 07/07/2015
  • Issued: 06/14/2016
  • Est. Priority Date: 06/30/2011
  • Status: Active Grant
First Claim
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1. A method of fabricating an energy storage device for electronic equipment, wherein the energy storage device includes a power supply component, circuitry and a communication component having a transmitter or transceiver and an antenna, the method comprising:

  • (a) setting desired air frequency (Fair_goal) and desired core frequency (Fcore_goal) for a coil to be a design frequency (Fdesign);

    (b) adjusting coil windings around an air core until its resonant frequency in air (Fair_actual) equals the desired air frequency;

    (c) inserting a ferromagnetic core inside the coil;

    (d) identifying a target voltage standing wave ratio (VSWR) value by adjusting position of the ferromagnetic core until a minimum (VSWR) is reached, wherein the minimum VSWR corresponds to an actual core frequency (Fcore_actual) of the coil;

    (e) determining if the desired core frequency is equal to the actual core frequency and, if not, repeating steps (b)-(d) with a revised desired air frequency given by Fair_goal=Fdesign×

    Fair_goal/Fair_actual until the desired core frequency is equal to the actual core frequency;

    (f) encapsulating the coil to yield an antenna;

    (g) measuring a resonant frequency of the encapsulated coil (Fpotted);

    (h) determining if the resonant frequency of the encapsulated coil is equal to the design frequency and, if not, repeating steps (b)-(f) using a revised core frequency Fcore_goal=Fdesign×

    Fcore_actual/Fpotted as well as revised air frequency given by Fair_goal=Fcore_goal×

    Fair_goal/Fcore_actual until the potted frequency equals the desired design frequency;

    (i) fabricating the antenna using the design parameters that achieved the potted frequency being equal to the design frequency;

    (j) encapsulating the processor and the communication component in an epoxy resin via a low temperature and low pressure process; and

    (k) integrating the encapsulated circuitry with a power supply component into a unitary energy storage device structure that has an external appearance of a conventional battery.

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