Manufacturable laser diode formed on C-plane gallium and nitrogen material
First Claim
1. A method for manufacturing a laser diode device, the method comprising:
- providing a gallium and nitrogen containing substrate having a surface region characterized by a polar c-plane or an offcut of a polar c-plane surface;
forming an epitaxial material overlying the surface region, the epitaxial material comprising a release material overlying the surface region, an n-type gallium and nitrogen containing region overlying the release material, an active region comprising at least one quantum well layer overlying the n-type gallium and nitrogen containing region, and a p-type gallium and nitrogen containing region overlying the active region; and
an interface region overlying the p-type gallium and nitrogen containing region, the at least one quantum well layer being characterized by an internal polarization field;
forming a plurality of dice by at least patterning the epitaxial material, each pair of dice being characterized by a first pitch between the pair of dice, each of the dice corresponding to at least one laser diode device;
bonding the interface region associated with at least one of the plurality of dice to a carrier substrate to form a bonded structure;
subjecting the release material to an energy source to initiate the gallium and nitrogen containing substrate member to transfer the one of the plurality of dice to the carrier substrate;
configuring at least a pair of the transferred dice with a second pitch between the pair of dice on the carrier substrate;
processing at least one of the plurality of dice on the carrier substrate to form at least a laser diode.
2 Assignments
0 Petitions
Accused Products
Abstract
A method for manufacturing a laser diode device includes providing a substrate having a surface region and forming epitaxial material overlying the surface region, the epitaxial material comprising an n-type cladding region, an active region comprising at least one active layer overlying the n-type cladding region, and a p-type cladding region overlying the active layer region. The epitaxial material is patterned to form a plurality of dice, each of the dice corresponding to at least one laser device, characterized by a first pitch between a pair of dice, the first pitch being less than a design width. Each of the plurality of dice are transferred to a carrier wafer such that each pair of dice is configured with a second pitch between each pair of dice, the second pitch being larger than the first pitch.
-
Citations
32 Claims
-
1. A method for manufacturing a laser diode device, the method comprising:
-
providing a gallium and nitrogen containing substrate having a surface region characterized by a polar c-plane or an offcut of a polar c-plane surface; forming an epitaxial material overlying the surface region, the epitaxial material comprising a release material overlying the surface region, an n-type gallium and nitrogen containing region overlying the release material, an active region comprising at least one quantum well layer overlying the n-type gallium and nitrogen containing region, and a p-type gallium and nitrogen containing region overlying the active region; and
an interface region overlying the p-type gallium and nitrogen containing region, the at least one quantum well layer being characterized by an internal polarization field;forming a plurality of dice by at least patterning the epitaxial material, each pair of dice being characterized by a first pitch between the pair of dice, each of the dice corresponding to at least one laser diode device; bonding the interface region associated with at least one of the plurality of dice to a carrier substrate to form a bonded structure; subjecting the release material to an energy source to initiate the gallium and nitrogen containing substrate member to transfer the one of the plurality of dice to the carrier substrate; configuring at least a pair of the transferred dice with a second pitch between the pair of dice on the carrier substrate; processing at least one of the plurality of dice on the carrier substrate to form at least a laser diode. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
-
-
23. A method for fabricating a laser diode device comprising:
-
providing a gallium and nitrogen containing substrate member comprising a surface region characterized by a polar c-plane or an offcut of a polar c-plane surface; forming an epitaxial material overlying the surface region, the epitaxial material comprising a release material overlying the surface region, an n-type gallium and nitrogen containing material overlying the release material;
an active region overlying the n-type gallium and nitrogen containing material, a p-type gallium and nitrogen containing material overlying the active region; and
a first transparent conductive oxide material overlying the epitaxial material, and an interface region overlying the first transparent conductive oxide material;patterning the epitaxial material to form a plurality of dice, wherein each die is characterized by a first pitch between a pair of dice, each of the dice corresponding to at least one laser diode device; bonding the interface region associated with at least one of the plurality of dice to a carrier substrate; and subjecting the release material associated with the one of the plurality of dice to an energy source to initiate release of the gallium and nitrogen containing substrate member to transfer the one a plurality of dice to the one or more carrier substrate; wherein each pair of the transferred dice is configured with a second pitch between the pair of dice on the carrier substrate; and processing at least one of the plurality of dice on at least one of the carrier substrates to form at least a laser diode. - View Dependent Claims (24, 25, 26, 27, 28, 29, 30, 31, 32)
-
Specification