MEMS microphone package

• US 9,369,788 B1
• Filed: 12/30/2014
• Issued: 06/14/2016
• Est. Priority Date: 12/05/2014
• Status: Active Grant

• Current Assignee: Industrial Technology Research Institute
• Original Assignee: Industrial Technology Research Institute
• Inventors: Chen, Hong-Ren, Ho, Tzong-Che, Fan, Yu-Wen, Huang, Chao-Ta
• Primary Examiner(s): Kuntz, Curtis
• Assistant Examiner(s): KAUFMAN, JOSHUA A
• Application Number:
  US14/586,086
• Publication Number:
  US 20160165358A1
• Time in Patent Office: 532 Days
• US Class Current: 1/1
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 7/0061 suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
• CPC Class Codes: B81B 7/0064 for protecting against electromagnetic or electrostatic interferences
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H04R 1/021 incorporating only one transducer
• CPC Class Codes: H04R 1/04 Structural association of microphone with electric circuitry therefor in deaf-aid sets H04R25/00
• CPC Class Codes: H04R 1/342 for microphones
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 2201/003 Mems transducers or their use of the electrostatic type H04R19/005
• CPC Class Codes: H04R 23/00 Transducers other than those covered by groups H04R9/00 - H04R21/00 diaphragms for transducers of the distributed-mode type H04R7/045
• CPC Class Codes: H04R 2410/03 Reduction of intrinsic noise in microphones
• CPC Class Codes: H04R 2499/11 Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
• CPC Class Codes: H04R 31/00 Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor manufacture of microstructural arrangements of deformable or non-deformable structures in general B81C1/00182

Abstract

An MEMS microphone package includes a substrate, an MEMS microphone, an IC chip and an electrically conductive cover. The substrate includes a first hole, an upper surface, a bottom surface, a side surface, a first electrically conductive layer and a second electrically conductive layer. The side surface has two sides connected to the upper surface and the bottom surface, respectively. The first electrically conductive layer is disposed on the upper surface. The second electrically conductive layer is disposed on the bottom surface. The MEMS microphone is electrically coupled to the substrate. The IC chip is electrically coupled to the substrate. The electrically conductive cover includes a second hole. The electrically conductive cover is bonded to the substrate to form a chamber for accommodating the MEMS microphone and the IC chip. The first hole and the second hole together form an acoustic hole.

Claims

1. A microelectromechanical system (MEMS) microphone package, comprising:

a substrate, comprising;

at least one first hole;

an upper surface;

a bottom surface;

a side surface with two sides connected to the upper surface and the bottom surface, respectively, and the two sides being opposite to each other;

at least one first electrically conductive layer disposed on the upper surface; and

at least one second electrically conductive layer disposed on the bottom surface;

at least one MEMS microphone electrically coupled to the substrate;

at least one IC chip electrically coupled to the substrate; and

an electrically conductive cover comprising at least one second hole;

wherein, the electrically conductive cover is bonded to the substrate to form a chamber for accommodating the MEMS microphone and the IC chip, the at least one first hole and the at least one second hole together form at least one acoustic hole, the at least one acoustic hole has an opening on an outer surface of the MEMS microphone package, the opening has a first boundary and a second boundary, the first boundary of the opening is a part of a boundary of the at least one first hole, and the second boundary of the opening is a part of a boundary of the at least one second hole.

2. The MEMS microphone package according to claim 1, wherein the electrically conductive cover further comprises a top portion and a side portion, the side portion surrounds and is connected to the top portion, and the at least one second hole is disposed on the side portion.

3. The MEMS microphone package according to claim 2, wherein a boundary of the first hole is disposed on the upper surface, and the first hole is not in contact with the side surface and the bottom surface to form a blind hole.

4. The MEMS microphone package according to claim 2, wherein a boundary of the first hole is disposed on the upper surface and the bottom surface, and the first hole is not in contact with the side surface to form a through hole extending through the upper surface and the bottom surface.

5. The MEMS microphone package according to claim 2, wherein a boundary of the first hole is disposed on the upper surface and the side surface, and the first hole is not in contact with the bottom surface to form a peripheral blind hole.

6. The MEMS microphone package according to claim 2, wherein a boundary of the first hole is disposed on the upper surface, the bottom surface and the side surface to form a through hole on edge.

7. The MEMS microphone package according to claim 6, wherein the substrate further comprises at least one third electrically conductive layer, the at least one third electrically conductive layer is disposed on a surface of the first hole, and the at least one third electrically conductive layer is connected to the at least one first electrically conductive layer and the at least one second electrically conductive layer.

8. The MEMS microphone package according to claim 7, wherein the electrically conductive cover is electrically coupled to the at least one first electrically conductive layer, the at least one second electrically conductive layer is electrically coupled to a fourth electrically conductive layer such that the electrically conductive cover forms a shield for preventing electromagnetic interference.

9. The MEMS microphone package according to claim 1, wherein the electrically conductive cover further comprises a top portion, a side portion and a brim portion, the side portion surrounds and is connected to the top portion, the brim portion surrounds and is connected to the side portion, the at least one second hole is disposed on the brim portion.

10. The MEMS microphone package according to claim 9, wherein a boundary of the first hole is disposed on the upper surface, and the first hole is not contact with the side surface and the bottom surface to form a blind hole.

11. The MEMS microphone package according to claim 9, wherein a boundary of the first hole is disposed on the upper surface and the bottom surface, and the first hole is not in contact with the side surface to form a through hole extending through the upper surface and the bottom surface.

12. The MEMS microphone package according to claim 9, wherein a boundary of the first hole is disposed on the upper surface and the side surface, and the first hole is not in contact with the bottom surface to form a peripheral blind hole.

13. The MEMS microphone package according to claim 9, wherein a boundary of the first hole is disposed on the upper surface, the bottom surface and the side surface to form a through hole on edge.

14. The MEMS microphone package according to claim 13, wherein the substrate further comprises at least one third electrically conductive layer, the at least one third electrically conductive layer is disposed on a surface of the first hole, the at least one third electrically conductive layer is connected to the at least one first electrically conductive layer and the at least one second electrically conductive layer.

15. The MEMS microphone package according to claim 14, wherein the electrically conductive cover is electrically coupled to the at least one first electrically conductive layer, the at least one second electrically conductive layer is electrically coupled to a fourth electrically conductive layer outside the MEMS microphone package such that the electrically conductive cover forms a shield for preventing electromagnetic interference.

16. The MEMS microphone package according to claim 1, wherein the electrically conductive cover further comprises a top portion, a side portion and a brim portion, the side portion surrounds and is connected to the top portion, the brim portion surrounds and is connected to the side portion, a boundary of the at least one second hole extends from the brim portion to the side portion.

17. The MEMS microphone package according to claim 16, wherein a boundary of the first hole is disposed on the upper surface, and the first hole is not in contact with the side surface and the bottom surface to form a blind hole.

18. The MEMS microphone package according to claim 16, wherein a boundary of the first hole is disposed on the upper surface and the bottom surface, and the first hole is not in contact with the side surface to form a through hole extending through the upper surface and the bottom surface.

19. The MEMS microphone package according to claim 16, wherein a boundary of the first hole is disposed on the upper surface and the side surface, and the first hole is not in contact with the bottom surface to form a peripheral blind hole.

20. The MEMS microphone package according to claim 16, wherein a boundary of the first hole is disposed on the upper surface, the bottom surface and the side surface to form a through hole on edge.

21. The MEMS microphone package according to claim 20, wherein the substrate further comprises at least one third electrically conductive layer, the at least one third electrically conductive layer is disposed on a surface of the first hole, the at least one third electrically conductive layer is connected to the at least one first electrically conductive layer and the at least one second electrically conductive layer.

22. The MEMS microphone package according to claim 21, wherein the electrically conductive cover is electrically coupled to the at least one first electrically conductive layer, the at least one second electrically conductive layer is electrically coupled to a fourth electrically conductive layer outside of the MEMS microphone package such that the electrically conductive cover forms a shield for preventing electromagnetic interference.

23. The MEMS microphone package according to claim 1, further comprising at least one third electrically conductive layer disposed on at least one surface of the at least one first hole, the at least one third electrically conductive layer being electrically coupled to the electrically conductive cover, and the at least one third electrically conductive layer being electrically coupled to an electrical ground layer such that the electrically conductive cover and the at least one third electrically conductive layer forms a shield for preventing electromagnetic interference.

24. The MEMS microphone package according to claim 1, wherein the opening of the at least one acoustic hole further has a third boundary connected to the first boundary and the second boundary, and the third boundary of the opening is a part of a boundary of the first electrically conductive layer.

25. A microelectromechanical system (MEMS) microphone package, comprising:

a substrate, comprising;

at least one first hole;

an upper surface;

a bottom surface;

a side surface with two sides connected to the upper surface and the bottom surface, respectively, and the two sides being opposite to each other;

at least one first electrically conductive layer disposed on the upper surface; and

at least one second electrically conductive layer disposed on the bottom surface;

at least one MEMS microphone electrically coupled to the substrate;

at least one IC chip electrically coupled to the substrate; and

an electrically conductive cover comprising at least one second hole;

wherein the electrically conductive cover is bonded to the substrate to form a chamber for accommodating the MEMS microphone and the IC chip, the at least one first hole and the at least one second hole together form at least one acoustic hole, the at least one acoustic hole has an opening on an outer surface of the MEMS microphone package, the opening has a first boundary and a second boundary, the first boundary of the opening is a part of a boundary of the at least one first hole and is disposed on the upper surface, the second boundary of the opening is a part of a boundary of the at least one second hole, and the part of the boundary of the at least one first hole and the part of the boundary of the at least one second hole is not on a same plane.

26. The MEMS microphone package according to claim 25, wherein the first hole is not in contact with the side surface and the bottom surface to form a blind hole.

27. The MEMS microphone package according to claim 25, wherein another part of the boundary of the first hole is disposed on the bottom surface, and the first hole is not in contact with the side surface to form a through hole extending through the upper surface and the bottom surface.

28. The MEMS microphone package according to claim 25, wherein another part of the boundary of the first hole is disposed on the side surface, and the first hole is not in contact with the bottom surface to form a peripheral blind hole.

29. The MEMS microphone package according to claim 25, wherein another part of boundary of the first hole is disposed on the bottom surface and the side surface to form a through hole on edge.

30. The MEMS microphone package according to claim 29, wherein the substrate further comprises at least one third electrically conductive layer, the at least one third electrically conductive layer is disposed on a surface of the first hole, and the at least one third electrically conductive layer is connected to the at least one first electrically conductive layer and the at least one second electrically conductive layer.

31. The MEMS microphone package according to claim 30, wherein the electrically conductive cover is electrically coupled to the at least one first electrically conductive layer, the at least one second electrically conductive layer is electrically coupled to a fourth electrically conductive layer outside the MEMS microphone package such that the electrically conductive cover forms a shield for preventing electromagnetic interference.

32. The MEMS microphone package according to claim 25, further comprising at least one third electrically conductive layer disposed on at least one surface of the at least one first hole, the at least one third electrically conductive layer is electrically coupled to the electrically conductive cover, and the at least one third electrically conductive layer is electrically coupled to an electrical ground layer such that the electrically conductive cover and the at least one third electrically conductive layer together form a shield for preventing electromagnetic interference.

33. The MEMS microphone package according to claim 25, wherein the opening of the at least one acoustic hole further has a third boundary connected to the first boundary and the second boundary, and the third boundary of the opening is a part of a boundary of the first electrically conductive layer.

34. A microelectromechanical system (MEMS) microphone package, comprising:

a substrate, comprising;

at least one first hole;

an upper surface;

a bottom surface;

a side surface with two sides connected to the upper surface and the bottom surface, respectively, wherein the two sides are opposite to each other;

at least one first electrically conductive layer disposed on the upper surface;

at least one second electrically conductive layer disposed on the bottom surface; and

at least one third electrically conductive layer;

at least one MEMS microphone electrically coupled to the substrate;

at least one IC chip electrically coupled to the substrate; and

an electrically conductive cover comprising at least one second hole;

wherein the electrically conductive cover is bonded to the substrate to form a chamber for accommodating the MEMS microphone and the IC chip, the at least one first hole and the at least one second hole together form at least one acoustic hole, the at least one acoustic hole has an opening on an outer surface of the MEMS microphone package, the opening has a first boundary and a second boundary, the first boundary of the opening is a part of a boundary of the at least one first hole, the second boundary of the opening is a part of a boundary of the at least one second hole, the at least one third electrically conductive layer is disposed on at least one surface of the first hole, the at least one third electrically conductive layer is electrically coupled to the electrically conductive cover, and the at least one third electrically conductive layer is electrically coupled to an electrical ground layer such that the electrically conductive cover and the at least one third electrically conductive layer form a shield for preventing electromagnetic interference.

35. The MEMS microphone package according to claim 34, wherein the electrically conductive cover further comprises a top portion and a side portion, the side portion surrounds and is connected to the top portion, and the at least one second hole is disposed on the side portion.

36. The MEMS microphone package according to claim 34, wherein the electrically conductive cover further comprises a top portion, a side portion and a brim portion, the side portion surrounds and is connected to the top portion, the brim portion surrounds and is connected to the side portion, and the at least one second hole is disposed on the brim portion.

37. The MEMS microphone package according to claim 36, wherein a boundary of the at least one second hole extends from the brim portion to the side portion.

38. The MEMS microphone package according to claim 34, wherein the electrically conductive cover is connected to the at least one first electrically conductive layer, the at least one first electrically conductive layer is connected to the at least one third electrically conductive layer, the at least one third electrically conductive layer is connected to the at least one second electrically conductive layer, the at least one second electrically conductive layer is connected to a fourth electrically conductive layer outside the MEMS microphone package such that the electrically conductive cover and the at least one third electrically conductive layer together form a shield for preventing electromagnetic interference.

39. The MEMS microphone package according to claim 34, wherein the opening of the at least one acoustic hole further has a third boundary connected to the first boundary and the second boundary, and the third boundary of the opening is a part of a boundary of the first electrically conductive layer.