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Package substrate with testing pads on fine pitch traces

  • US 9,370,097 B2
  • Filed: 03/01/2013
  • Issued: 06/14/2016
  • Est. Priority Date: 03/01/2013
  • Status: Active Grant
First Claim
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1. A substrate comprising:

  • a plurality of traces;

    a solder resist layer covering the plurality of traces; and

    a testing pad coupled to a trace from the plurality of traces, the testing pad configured to enable testing of the substrate in the absence of any component being mounted on the substrate, the testing pad being at least partially exposed and at least partially free of the solder resist layer when a chip is coupled to the substrate.

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