Low-profile stacked-die MEMS resonator system

• US 9,371,221 B2
• Filed: 01/15/2015
• Issued: 06/21/2016
• Est. Priority Date: 06/15/2006
• Status: Active Grant

• Current Assignee: SiTime Corporation (Megachips Corporation)
• Original Assignee: SiTime Corporation (Megachips Corporation)
• Inventors: Gupta, Pavan, Partridge, Aaron, Lutz, Markus
• Primary Examiner(s): Diaz, Jose R
• Application Number:
  US14/597,825
• Publication Number:
  US 20150123220A1
• Time in Patent Office: 523 Days
• US Class Current: 1/1
• CPC Class Codes: B81B 2201/0271 Resonators; ultrasonic resonators
• CPC Class Codes: B81B 2207/07 Interconnects
• CPC Class Codes: B81B 2207/094 Feed-through, via
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: B81B 7/0077 Other packages not provided for in groups B81B7/0035 - B81B7/0074
• CPC Class Codes: B81B 7/0083 Temperature control
• CPC Class Codes: B81C 1/0023 Packaging together an electronic processing unit die and a micromechanical structure die MEMS packages B81B7/0032; MEMS packaging processes B81C1/00261
• CPC Class Codes: B81C 1/00301 Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias
• CPC Class Codes: B81C 1/00333 Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325
• CPC Class Codes: B81C 1/00341 Processes for manufacturing microsystems not provided for in groups B81C1/00023 - B81C1/00261
• CPC Class Codes: B81C 2201/016 Passivation
• CPC Class Codes: B81C 2203/0118 Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
• CPC Class Codes: B81C 2203/0154 Moulding a cap over the MEMS device
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48245 the item being metallic
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/34 Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements thermal treatment apparatus H01L21/00
• CPC Class Codes: H01L 23/498 Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers shape of the substrate H01L23/13
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/1461 : MEMS
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H10N 30/302 : Sensors

Abstract

A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead. A MEMS resonator chip is mounted to the resonator-control chip in a stacked die configuration and the MEMS resonator chip, resonator-control chip and internal electrical contact and die-mounting surfaces of the electrical lead are enclosed within a package enclosure that exposes the external electrical contact surface of the electrical lead at an external surface of the packaging structure.

Claims

1. A microelectromechanical-system (MEMS) resonator system packaging structure having a low cross-sectional profile, the packaging structure comprising:

a lead frame including an electrical lead having internal and external electrical contact surfaces at respective first and second heights within the cross-sectional profile of the packaging structure, and a die-mounting surface at a third height between the first and second heights;

a resonator-control chip mounted to the die-mounting surface of the electrical lead and wire-bonded to the internal electrical contact surface of the electrical lead;

a MEMS resonator chip mounted to the resonator-control chip in a stacked die configuration and electrically coupled to the resonator-control chip; and

a package enclosure that encloses the MEMS resonator chip, resonator-control chip and internal electrical contact and die-mounting surfaces of the electrical lead, and that exposes the external contact surface of the electrical lead at an external surface of the packaging structure.

2. The packaging structure of claim 1 further comprising a layer of electrically-conductive epoxy disposed between the MEMS resonator chip to both secure and electrically couple the MEMS resonator chip to the resonator-control chip.

3. The packaging structure of claim 1 further comprising:

an electrically insulating passivation layer disposed between the MEMS resonator chip and the resonator-control chip; and

a layer of electrically conductive epoxy disposed between the MEMS resonator chip and the passivation layer to (i) electrically couple the MEMS resonator chip to the resonator-control chip via one or more apertures in the passivation layer and (ii) secure the MEMS resonator chip to the resonator-control chip.

4. The packaging structure of claim 1 further comprising a layer of thermally-conductive epoxy disposed between the MEMS resonator chip and the resonator-control chip to both secure and thermally couple the MEMS resonator chip to the resonator-control chip.

5. The packaging structure of claim 1 further comprising:

an electrically-insulating passivation layer disposed between the MEMS resonator chip and the resonator-control chip, the passivation layer having one or more apertures therein; and

a thermally conductive epoxy disposed between the MEMS resonator chip and the passivation layer and extending through the one or more apertures in the passivation layer to contact the resonator-control chip such that one or more thermal conduction paths are established between the MEMS resonator chip and the resonator-control chip.

6. The packaging structure of claim 1 further comprising wire bonds extending from the MEMS resonator chip to the resonator-control chip.

7. The packaging structure of claim 1 wherein the resonator-control chip comprises substantially planar opposite surfaces, including a first surface secured to the die-mounting surface of the electrical lead and a second surface bearing a contact that is wire-bonded to the internal electrical contact surface of the electrical lead.

8. The packaging structure of claim 7 wherein a difference between the first and second heights of the internal and external electrical contact surfaces of the electrical lead substantially matches a thickness dimension between the first and second surfaces of the resonator-control chip such that the second surface of the resonator-control chip is at approximately the first height within the cross-sectional profile.

9. The packaging structure of claim 1 wherein the lead frame includes, in addition to the electrical lead, at least one other electrical lead having internal and external electrical contact surfaces at the first and second heights, respectively, and wherein the resonator-control chip is mounted to the at least one other electrical lead and extends across a gap between the electrical lead and the at least one other electrical lead.

10. The packaging structure of claim 9 wherein the package enclosure fills the gap.

11. The packaging structure of claim 9 wherein the resonator-control chip is at least partly disposed between (i) a portion of the electrical lead that extends to the internal electrical contact surface thereof and (ii) a portion of the at least one other electrical lead that extends to the internal electrical contact surface thereof.

12. The packaging structure of claim 1 wherein at least a substantial portion of the resonator-control chip is disposed between the first and second heights within the cross-sectional profile.

13. The packaging structure of claim 1 wherein the MEMS resonator chip is disposed in a flip-chip orientation relative to the resonator-control chip.

14. The packaging structure of claim 1 wherein the MEMS resonator chip comprises a MEMS resonator and the resonator-control chip comprises a temperature sensor and circuitry to compensate for changes in temperature of the MEMS resonator based, at least in part, on temperature data obtained from the temperature sensor.

15. A method of packaging a microelectromechanical-system (MEMS) resonator system within a low-profile packaging structure, the method comprising:

forming a lead frame having a plurality of electrical leads, including an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure, and a die-mounting surface at an intermediate height between the first and second heights;

mounting a resonator-control chip to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights within the cross-sectional profile of the packaging structure;

wire-bonding the resonator-control chip to the internal electrical contact surface of the electrical lead;

mounting a MEMS resonator chip to the resonator-control chip in a stacked die configuration;

electrically coupling the MEMS resonator chip to the resonator-control chip; and

enclosing the MEMS resonator chip, resonator-control chip and internal electrical contact and die-mounting surfaces of the electrical lead within a package enclosure that exposes the external electrical contact surface of the electrical lead at an external surface of the packaging structure.

16. The method of claim 15 wherein mounting the MEMS resonator chip to the resonator-control chip in the stacked die configuration comprises disposing a layer of electrically-conductive epoxy between the MEMS resonator chip to both secure and electrically couple the MEMS resonator chip to the resonator-control chip.

17. The method of claim 15 wherein mounting the MEMS resonator chip to the resonator-control chip in the stacked die configuration comprises disposing a layer of thermally-conductive epoxy between the MEMS resonator chip and the resonator-control chip to both secure and thermally couple the MEMS resonator chip to the resonator-control chip.

18. The method of claim 15 wherein mounting the MEMS resonator chip to the resonator-control chip in the stacked die configuration comprises:

disposing an electrically-insulating passivation layer between the MEMS resonator chip and the resonator-control chip, the passivation layer having one or more apertures therein; and

disposing a layer of epoxy between the MEMS resonator chip and the passivation layer to secure the MEMS resonator chip to the resonator-control chip, the layer of epoxy extending from the MEMS resonator chip to the resonator-control chip via the one or more apertures in the passivation layer and having at least one of a thermally conductive property or an electrically conductive property to establish at least one of a thermal conduction path or an electrical conduction path between the MEMS resonator chip and the resonator-control chip via the one or more apertures in the passivation layer.

19. The method of claim 15 wherein:

the resonator-control chip comprises substantially planar first and second surfaces separated by a thickness of the resonator-control chip;

mounting the resonator-control chip to the die-mounting surface of the electrical lead the resonator-control chip comprises securing the first surface of the resonator-control chip to the die-mounting surface of the electrical lead;

wire-bonding the resonator-control chip to the internal electrical contact surface of the electrical lead comprises wire-bonding a contact on the second surface of the resonator-control chip to the internal electrical contact surface of the electrical lead; and

a difference between the first and second heights of the internal and external electrical contact surfaces of the electrical lead substantially matches the thickness of the resonator-control chip such that the second surface of the resonator-control chip is at approximately the first height within the cross-sectional profile.

20. The method of claim 15 wherein the lead frame includes, in addition to the electrical lead, at least one other electrical lead having internal and external electrical contact surfaces at the first and second heights, respectively, the method further comprising:

mounting the resonator-control chip to the at least one other electrical lead such that the resonator-control chip extends across a gap between the electrical lead and the at least one other electrical lead; and

enclosing the at least one other electrical lead within the package enclosure that exposes the electrical contact surface of the at least one other electrical lead at the external surface of the packaging structure and fills the gap between the electrical lead and the at least one other electrical lead.

21. The method of claim 15 wherein electrically coupling the MEMS resonator chip to the resonator-control chip comprises wire-bonding the MEMS resonator chip to the resonator-control chip.