Packaged device

• US 9,372,202 B2
• Filed: 09/14/2012
• Issued: 06/21/2016
• Est. Priority Date: 09/18/2008
• Status: Active Grant

• Current Assignee: DRNC Holdings, Inc. (InterDigital, Inc.)
• Original Assignee: DRNC Holdings, Inc. (InterDigital, Inc.)
• Inventors: Inoue, Hiroaki, Katsuki, Takashi, Nakazawa, Fumihiko
• Primary Examiner(s): Dinh, Tuan T
• Application Number:
  US13/618,643
• Publication Number:
  US 20130010447A1
• Time in Patent Office: 1,376 Days
• Field of Search: 361760-784, 361792-794, 361/803, 257414-415, 7350412-50414
• US Class Current: 1/1
• CPC Class Codes: B81C 1/00301 Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias
• CPC Class Codes: G01C 19/5719 using planar vibrating masses driven in a translation vibration along an axis
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: H01L 21/76898 formed through a semiconductor substrate
• CPC Class Codes: H01L 23/481 Internal lead connections, e.g. via connections, feedthrough structures
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base

Abstract

A packaged device of one embodiment includes a device layer section, and first and second packaging members. The device layer section is one where a movable microdevice including a movable part and a terminal part is formed. The first packaging member is joined to the device layer section, and includes a wiring region provided at a position corresponding to the terminal part and a conductive plug extending through the wiring region. The second packaging member is joined to a side of the device layer section opposite the first packaging member.

Claims

1. A packaged device comprising:

a device layer section in which a movable microdevice including a movable part and a terminal part is formed;

a first packaging member joined to the device layer section, and including a wiring region provided at a position corresponding to the terminal part and a conductive plug extending through the wiring region, the first packaging member including a conductive non-wiring region electrically isolated from the wiring region, the conductive non-wiring region adapted to act as a ground; and

a second packaging member joined to a side of the device layer section opposite the first packaging member, and

an insulating film provided on a surface of the first packaging member, and including a first opening at a position corresponding to the wiring region;

a first electrode pad electrically coupled to the wiring region at the first opening;

wherein the insulating film includes a second opening at a position corresponding to the conductive non-wiring region, and

wherein a second electrode pad is electrically coupled to the conductive non-wiring region at the second opening.

2. The packaged device according to claim 1, wherein the second electrode pad is provided in the second opening in an in-plane direction of the first packaging member.

3. The packaged device according to claim 1, wherein the first packaging member includes a recess facing the movable part of the movable microdevice.

4. The packaged device according to claim 1, wherein the second packaging member includes a recess facing the movable part of the movable microdevice.