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Method for manufacturing a high-capacitance RF MEMS switch

  • US 9,373,460 B2
  • Filed: 12/26/2012
  • Issued: 06/21/2016
  • Est. Priority Date: 04/22/2010
  • Status: Active Grant
First Claim
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1. A method for manufacturing a micro-electro-mechanical switch assembly comprising:

  • depositing an electrode material on a surface of a substrate;

    depositing a dielectric material to form a dielectric layer on at least a portion of a surface of the electrode material;

    depositing a metal layer on at least a portion of a surface of the dielectric layer, the metal layer having a plurality of openings extending through the metal layer;

    depositing a plurality of posts on the substrate at positions spaced apart from the electrode material;

    depositing a spacer material on the metal layer and between the posts;

    depositing a flexible membrane on the spacer material and the posts; and

    etching the spacer material from the assembly.

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