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Substrate recycling method and recycled substrate

  • US 9,373,496 B2
  • Filed: 11/21/2013
  • Issued: 06/21/2016
  • Est. Priority Date: 11/21/2012
  • Status: Expired due to Fees
First Claim
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1. A substrate recycling method, the method comprising:

  • separating a substrate comprising a first surface from an epitaxial layer;

    performing a first etching of the first surface using electrochemical etching; and

    performing, after the first etching, a second etching of the first surface using chemical etching or dry etching, or performing, after the first etching, chemical mechanical polishing of the first surface,wherein;

    the first surface comprises a sacrificial layer; and

    the substrate further comprises an etching stop layer disposed under the sacrificial layer.

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