Stepped package for image sensor

• US 9,373,653 B2
• Filed: 03/23/2015
• Issued: 06/21/2016
• Est. Priority Date: 09/02/2011
• Status: Active Grant

• Current Assignee: Optiz, Inc.
• Original Assignee: Optiz, Inc.
• Inventors: Oganesian, Vage
• Primary Examiner(s): Smith, Bradley K
• Assistant Examiner(s): GOODWIN, DAVID J
• Application Number:
  US14/665,084
• Publication Number:
  US 20150200219A1
• Time in Patent Office: 456 Days
• Field of Search: 257/680, 257/433, 257/678, 257/690, 257/734
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/1134 Stud bumping, i.e. using a wire-bonding apparatus
• CPC Class Codes: H01L 2224/12105 Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
• CPC Class Codes: H01L 2224/13021 the bump connector being disposed in a recess of the surface
• CPC Class Codes: H01L 2224/13022 the bump connector being at least partially embedded in the surface
• CPC Class Codes: H01L 2224/131 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/13144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/16237 the bump connector connecting to a bonding area disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/2105 Shape
• CPC Class Codes: H01L 2224/211 Disposition
• CPC Class Codes: H01L 2224/215 Material
• CPC Class Codes: H01L 2224/221 Disposition
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32227 the layer connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/73217 Layer and HDI connectors
• CPC Class Codes: H01L 2224/81444 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/81447 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/82106 by subtractive methods
• CPC Class Codes: H01L 2224/83101 as prepeg comprising a layer connector, e.g. provided in an insulating plate member
• CPC Class Codes: H01L 2224/8385 : using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
• CPC Class Codes: H01L 2224/92144 : the second connecting process involving a build-up interconnect
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/19 : Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 24/20 : Structure, shape, material or disposition of high density interconnect preforms
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 24/92 : Specific sequence of method steps
• CPC Class Codes: H01L 27/14618 : Containers
• CPC Class Codes: H01L 27/14634 : Assemblies, i.e. Hybrid structures
• CPC Class Codes: H01L 27/14636 : Interconnect structures
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/15156 : Side view

Abstract

An image sensor package includes a crystalline handler having opposing first and second surfaces, and a cavity formed into the first surface. At least one step extends from a sidewall of the cavity, wherein the cavity terminates in an aperture at the second surface. A cover is mounted to the second surface and extends over and covers the aperture. The cover is optically transparent to at least one range of light wavelengths. A sensor chip is disposed in the cavity and mounted to the at least one step. The sensor chip includes a substrate with front and back opposing surfaces, a plurality of photo detectors formed at the front surface, and a plurality of contact pads formed at the front surface which are electrically coupled to the photo detectors.

Claims

1. An image sensor package, comprising:

a crystalline handler having opposing first and second surfaces, the handler including a cavity formed into the first surface and at least one step extending from a sidewall of the cavity;

a sensor chip disposed in the cavity, wherein the sensor chip includes;

a substrate with front and back opposing surfaces,

a plurality of photo detectors formed at the front surface, and

a plurality of contact pads formed at the front surface which are electrically coupled to the photo detectors,

wherein the front surface of the sensor chip is mounted to the at least one step;

a plurality of holes in the substrate each extending from the back surface to one of the contact pads;

conductive material in each of the holes extending from the contact pad to the back surface and insulated from a sidewall of the hole; and

a plurality of surface mount interconnects each disposed over the first surface or the back surface, and each electrically connected to the conductive material in one of the holes.

2. The image sensor package of claim 1, wherein the sensor chip is mounted to the at least one step by dielectric material disposed between the at least one step and the front surface.

3. The image sensor package of claim 1, further comprising:

a dielectric material extending over the first and back surfaces that encapsulates the sensor chip in the cavity, wherein each of the plurality of holes extends through the dielectric material.

4. The image sensor package of claim 1, wherein for each of the holes, the conductive material fills the hole.

5. The image sensor package of claim 1, wherein for each of the holes, the conductive material is a layer of conductive material that extends along the sidewall of the hole.

6. The image sensor package of claim 1, wherein the cavity terminates in an aperture at the second surface, and wherein the image sensor package further comprising:

a cover mounted to the second surface and extending over and covering the aperture, wherein the cover is optically transparent to at least one range of light wavelengths.

7. The image sensor package of claim 1, wherein the cavity formed into the first surface does not reach the second surface, and wherein the handler is optically transparent to at least one range of light wavelengths.

8. An image sensor package, comprising:

a crystalline handler having opposing first and second surfaces, the handler including a cavity formed into the first surface and at least one step extending from a sidewall of the cavity;

a sensor chip disposed in the cavity, wherein the sensor chip includes;

a substrate with front and back opposing surfaces,

a plurality of photo detectors formed at the front surface, and

a plurality of contact pads formed at the front surface which are electrically coupled to the photo detectors,

wherein the front surface of the sensor chip is mounted to the at least one step;

a plurality of holes in the substrate each extending from the back surface to one of the contact pads;

conductive material in each of the holes extending from the contact pad to the back surface and insulated from a sidewall of the hole; and

a plurality of surface mount interconnects each disposed over the first surface or the back surface, and each electrically connected to the conductive material in one of the holes;

a second cavity formed into the first surface of the handler;

a processor chip disposed in the second cavity, the processor chip comprising;

a second substrate,

processing circuitry formed on the second substrate, and

a plurality of second contact pads formed on the second substrate which are electrically coupled to the processing circuitry.

9. The image sensor package of claim 8, further comprising:

a dielectric material extending over the first surface of the handler, the sensor chip and the processor chip that encapsulates the sensor chip in the cavity and encapsulates the processor chip in the second cavity.

10. The image sensor package of claim 9, further comprising:

a plurality of second holes each extending from one of the contact pads of the processor chip and through the dielectric material; and

conductive material in each of the second holes extending from the one contact pad of the processor chip and through the dielectric material.

11. The image sensor package of claim 10, further comprising:

a second plurality of surface mount interconnects each disposed over the first surface or the processor chip, and each electrically connected to the conductive material in one of the second holes.