Method of forming a low profile image sensor package with an image sensor substrate, a support substrate and a printed circuit board

• US 9,373,660 B2
• Filed: 10/12/2015
• Issued: 06/21/2016
• Est. Priority Date: 09/10/2012
• Status: Active Grant

• Current Assignee: Optiz, Inc.
• Original Assignee: Optiz, Inc.
• Inventors: Oganesian, Vage
• Primary Examiner(s): Jahan, Bilkis
• Application Number:
  US14/881,075
• Publication Number:
  US 20160035785A1
• Time in Patent Office: 253 Days
• Field of Search: None
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14627 Microlenses
• CPC Class Codes: H01L 27/1464 Back illuminated imager structures
• CPC Class Codes: H01L 27/14683 Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof not peculiar thereto H01L21/00
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements
• CPC Class Codes: H01L 27/14687 Wafer level processing
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

An image sensor package, and method of making same, that includes a printed circuit board having a first substrate with an aperture extending therethrough, one or more circuit layers, and a plurality of first contact pads electrically coupled to the one or more circuit layers. A sensor chip mounted to the printed circuit board and disposed at least partially in the aperture. The sensor chip includes a second substrate, a plurality of photo detectors formed on or in the second substrate, and a plurality of second contact pads formed at the surface of the second substrate which are electrically coupled to the photo detectors. Electrical connectors each electrically connect one of the first contact pads and one of the second contact pads. A lens module is mounted to the printed circuit board and has one or more lenses disposed for focusing light onto the photo detectors.

Claims

1. A method of forming an image sensor package, comprising:

providing a first substrate with opposing first and second surfaces and a plurality of image sensors formed thereon, wherein each image sensor includes a plurality of photo detectors formed on or in the first substrate and a plurality of first contact pads formed at the first surface of the first substrate which are electrically coupled to the photo detectors;

mounting a second substrate with opposing first and second surfaces to the first substrate by attaching the second substrate first surface to the first substrate first surface;

forming trenches into the second substrate second surface that extends partially through the second substrate, wherein each of the trenches is disposed over one or more of the first contact pads;

forming a plurality of openings each extending from one of the trenches to the second substrate first surface and exposing one of the first contact pads;

forming a plurality of conductive traces each extending from one of the first contact pads and through one of the plurality of openings;

dicing the mounted first and second substrates into multiple separate image sensor assemblies along dicing lines in-between the image sensors, wherein each of the image sensor assemblies includes one of the image sensors;

mounting one of the image sensor assemblies to a printed circuit board, wherein the printed circuit board includes a third substrate with opposing first and second surfaces, a cavity formed into the third substrate first surface, an opening extending from the cavity to the third substrate second surface, one or more circuit layers, and a plurality of second contact pads electrically coupled to the one or more circuit layers, wherein the first substrate of the one image sensor assembly is at least partially disposed in the cavity; and

electrically connecting each of the plurality of conductive traces of the one image sensor assembly to one of the second contact pads.

2. The method of claim 1, wherein the printed circuit board includes a laterally extending shoulder at the second surface of the third substrate such that the opening has a smaller lateral dimension than that of the cavity.

3. The method of claim 2, further comprising:

mounting a lens module to the printed circuit board, wherein the lens module includes one or more lenses disposed for focusing light onto the photo detectors.

4. The method of claim 2, wherein the mounting includes mounting the one image sensor assembly to the shoulder via adhesive, and wherein the plurality of photo detectors are oriented to receive light passing through the opening.

5. The method of claim 3, wherein the lens module is mounted to the second surface of the third substrate, and disposed over the opening.

6. The method of claim 2, wherein the plurality of second contact pads are disposed at the first surface of the third substrate.

7. The method of claim 4, further comprising:

mounting an optically transparent substrate to and spaced from the first substrate second surface of the one image sensor assembly, wherein the adhesive is disposed directly between the optically transparent substrate and the shoulder.

8. The method of claim 2, wherein the adhesive is disposed directly between the first substrate second surface of the one image sensor assembly and the shoulder.

9. The method of claim 2, wherein:

the plurality of second contact pads are disposed at the shoulder of the third substrate;

the electrically connecting includes using Ball Grid Array (BGA) or Land Grid Array electrical connectors.

10. The method of claim 9, further comprising:

mounting an optically transparent substrate to and spaced from the first substrate second surface of the one image sensor assembly.