3-D inductor and transformer

• US 9,373,673 B2
• Filed: 05/21/2015
• Issued: 06/21/2016
• Est. Priority Date: 06/01/2010
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Yen, Hsiao-Tsung, Kuo, Chin-Wei, Hu, Hsien-Pin, Liu, Sally, Chen, Ming-Fa, Lu, Jhe-Ching
• Primary Examiner(s): REAMES, MATTHEW L
• Application Number:
  US14/719,115
• Publication Number:
  US 20150255531A1
• Time in Patent Office: 397 Days
• US Class Current: 1/1
• CPC Class Codes: H01F 17/0006 Printed inductances printed coils for dynamo-electric machines H02K3/26; printed circuits H05K
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H01L 21/283 Deposition of conductive or insulating materials for electrodes conducting electric current
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/05552 in top view
• CPC Class Codes: H01L 2224/05572 the external layer extending out of an opening
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/5227 Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 28/10 Inductors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA

Abstract

In accordance with an embodiment, a semiconductor device comprises a semiconductor die, an interposer, and conductive bumps bonding the semiconductor die to the interposer. The semiconductor die comprises a first metallization layer, and the first metallization layer comprises a first conductive pattern. The interposer comprises a second metallization layer, and the second metallization layer comprises a second conductive pattern. Some of the conductive bumps electrically couple the first conductive pattern to the second conductive pattern to form a coil. Other embodiments contemplate other configurations of coils, inductors, and/or transformers, and contemplate methods of manufacture.

Claims

1. A structure comprising:

a semiconductor die comprising;

a first metallization layer comprising a first conductive pattern; and

a second metallization layer over the first metallization layer, the second metallization layer comprising a second conductive pattern;

an interposer comprising;

a third metallization layer on a first side of the interposer, the third metallization layer comprising a third conductive pattern; and

a fourth metallization layer over the third metallization layer, the fourth metallization layer comprising a fourth conductive pattern; and

a first set of conductive bumps bonding the semiconductor die to the interposer, at least one of the first set of conductive bumps electrically coupling one of the first conductive pattern and the second conductive pattern to one of the third conductive pattern and the fourth conductive pattern to form a first coil, and at least one other of the first set of conductive bumps electrically coupling one of the first conductive pattern and the second conductive pattern to one of the third conductive pattern and fourth conductive pattern to form a second coil, the first coil being distinct from the second coil.

2. The structure of claim 1 further comprising:

a substrate; and

a second set of conductive bumps on a second side of the interposer and bonding the interposer to the substrate, the second side being opposite the first side.

3. The structure of claim 2 further comprising:

a second integrated circuit die; and

a third set of conductive bumps on the second side of the interposer and bonding the second integrated circuit die to the interposer.

4. The structure of claim 1, wherein the semiconductor die further comprises a first dielectric layer, the first metallization layer being in the first dielectric layer, and wherein the interposer further comprises a second dielectric layer, the second metallization layer being in the second dielectric layer.

5. The structure of claim 1, wherein the first conductive pattern and the third conductive pattern each comprises a ring-shape of conductive materials.

6. The structure of claim 1, wherein the interposer further comprises a via electrically coupling the third conductive pattern to the fourth conductive pattern.

7. The structure of claim 1, wherein the semiconductor die further comprises a via electrically coupling the first conductive pattern to the second conductive pattern.

8. The structure of claim 1, wherein the second coil surrounds the first coil.

9. The structure of claim 1, wherein the first conductive pattern, the second conductive pattern, the third conductive pattern, and the fourth conductive pattern each comprises at least two trace links, wherein the at least two trace links of each of the first conductive pattern and the second conductive pattern has at least a first portion with a first longitudinal axis and at least a second portion with a second longitudinal axis, the second longitudinal axis being different than the first longitudinal axis.

10. A device comprising:

a semiconductor die comprising;

a first metallization layer comprising a first spiral pattern and a second spiral pattern, the second spiral pattern being distinct from the first spiral pattern, a first part of the first spiral pattern surrounding the second spiral pattern, and the second spiral pattern surrounding a second part of the first spiral pattern; and

a second metallization layer on the first metallization layer, the second metallization layer comprising a first cross link and a second cross link;

an interposer comprising;

a third metallization layer on a first side of a substrate, the third metallization layer comprising a third spiral pattern and a fourth spiral pattern, the fourth spiral pattern being distinct from the third spiral pattern;

a fourth metallization layer on the first side of the substrate comprising a third cross link and a fourth cross link; and

through substrate vias (TSVs) extending through the substrate; and

conductive bumps bonding the semiconductor die to a second side of the interposer, the second side being opposite the first side, the conductive bumps and the TSVs electrically coupling at least one of the first metallization layer and second metallization layer to at least one of the third metallization layer and the fourth metallization layer.

11. The device of claim 10, wherein the first cross link electrically couples a first portion of the first spiral pattern to a second portion of the first spiral pattern, and the second cross link electrically couples a first portion of the second spiral pattern to a second portion of the second spiral pattern.

12. The device of claim 11, wherein the first cross link further comprises:

a metal line in the second metallization layer;

a first via electrically coupling the first portion of the first spiral pattern to the metal line; and

a second via electrically coupling the second portion of the first spiral pattern to the metal line.

13. The device of claim 10, wherein a first part of the third spiral pattern surrounds the fourth spiral pattern, and the fourth spiral pattern surrounds a second part of the third spiral pattern.

14. The device of claim 10, wherein at least one TSV electrically couples the first spiral pattern to the third spiral pattern, and at least one other TSV electrically couples the second spiral pattern to the fourth spiral pattern.

15. The device of claim 10, wherein each of the TSVs have a first end and a second end, the first ends being coplanar with a first side of the substrate and the second ends being coplanar with the second side of the substrate, the first and second sides being major surfaces of the substrate.

16. A method comprising:

forming a plurality of through substrate vias (TSVs) extending through a substrate;

forming a first set of trace links on a first side of the substrate, the first set of trace links forming a first conductive pattern;

forming a second set of trace links over the first set of trace links, the second set of trace links forming a second conductive pattern;

forming a third set of trace links on a second side of the substrate, the second side being opposite the first side, the third set of trace links forming a third conductive pattern; and

forming a fourth set of trace links over the third set of trace links, the fourth set of trace links forming a fourth conductive pattern, at least one of the plurality of TSVs electrically coupling the first conductive pattern and the third conductive pattern to form a first coil, at least one other of the plurality of TSVs electrically coupling the second conductive pattern and the fourth conductive pattern to form a second coil, the first coil being distinct from the second coil.

17. The method of claim 16, wherein the first conductive pattern and the third conductive pattern each comprises a ring-shape of conductive materials.

18. The method of claim 16, wherein each of the first and third sets of trace links has at least a portion with a first longitudinal axis and at least a second portion with a second longitudinal axis, the second longitudinal axis being different than the first longitudinal axis.

19. The method of claim 16, wherein each of the plurality of TSVs having a first end and a second end, the first ends being coplanar with a first side of the substrate and the second ends being coplanar with the second side of the substrate, the first and second sides being major surfaces of the substrate.

20. The method of claim 16, wherein the second coil surrounds the first coil.