Mems having a cutout section on concave portion of a substrate

• US 9,376,313 B2
• Filed: 04/15/2015
• Issued: 06/28/2016
• Est. Priority Date: 04/18/2014
• Status: Active Grant

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Tanaka, Satoru
• Primary Examiner(s): Chambliss, Alonzo
• Application Number:
  US14/687,057
• Publication Number:
  US 20150303153A1
• Time in Patent Office: 440 Days
• US Class Current: 1/1
• CPC Class Codes: B81B 2201/0235 Accelerometers
• CPC Class Codes: B81B 2201/0242 Gyroscopes
• CPC Class Codes: B81B 2203/0118 Cantilevers
• CPC Class Codes: B81B 2207/097 Interconnects arranged on the substrate or the lid, and covered by the package seal
• CPC Class Codes: B81B 3/0018 Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
• CPC Class Codes: B81B 3/0072 For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: B81C 1/00158 Diaphragms, membranes manufacture process for semi-permeable inorganic membranes B01D67/0039
• CPC Class Codes: B81C 2203/0109 Bonding an individual cap on the substrate
• CPC Class Codes: G01C 19/5656 the devices involving a micromechanical structure
• CPC Class Codes: G01L 9/0042 Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms details about the integration or bonding of piezoresistor in or on the diaphragm G01L9/0052 and G01L9/0057 respectively
• CPC Class Codes: H01L 21/76205 in a region being recessed from the surface, e.g. in a recess, groove, tub or trench region
• CPC Class Codes: H01L 2224/0212 Auxiliary members for bonding areas, e.g. spacers
• CPC Class Codes: H01L 23/528 Geometry or layout of the interconnection structure H01L27/0207 takes precedence; algorithms G06F30/00
• CPC Class Codes: H01L 24/02 Bonding areas on insulating substrates, e.g. chip carriers, H01L23/49816, H01L23/49838, H01L23/5389; Manufacturing methods related thereto
• CPC Class Codes: H01L 2924/15 Details of package parts other than the semiconductor or other solid state devices to be connected
• CPC Class Codes: H01L 2924/351 Thermal stress

Abstract

According to an aspect of the invention, a functional element includes a substrate which is provided with a concave section; a stationary section connected to a wall section that defines the concave section of the substrate; an elastic section which extends from the stationary section and is capable of stretching and contracting in a first axis direction; a movable body connected to the elastic section; a movable electrode section which extends from the movable body. The concave section includes a cutout section which is provided on the wall section. The stationary section includes an overlap section which is spaced with the substrate, and overlaps the concave section when seen in a plan view. At least a portion of the overlap section overlaps the cutout section when seen in the plan view, and the elastic section extends from the overlap section.

Claims

1. A functional element comprising:

a substrate which is provided with a concave section;

a stationary section connected to a wall section that defines the concave section of the substrate;

an elastic section which extends from the stationary section and is capable of stretching and contracting in a first axis direction;

a movable body connected to the elastic section;

a movable electrode section which extends from the movable body; and

a stationary electrode section which is connected to the substrate and extends in an extending direction of the movable electrode section,

wherein the concave section includes a cutout section which is provided on the wall section,

the stationary section includes an overlap section which is spaced with the substrate, and overlaps the concave section when seen in a plan view,

at least a portion of the overlap section overlaps the cutout section when seen in the plan view, and

the elastic section extends from the overlap section.

2. The functional element according to claim 1,

wherein the stationary section includes an extension section which extends from the overlap section in a second axis direction intersecting with the first axis direction when seen in the plan view.

3. The functional element according to claim 2, wherein a width of the cutout section in the first axis direction is wider than a width of a portion of the overlap section overlapping the cutout section in the first axis direction when seen in the plan view.

4. The functional element according to claim 2,

wherein the concave section is continuous to the cutout section and includes a receiving section which receives the movable body,

when seen in the plan view, the overlap section includes a first portion overlapping the cutout section and a second portion overlapping the receiving section, and

when seen in the plan view, a width of the cutout section in the second axis direction which intersects the first axis direction is wider than a width of the second portion in the second axis direction.

5. The functional element according to claim 1, wherein a width of the cutout section in the first axis direction is wider than a width of the portion of the overlap section overlapping the cutout section in the first axis direction when seen in the plan view.

6. The functional element according to claim 5,

wherein the concave section is continuous to the cutout section and includes a receiving section which receives the movable body,

when seen in the plan view, the overlap section includes a first portion overlapping the cutout section and a second portion overlapping the receiving section, and

when seen in the plan view, a width of the cutout section in the second axis direction which intersects the first axis direction is wider than a width of the second portion in the second axis direction.

7. The functional element according to claim 1, wherein a material of the substrate is glass, and a material of the stationary section is silicon.

8. The functional element according to claim 7,

wherein the concave section is continuous to the cutout section and includes a receiving section which receives the movable body,

when seen in the plan view, the overlap section includes a first portion overlapping the cutout section and a second portion overlapping the receiving section, and

when seen in the plan view, a width of the cutout section in the second axis direction which intersects the first axis direction is wider than a width of the second portion in the second axis direction.

9. The functional element according to claim 1,

wherein the concave section is continuous to the cutout section and includes a receiving section which receives the movable body,

when seen in the plan view, the overlap section includes a first portion overlapping the cutout section and a second portion overlapping the receiving section, and

when seen in the plan view, a width of the cutout section in the second axis direction which intersects the first axis direction is wider than a width of the second portion in the second axis direction.

10. An electronic apparatus comprising the functional element according to claim 1.

11. A mobile entity comprising the functional element according to claim 1.