Backlight module and heat-dissipating device
First Claim
1. A heat dissipating device for a backlight module and which is arranged between a backframe and a waveguide of the backlight module for dissipating heat generated from a light source disposed adjacent to an end of the waveguide, wherein the heat dissipating device includes a master heatsink, which is made of a material having a first composition, and an auxiliary heatsink, which is made of a material that has a second composition different from the first composition;
- wherein the master heatsink has a raised portion on which a surface of the waveguide is positioned and supported in such a way that an end of the waveguide that is located close to the light source is spaced from a non-raised portion the master heatsink and a space is defined between the surface of the waveguide and the non-raised portion of the master heatsink; and
wherein the master heatsink has a sidewall extending from an end thereof to be in connection with the light source and the auxiliary heatsink is arranged in the space defined between the surface of the waveguide and the non-raised portion of the backframe and is located under the surface of the waveguide and between the sidewall and the raised portion of the master heatsink.
1 Assignment
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Accused Products
Abstract
The present invention relates to a technology of displaying device, and more particularly to a heat-dissipating device of a backlight module, and which is arranged between a backframe and a waveguide of the backlight module for dissipating heat generated from a light source disposed adjacent to the waveguide, wherein the heat dissipating device includes a master heatsink, and an auxiliary heatsink; and wherein the master heatsink has a sidewall extending from an end thereof to in connection to the waveguide, and the auxiliary heatsink is arranged between the master heatsink and the waveguide. The present invention further provides a backlight module incorporated with such a heat-dissipating device. With the combination of the master heatsink and the auxiliary heatsink, a novel heat-dissipating device is created and which effectively upgrades the heat-dissipating performance under the high power density, prolonging the service life of the light source, and the increases the optical characteristic of the displaying device.
7 Citations
13 Claims
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1. A heat dissipating device for a backlight module and which is arranged between a backframe and a waveguide of the backlight module for dissipating heat generated from a light source disposed adjacent to an end of the waveguide, wherein the heat dissipating device includes a master heatsink, which is made of a material having a first composition, and an auxiliary heatsink, which is made of a material that has a second composition different from the first composition;
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wherein the master heatsink has a raised portion on which a surface of the waveguide is positioned and supported in such a way that an end of the waveguide that is located close to the light source is spaced from a non-raised portion the master heatsink and a space is defined between the surface of the waveguide and the non-raised portion of the master heatsink; and wherein the master heatsink has a sidewall extending from an end thereof to be in connection with the light source and the auxiliary heatsink is arranged in the space defined between the surface of the waveguide and the non-raised portion of the backframe and is located under the surface of the waveguide and between the sidewall and the raised portion of the master heatsink. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A heat dissipating device for a backlight module and which is arranged between a backframe and a waveguide of the backlight module for dissipating heat generated from a light source disposed adjacent to an end of the waveguide, wherein the heat dissipating device includes a master heatsink, which is made of a material having a first composition, and an auxiliary heatsink, which is made of a material that has a second composition different from the first composition;
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wherein the master heatsink has a raised portion on which a surface of the waveguide is positioned and supported in such a way that an end of the waveguide that is located close to the light source is spaced from a non-raised portion the master heatsink and a space is defined between the surface of the waveguide and the non-raised portion of the master heatsink; wherein the master heatsink has a sidewall extending from an end thereof to be in connection with the light source and the auxiliary heatsink is arranged in the space defined between the surface of the waveguide and the non-raised portion of the backframe and is located under the surface of the waveguide and between the sidewall and the raised portion of the master heatsink; and wherein a distance between the auxiliary heatsink and the sidewall of the master heatsink is about 10-15 mm.
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13. A backlight module including a backframe, and a light source, a heat dissipating device and a waveguide mounted on an internal side of the backframe, wherein the light source is arranged opposite to a side of the waveguide;
- wherein the heat dissipating device is arranged between the backframe and the waveguide for dissipating heat generated from a light source disposed adjacent to an end of the waveguide, wherein the heat dissipating device includes a master heatsink, which is made of a material having a first composition, and an auxiliary heatsink, which is made of a material that has a second composition different from the first composition;
wherein the master heatsink has a raised portion on which a surface of the waveguide is positioned and supported in such a way that an end of the waveguide that is located close to the light source is spaced from a non-raised portion the master heatsink and a space is defined between the surface of the waveguide and the non-raised portion of the master heatsink; and wherein the master heatsink has a sidewall extending from an end thereof to be in connection with the light source and the auxiliary heatsink is arranged in the space defined between the surface of the waveguide and the non-raised portion of the backframe and is located under the surface of the waveguide and between the sidewall and the raised portion of the master heatsink.
- wherein the heat dissipating device is arranged between the backframe and the waveguide for dissipating heat generated from a light source disposed adjacent to an end of the waveguide, wherein the heat dissipating device includes a master heatsink, which is made of a material having a first composition, and an auxiliary heatsink, which is made of a material that has a second composition different from the first composition;
Specification