Semiconductor device

• US 9,377,825 B2
• Filed: 06/05/2014
• Issued: 06/28/2016
• Est. Priority Date: 02/08/2008
• Status: Active Grant

• Current Assignee: Renesas Electronics Corporation
• Original Assignee: Renesas Electronics Corporation
• Inventors: Shinohara, Minoru, Araki, Makoto, Sugiyama, Michiaki
• Primary Examiner(s): Clark, Jasmine
• Application Number:
  US14/296,552
• Publication Number:
  US 20140347809A1
• Time in Patent Office: 754 Days
• Field of Search: 257/723, 257/777, 257/E25.006, 257/E25.021, 257/E25.027, 257/E23.085, 438/109
• US Class Current: 1/1
• CPC Class Codes: G06F 1/185 Mounting of expansion boards
• CPC Class Codes: G11C 5/02 Disposition of storage elements, e.g. in the form of a matrix array
• CPC Class Codes: G11C 5/063 Voltage and signal distribution in integrated semi-conductor memory access lines, e.g. word-line, bit-line, cross-over resistance, propagation delay
• CPC Class Codes: H01L 2224/05553 being rectangular
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48145 the bodies being stacked
• CPC Class Codes: H01L 2224/48225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2225/06506 Wire or wire-like electrical connections between devices
• CPC Class Codes: H01L 2225/0651 Wire or wire-like electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06527 Special adaptation of electrical connections, e.g. rewiring, engineering changes, pressure contacts, layout
• CPC Class Codes: H01L 2225/06562 at least one device in the stack being rotated or offset
• CPC Class Codes: H01L 2225/06572 Auxiliary carrier between devices, the carrier having an electrical connection structure
• CPC Class Codes: H01L 23/5388 : for flat cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 24/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/0657 : Stacked arrangements of devices
• CPC Class Codes: H01L 25/18 : the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 : Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/1815 : Shape
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/30105 : Capacitance

Abstract

A memory card has a wiring board, four memory chips stacked on a main surface of the wiring board, and a controller chip and an interposer mounted on a surface of the memory chip of the uppermost layer. The memory chips are stacked on the surface of the wiring board so that their long sides are directed in the same direction as that of the long side of the wiring board. The memory chip of the lowermost layer is mounted on the wiring board in a dislocated manner by a predetermined distance in a direction toward a front end of the memory card so as not to overlap the pads of the wiring board. The three memory chips stacked on the memory chip of the lowermost layer are disposed so that their short sides on which pads are formed are located at the front end of the memory card.

Claims

1. A semiconductor device comprising:

a wiring board having a main surface, a rear surface opposite to the main surface, a long side, a short side intersecting the long side, a plurality of first terminals arrayed along the long side on the main surface, a plurality of second terminals arrayed along the short side on the main surface, and external connecting terminals formed on the rear surface;

a memory chip mounted over the main surface of the wiring board, the memory chip having a first main surface, a first side, a second side intersecting the first side, and a plurality of first electrodes arrayed along the second side on the first main surface, the first electrodes being connected with the second terminals of the wiring board via a plurality of first wires; and

a controller chip mounted over the first main surface of the memory chip, the controller chip being operable to control the memory chip and having a second main surface and a plurality of second electrodes arrayed on the second main surface, the second electrodes being connected with the first terminals of the wiring board via a plurality of second wires,

wherein the long side of the wiring board includes a first portion and a second portion, and the first terminals are arrayed between the first side of the memory chip and the first portion of the long side of the wiring board in a plan view,

wherein a distance between the first portion of the long side of the wiring board and the first side of memory chip is greater than a distance between the second portion of the long side of the wiring board and the first side of the memory chip in a first direction perpendicular to the first side of the memory chip, and

wherein the second terminals are arranged on a first area of the main surface of the wiring board between the second side of memory chip and the short side of the wiring board.

2. The semiconductor device according to claim 1, wherein

a passive element is arranged on the main surface of the wiring board.

3. The semiconductor device according to claim 2, wherein

the passive element is a chip capacitor.

4. The semiconductor device according to claim 1, wherein

the second terminals of the wiring board are opposite to the first electrodes in the plan view.

5. The semiconductor device according to claim 1, wherein

the memory chip is one of a plurality of such memory chips mounted in a stacked manner on the main surface of the wiring board, and

the memory chips are stacked in a dislocated manner in a second direction perpendicular to the second side of the memory chip so that the respective first electrodes provided along the second sides of the memory chips are exposed.

6. The semiconductor device according to claim 1, wherein

the main surface of the wiring board, the memory chip and the controller chip are sealed with resin.

7. The semiconductor device according to claim 1, wherein

the wiring board has external dimensions being the same as external dimensions of a wiring board of a micro SD card.

8. A semiconductor device comprising:

a wiring board having;

a top surface,

a rear surface opposite the top surface,

a first long side including a straight line portion and a projected portion,

a second long side opposite the first long side,

a first short side, and

a second short side, which intersect the first and second long sides;

a memory chip mounted over the top surface of the wiring board and having;

a first main surface,

a first side facing the first long side of the wiring board,

a second side opposite the first side and facing the second long side of the wiring board,

a third side facing the first short side of the wiring board, and

a fourth side facing the second short side of the wiring board and that intersects the first and second sides; and

a controller chip for controlling the memory chip, the controller chip being mounted on the first main surface of the memory chip and having a second main surface,

wherein a plurality of first electrodes is disposed on the top surface of the wiring board between the first side of the memory chip and an outer edge of the projected portion of the wiring board in a plan view,

wherein a plurality of second electrodes are formed along the first side of the memory chip on the second main surface of the controller chip,

wherein a plurality of third electrodes are formed between the third side of the memory chip and the first short side of the wiring board on the top surface of the wiring board,

wherein a plurality of the fourth electrodes are formed along the third side of the memory chip on the first main surface of the memory chip,

wherein the first electrodes of the wiring board are electrically connected with the second electrodes of the controller chip via a plurality of first wirings,

wherein the third electrodes of the wiring board are electrically connected with the fourth electrodes of the memory chip via a plurality of second wirings,

wherein the third electrodes of the wiring board are electrically connected with the first electrodes of the wiring board,

wherein a portion of the first side of the memory chip is adjacent to the straight line portion of the wiring board,

wherein the second side of the memory chip is adjacent to the second long side of the wiring board,

wherein the fourth side of the memory chip is adjacent to the second short side of the wiring board, and

wherein an electrode is not formed on the top surface of the wiring board in the plan view between the portion of the first side of the memory chip and the straight portion of the wiring board, between the second side of the memory chip and the second long side of the wiring board, and between the fourth side of the memory chip and the second short side of the wiring board.

9. The semiconductor device according to claim 8, wherein a passive element is arranged on the top surface of the wiring board between the first side of the memory chip and the outer edge of the projected portion of the wiring board.

10. The semiconductor device according to claim 9, wherein the passive element is a chip capacitor.

11. The semiconductor device according to claim 9, wherein the first electrodes of the wiring board are arranged between the first side of the memory chip and the passive element in the plan view.

12. The semiconductor device according to claim 8, wherein the fourth electrodes of the memory chip are arranged along the third side of the memory chip such that the fourth electrodes face the third electrodes of the wiring board in the plan view.

13. The semiconductor device according to claim 8, wherein a plurality of the memory chips are stacked over the top surface of the wiring board and are displaced with respect to each other in a direction perpendicular to the third side of the memory chip so that the fourth electrodes provided on their respective third sides are exposed.

14. The semiconductor device according to claim 8, wherein the top surface of the wiring board, the memory chip and the controller chip are sealed with resin.

15. The semiconductor device according to claim 8, wherein the wiring board has external dimensions that are the same as those of a wiring board of a micro SD card.