Electromagnetic induction panel structure and method of manufacturing the same, and electromagnetic handwriting input device
First Claim
1. An electromagnetic induction panel structure, comprising:
- a multilayer substrate including an insulating base layer, a first conductive circuit layer disposed on a first surface of the insulating base layer, a second conductive circuit layer disposed on a second surface of the insulating base layer, wherein the first surface is opposite the second surface, a first outermost lateral conductive layer disposed directly on the first conductive circuit layer, and a second outermost lateral conductive layer disposed directly on the second conductive circuit layer;
a first cover unit disposed on the first outermost lateral conductive layer of the multilayer substrate; and
a second cover unit disposed on the second outermost lateral conductive layer of the multilayer substrate, wherein the second cover unit includes a wave-absorbing material layer.
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Accused Products
Abstract
An electromagnetic induction panel structure includes a multilayer substrate, a first cover unit and a second cover unit. The multilayer substrate includes a first outermost lateral conductive layer and a second outermost lateral conductive layer respectively disposed on two opposite outermost surfaces thereof. The first cover unit is disposed on the first outermost lateral conductive layer. The second cover unit is disposed on the second outermost lateral conductive layer. For example, the first cover unit includes a first insulating layer directly formed on the first outermost lateral conductive layer for directly contacting the first outermost lateral conductive layer. The second cover unit includes a second insulating layer directly formed on the second outermost lateral conductive layer for directly contacting the second outermost lateral conductive layer. The second cover unit includes a wave-absorbing material layer directly formed on the second insulating layer for directly contacting the second insulating layer.
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Citations
20 Claims
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1. An electromagnetic induction panel structure, comprising:
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a multilayer substrate including an insulating base layer, a first conductive circuit layer disposed on a first surface of the insulating base layer, a second conductive circuit layer disposed on a second surface of the insulating base layer, wherein the first surface is opposite the second surface, a first outermost lateral conductive layer disposed directly on the first conductive circuit layer, and a second outermost lateral conductive layer disposed directly on the second conductive circuit layer; a first cover unit disposed on the first outermost lateral conductive layer of the multilayer substrate; and a second cover unit disposed on the second outermost lateral conductive layer of the multilayer substrate, wherein the second cover unit includes a wave-absorbing material layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method of manufacturing an electromagnetic induction panel structure, comprising:
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disposing a first cover unit on a first outermost lateral conductive layer of a multilayer substrate, wherein the multilayer substrate includes an insulating base layer, a first conductive circuit layer disposed on a first surface of the insulating base layer, a second conductive circuit layer disposed on a second surface of the insulating base layer, wherein the first surface is opposite the second surface, the first outermost lateral conductive layer disposed directly on the first conductive circuit layer, and a second outermost lateral conductive layer disposed directly on the second conductive circuit layer; and disposing a second cover unit on the second outermost lateral conductive layer of the multilayer substrate, wherein the second cover unit includes a wave-absorbing material layer. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification