Stretchable electronic patch having a circuit layer undulating in the thickness direction

• US 9,378,450 B1
• Filed: 02/09/2015
• Issued: 06/28/2016
• Est. Priority Date: 12/05/2014
• Status: Active Grant

• Current Assignee: Vivalnk Inc.
• Original Assignee: Vivalnk Inc.
• Inventors: Mei, Junfeng, Li, Jiang
• Primary Examiner(s): Vo, Tuyen K
• Application Number:
  US14/616,986
• Publication Number:
  US 20160162774A1
• Time in Patent Office: 505 Days
• Field of Search: 235/451, 235/488, 235/492, 235/375
• US Class Current: 1/1
• CPC Class Codes: G06K 19/07722 the record carrier being multilayered, e.g. laminated sheets flat articles in general, see B32B37/00
• CPC Class Codes: G06K 19/0776 the adhering arrangement being a layer of adhesive, so that the record carrier can function as a sticker

Abstract

An electronic patch includes a first circuit layer comprising a substantially flat first substrate and a first conductive circuit, a second circuit layer comprising a substantially flat second substrate and a second conductive circuit, and an undulated ribbon that connects the first circuit layer and the second circuit layer. The undulated ribbon includes a third conductive circuit that connects the first conductive circuit and the second conductive circuit. An elastic layer encloses the first circuit layer, the second circuit layer, and the undulated ribbons.

Claims

1. An electronic patch, comprising:

a first circuit layer comprising a first flat substrate and a first conductive circuit;

a second circuit layer comprising a second flat substrate and a second conductive circuit;

an undulated ribbon that connects the first circuit layer and the second circuit layer, wherein the undulated ribbon includes a third conductive circuit that connects the first conductive circuit and the second conductive circuit, wherein the undulated ribbon is flexible, wherein the undulated ribbon is undulated in a direction perpendicular to the first flat substrate or the second flat substrate, wherein the undulated ribbon is displaced above and below the first flat substrate and the second flat substrate; and

an elastic layer that encloses the first circuit layer, the second circuit layer, and the undulated ribbons.

2. The electronic patch of claim 1, wherein the undulated ribbon is configured to unfold and elongate in a user'"'"'s movement when the electronic patch is worn by the user.

3. The electronic patch of claim 1, wherein the undulated ribbon has serpentine or zigzag shape that includes turns, folds, or loops out of a plane of the first flat substrate or the second flat substrate.

4. The electronic patch of claim 1, wherein the first flat substrate and the second flat substrate are parallel to each other.

5. The electronic patch of claim 1, wherein the undulated ribbon are fabricated by pressing a flat circuit layer by molds comprising recesses having undulated contours.

6. The electronic patch of claim 1, further comprising:

multiple undulated ribbons that connect the first circuit layer and the second circuit layer, wherein the multiple undulated ribbons define at least one opening therein.

7. The electronic patch of claim 1, wherein the first flat substrate has a Young'"'"'s Modulus higher than 0.5 Gpa.

8. The electronic patch of claim 1, wherein the first flat substrate comprises Polyimide, Polyethylene, Terephthalate, PEEK, Polyester, Aramid, Composite, Glass epoxy, and Polyethylene naphalate.

9. The electronic patch of claim 1, wherein the undulated ribbon has a Young'"'"'s Modulus lower than 0.3 Gpa.

10. The electronic patch of claim 1, wherein the elastic layer has a Young'"'"'s Modulus lower than 0.3 Gpa.

11. The electronic patch of claim 1, wherein the elastic layer comprises an elastomeric material or a viscoelastic polymeric material.

12. The electronic patch of claim 1, wherein at least one of the first circuit layer or the second circuit layer comprises one or more semiconductor chips in connection with the first conductive circuit and the second conductive circuit.

13. The electronic patch of claim 12, wherein the one or more semiconductor chips in combination with the first conductive circuit or the second conductive circuit are configured to wirelessly communicate with an external device.

14. The electronic patch of claim 13, wherein at least one of the first conductive circuit or the second conductive circuit includes an antenna circuit configured to receive or transmit wireless signals in communications with the external device.

15. The electronic patch of claim 13, wherein the one or more semiconductor chips in combination with the first conductive circuit or the second conductive circuit are configured to wirelessly communicate with the external device based on near field communication (NFC), Wi-Fi, Bluetooth, or RFID wireless communication standard.

16. The electronic patch of claim 1, further comprising:

an adhesive layer under the elastic layer and configured to adhere to a user'"'"'s skin.

17. The electronic patch of claim 1, wherein at least one of the first circuit layer or the second circuit layer comprises one or more sensors, actuators, or chemical delivery devices in connection with the conductive circuit.

18. The electronic patch of claim 1, wherein at least one of the first circuit layer or the second circuit layer comprises one or more electronic components selected from the group consisting of capacitors, inductors, resistors, metal pads, diodes, transistors, and amplifiers.

20. The electronic patch of claim 1, wherein a cross-section of the substrate has a zigzag shape.

19. An electronic patch, comprising:

an undulated circuit layer comprising;

a substrate comprising a plurality of patches that are separated by fold lines parallel to a plane defined by the substrate;

a conductive circuit; and

a plurality of electronic components on different patches in the plurality of patches, wherein the plurality of electronic components are connected by the conductive circuit, wherein the substrate is folded along the fold lines that are parallel to the plane defined by the substrate, wherein adjacent patches of the different patches are tilted in opposite directions relative to the plane defined by the substrate; and

an elastic layer that encloses the undulated circuit layer.