Radio IC device

• US 9,378,452 B2
• Filed: 11/13/2013
• Issued: 06/28/2016
• Est. Priority Date: 05/16/2011
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Dokai, Yuya, Ieki, Tsutomu
• Primary Examiner(s): Le, Thien M
• Assistant Examiner(s): Habib, Asifa
• Application Number:
  US14/078,596
• Publication Number:
  US 20140061319A1
• Time in Patent Office: 958 Days
• US Class Current: 1/1
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: G06K 19/07771 the record carrier comprising means for minimising adverse effects on the data communication capability of the record carrier, e.g. minimising Eddy currents induced in a proximate metal or otherwise electromagnetically interfering object
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 9/26 with folded element or elements, the folded parts being spaced apart a small fraction of operating wavelength resonant loop antennas H01Q7/00

Abstract

A radio IC device includes a flexible dielectric base, a radiation element that is a metal film or a metal foil wrapped around the dielectric base, and a radio IC element mounted on the radiation element. The radiation element includes, in a portion other than a portion where the radio IC element is disposed, a bonded portion that is bonded to the dielectric element and a non-bonded portion that is not bonded to the dielectric element. The radio IC element is arranged to be directly opposed to the dielectric element with the portion of the radiation element where the radio IC element is disposed not bonded to the dielectric base.

Claims

1. A radio IC device comprising:

a flexible dielectric base including a first surface, a second surface, and an end surfaces, the first surface and the second surface facing each other and being connected to one another by the end surface;

a radiation element including a metal film or a metal foil wrapped around the dielectric base and extending from the first surface to the second surface through the end surface; and

a radio IC element mounted on the radiation element;

wherein

the radiation element includes, in a portion of the radiation element other than a portion of the radiation element on which the radio IC element is mounted, a bonded portion that is bonded to the dielectric base and a non-bonded portion that is not bonded to the dielectric base;

the radio IC element is arranged to be adjacent to the first surface of the dielectric base;

the portion of the radiation element on which the radio IC element is mounted and a portion of the radiation element facing the end surface are not bonded to the dielectric base; and

a portion of the radiation element facing the second surface is bonded to the dielectric base.

2. The radio IC device according to claim 1, wherein the radiation element is provided on one main surface of an insulating film.

3. The radio IC device according to claim 1, further comprising an insulating case that houses the dielectric base, the radiation element and the radio IC element.

4. The radio IC device according to claim 3, wherein

the radio IC element is located on the first surface of the dielectric base;

and

the dielectric base is bonded to the case at a portion of the dielectric base other than the portion of the dielectric base where the radio IC element is disposed.

5. The radio IC device according to claim 1, wherein

the radio IC element is located on the first surface of the dielectric base.

6. The radio IC device according to claim 1, wherein

the radio IC element is located on the first surface of the dielectric base;

and

a portion of the radiation element facing the first surface is bonded to the dielectric base.

7. The radio IC device according to claim 1, wherein the dielectric base has an elongated rectangular or substantially rectangular parallelepiped shape.

8. The radio IC device according to claim 1, wherein the radiation element has a width that is smaller than a width of the dielectric base.

9. The radio IC device according to claim 1, further comprising an adhesive arranged to bond the bonded portion to the dielectric base.

10. The radio IC device according to claim 1, wherein the radiation element includes an opening and a slit located in a central portion thereof.

11. The radio IC device according to claim 10, wherein feed sections are defined by opposite sides of the slit and the radio IC element is mounted to the feed sections.

12. The radio IC device according to claim 11, wherein the radio IC element is electrically connected to the feed sections via electromagnetic coupling or direct electrical connection.

13. The radio IC device according to claim 1, further comprising a flexible resin film disposed on a surface of the radiation element.

14. The radio IC device according to claim 1, wherein an upper surface of the radiation element functions as a patch antenna.

15. An article comprising:

a curved surface; and

the radio IC device according to claim 1 attached to the curved surface.

16. The article according to claim 15, wherein the radio IC device is bent in a lengthwise direction thereof such that upper surfaces of the dielectric base and the radiation element are stretched, and lower surfaces of the dielectric base and the radiation element are contracted.