Inspection apparatus, inspection system, inspection method of semiconductor devices, and manufacturing method of inspected semiconductor devices

• US 9,379,029 B2
• Filed: 07/18/2012
• Issued: 06/28/2016
• Est. Priority Date: 07/18/2012
• Status: Active Grant

• Current Assignee: DENSO Corporation
• Original Assignee: Toyota Jidosha Kabushiki Kaisha (Toyota Motor Corporation)
• Inventors: Osanai, Yosuke, Ushijima, Takashi
• Primary Examiner(s): Nguyen, Tung X
• Application Number:
  US14/402,951
• Publication Number:
  US 20150123694A1
• Time in Patent Office: 1,441 Days
• US Class Current: 1/1
• CPC Class Codes: G01R 31/2601 Apparatus or methods therefor G01R31/2607, G01R31/2642 take precedence
• CPC Class Codes: G01R 31/2863 Contacting devices, e.g. sockets, burn-in boards or mounting fixtures in general G01R1/04
• CPC Class Codes: H01L 22/10 Measuring as part of the manufacturing process burn-in G01R31/2855
• CPC Class Codes: H01L 22/14 for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
• CPC Class Codes: H01L 22/32 Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors arrangements for conducting electric current to or from the solid state body in operation H01L23/48

Abstract

An inspection apparatus for inspecting output signal of a semiconductor device is provided with a monitor device configured to sense a signal on the monitor line and a plurality of inspection circuits connected to the monitor line. Each inspection circuit is provided with a semiconductor device support allowing a semiconductor device to be set thereon and including a signal terminal to which a signal is input from the set semiconductor device, a first resistor connected between the signal terminal and the monitor line, a selector terminal, and a first diode connected between the signal terminal and the selector terminal so that a cathode of the first diode is connected to a selector terminal side.

Claims

1. An inspection apparatus configured to inspect output signals of semiconductor devices, the inspection apparatus comprising:

a monitor line;

a monitor device configured to sense a signal on the monitor line;

a plurality of inspection circuits connected to the monitor line; and

a selector device,

wherein each inspection circuit comprises;

a semiconductor device support on which a semiconductor device is to be set, the semiconductor device support comprising a signal terminal to which a signal is input from the semiconductor device set on the semiconductor support;

a first resistor connected between the signal terminal and the monitor line;

a selector terminal; and

a first diode connected between the signal terminal and the selector terminal so that a cathode of the first diode is connected to a selector terminal side, and

the selector device is configured to perform an operation to apply a first potential on a first selector terminal of the plurality of the selector terminals and apply a second potential lower than the first potential on other selector terminals and an operation to apply the first potential on a second selector terminal of the plurality of the selector terminals and apply the second potential on other selector terminals.

2. The inspection apparatus of claim 1, wherein

V1 is the first potential,

VH1 is an upper potential of the signal input to the signal terminal corresponding to the selector terminal on which the first potential is applied,

VF11 is a forward voltage of the first diode corresponding to the selector terminal on which the first potential is applied,

a relationship of V1>

VH1−

VF11 is satisfied,

V2 is the second potential,

VH2 is an upper potential of the signal input to the signal terminal corresponding to the selector terminal on which the second potential is applied,

VF12 is a forward voltage of the second diode corresponding to the selector terminal on which the second potential is applied, and

a relationship of V2<

VH2−

VF12 is satisfied.

3. The inspection apparatus of claim 1, wherein each inspection circuit comprises a second diode connected in parallel to the first resistor so that a cathode of the second diode is connected to a monitor line side.

4. The inspection apparatus of claim 3, wherein

VL1 is a lower potential of the signal input to the signal terminal corresponding to the selector terminal on which the first potential is applied,

V2 is the second potential,

VF12 is a forward voltage of the first diode corresponding to the selector terminal on which the second potential is applied,

VF22 is a forward voltage of the second diode corresponding to the selector terminal on which the second potential is applied, and

a relationship of V2+VF12<

VL1+VF22 is satisfied.

5. The inspection apparatus of claim 1, wherein each inspection circuit comprises a second resistor connected between the signal terminal and a connection portion connecting an anode of the first diode and the first resistor.

6. The inspection apparatus of claim 1, wherein

each semiconductor device support comprises:

a high potential terminal providing a high potential to the semiconductor device set on the semiconductor device support; and

a low potential terminal providing a low potential to the semiconductor device set on the semiconductor device support, and

each inspection circuit comprises a third resistor connected between the high potential terminal and the signal terminal.

7. The inspection apparatus of claim 1, wherein

each semiconductor device support comprises:

a high potential terminal providing a high potential to the semiconductor device set on the semiconductor device support; and

a low potential terminal providing a low potential to the semiconductor device set on the semiconductor device support, and

each inspection circuit comprises a fourth resistor connected between the low potential terminal and the signal terminal.

8. An inspection system comprising a plurality of the inspection apparatus of claim 1, wherein

the monitor line and the monitor device of each inspection apparatus are independent, and

the selector terminal of each inspection apparatus is common with the selector terminals of other inspection apparatuses.

9. A method for inspecting output signals of semiconductor devices using an inspection apparatus,

the inspection apparatus comprising:

a monitor line; and

a plurality of inspection circuits connected to the monitor line,

wherein each inspection circuit comprises;

a semiconductor device support on which a semiconductor device is to be set, the semiconductor device support comprising a signal terminal to which a signal is input from the semiconductor device set on the semiconductor support;

a first resistor connected between the signal terminal and the monitor line;

a selector terminal; and

a first diode connected between the signal terminal and the selector terminal so that a cathode of the first diode is connected to a selector terminal side,

the method comprising;

setting a semiconductor device on each semiconductor device support;

sensing a signal on the monitor line in a state where a first potential is applied on a first selector terminal among the plurality of the selector terminals and a second potential lower than the first potential is applied on other selector terminals; and

sensing the signal on the monitor line in a state where the first potential is applied on a second selector terminal among the plurality of the selector terminals and the second potential is applied on other selector terminals.

10. A method for manufacturing inspected semiconductor devices, comprising

forming structures of semiconductor devices;

and

inspecting the formed semiconductor devices,

wherein an inspection apparatus used in the inspection comprises;

a monitor line, and

a plurality of inspection circuits connected to the monitor line,

each inspection circuit comprises;

a semiconductor device support on which a semiconductor device is to be set, the semiconductor device support comprising a signal terminal to which a signal is input from the semiconductor device set on the semiconductor support;

a first resistor connected between the signal terminal and the monitor line;

a selector terminal; and

a first diode connected between the signal terminal and the selector terminal so that a cathode of the first diode is connected to a selector terminal side,

the inspection comprising;

setting a semiconductor device on each semiconductor device support;

sensing a signal on the monitor line in a state where a first potential is applied on a first selector terminal among the plurality of the selector terminals and a second potential lower than the first potential is applied on other selector terminals; and

sensing the signal on the monitor line in a state where the first potential is applied on a second selector terminal among the plurality of the selector terminals and the second potential is applied on other selector terminals.