3D die stacking structure with fine pitches

• US 9,379,078 B2
• Filed: 11/07/2013
• Issued: 06/28/2016
• Est. Priority Date: 11/07/2013
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Yu, Chen-Hua, Chen, Chen-Shien, Hu, Yen-Chang
• Primary Examiner(s): MENZ, LAURA MARY
• Application Number:
  US14/074,186
• Publication Number:
  US 20150123268A1
• Time in Patent Office: 964 Days
• US Class Current: 1/1
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 2224/1134 Stud bumping, i.e. using a wire-bonding apparatus
• CPC Class Codes: H01L 2224/11462 Electroplating
• CPC Class Codes: H01L 2224/1147 using a lift-off mask
• CPC Class Codes: H01L 2224/13017 being non uniform along the bump connector
• CPC Class Codes: H01L 2224/13023 the whole bump connector protruding from the surface
• CPC Class Codes: H01L 2224/131 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/13124 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/13144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/13147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/13155 Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/13164 Palladium [Pd] as principal constituent
• CPC Class Codes: H01L 2224/1403 Bump connectors having different sizes, e.g. different diameters, heights or widths
• CPC Class Codes: H01L 2224/14051 Bump connectors having different shapes
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/16148 the bump connector connecting to a bonding area protruding from the surface
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16238 the bump connector connecting to a bonding area protruding from the surface of the item
• CPC Class Codes: H01L 2224/1703 Bump connectors having different sizes, e.g. different diameters, heights or widths
• CPC Class Codes: H01L 2224/17051 Bump connectors having different shapes
• CPC Class Codes: H01L 2224/32145 : the bodies being stacked
• CPC Class Codes: H01L 2224/32225 : the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 : the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73253 : Bump and layer connectors
• CPC Class Codes: H01L 2224/81815 : Reflow soldering
• CPC Class Codes: H01L 2224/831 : the layer connector being supplied to the parts to be connected in the bonding apparatus
• CPC Class Codes: H01L 2225/06506 : Wire or wire-like electrical connections between devices
• CPC Class Codes: H01L 2225/06513 : Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
• CPC Class Codes: H01L 2225/06517 : Bump or bump-like direct electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06555 : Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
• CPC Class Codes: H01L 2225/06568 : the devices decreasing in size, e.g. pyramidical stack
• CPC Class Codes: H01L 2225/06582 : Housing for the assembly, e.g. chip scale package [CSP]
• CPC Class Codes: H01L 2225/06586 : Housing with external bump or bump-like connectors
• CPC Class Codes: H01L 23/3128 : the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 24/11 : Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 24/14 : of a plurality of bump connectors
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/17 : of a plurality of bump connectors
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 25/0657 : Stacked arrangements of devices
• CPC Class Codes: H01L 25/50 : Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation

Abstract

A package includes package includes a first package component including a first plurality of electrical connectors at a top surface of the first package component, and a second plurality of electrical connectors longer than the first plurality of electrical connectors at the top surface of the first package component. A first device die is over the first package component and bonded to the first plurality of electrical connectors. A second package component is overlying the first package component and the first device die. The second package component includes a third plurality of electrical connectors at a bottom surface of the second package component. The third plurality of electrical connectors is bonded to the second plurality of electrical connectors. A fourth plurality of electrical connectors is at a bottom surface of the second package. The second and the fourth plurality of electrical connectors comprise non-solder metallic materials.

Claims

1. A package comprising:

a first package component comprising;

a first plurality of electrical connectors at a top surface of the first package component; and

a second plurality of electrical connectors longer than the first plurality of electrical connectors at the top surface of the first package component;

a first device die over the first package component and bonded to the first plurality of electrical connectors, wherein the second plurality of electrical connectors has a length greater than a thickness of the first device die;

a second package component over the first package component and the first device die, wherein the second package component comprises;

a third plurality of electrical connectors at a bottom surface of the second package component, wherein the third plurality of electrical connectors is bonded to the second plurality of electrical connectors; and

a fourth plurality of electrical connectors at a bottom surface of the second package component, wherein the fourth plurality of electrical connectors comprises a second non-solder metallic material; and

a third package component under the first package component, wherein the third package component is bonded to the fourth plurality of electrical connectors, and wherein the fourth plurality of electrical connectors has a length greater than a sum of the thickness of the first device die and a thickness of the first package component.

2. The package of claim 1, wherein the first plurality of electrical connectors has a first pitch, and the second plurality of electrical connectors has a second pitch equal to or smaller than the first pitch.

3. The package of claim 1, wherein the second plurality of electrical connectors has a third pitch, and the fourth plurality of electrical connectors has a fourth pitch equal to or smaller than the third pitch.

4. The package of claim 1, and wherein the fourth plurality of electrical connectors has a length-to-width ratio greater than about 4.

5. The package of claim 1, wherein the first package component comprises a second device die.

6. The package of claim 1, wherein the second package component comprises a third device die.

7. The package of claim 1, wherein the third package component comprises a package substrate.

8. A package comprising:

a first package component comprising;

a first plurality of electrical connectors at a top surface of the first package component; and

a second plurality of electrical connectors longer than the first plurality of electrical connectors at the top surface of the first package component;

a first device die over the first package component and bonded to the first plurality of electrical connectors, wherein the second plurality of electrical connectors has a length greater than a thickness of the first device die;

a second package component over the first package component and the first device die, wherein the second package component comprises;

a third plurality of electrical connectors at a bottom surface of the second package component, wherein the third plurality of electrical connectors is bonded to the second plurality of electrical connectors; and

a fourth plurality of electrical connectors at a bottom surface of the second package component, wherein the fourth plurality of electrical connectors comprises a second non-solder metallic material;

a third package component under the first package component, wherein the third package component is bonded to the fourth plurality of electrical connectors, and wherein the fourth plurality of electrical connectors has a length greater than a sum of the thickness of the first device die and a thickness of the first package component; and

a first encapsulating material encircling each of the fourth plurality of electrical connectors, wherein the first encapsulating material further extends into a gap between the first package component and the third package component.

9. The package of claim 8, wherein the first plurality of electrical connectors has a first pitch, and the second plurality of electrical connectors has a second pitch equal to or smaller than the first pitch.

10. The package of claim 8, wherein the second plurality of electrical connectors has a third pitch, and the fourth plurality of electrical connectors has a fourth pitch equal to or smaller than the third pitch.

11. The package of claim 8, and wherein the fourth plurality of electrical connectors has a length-to-width ratio greater than about 4.

12. The package of claim 8, wherein the first package component comprises a second device die.

13. The package of claim 8, wherein the second package component comprises a third device die.

14. The package of claim 8, wherein the third package component comprises a package substrate.

15. The package of claim 8 further comprising a second encapsulating material encircling each of the second plurality of electrical connectors, wherein the first encapsulating material and the second encapsulating material are different from each other.

16. A package comprising:

a first package component comprising;

a first plurality of electrical connectors at a top surface of the first package component; and

a second plurality of electrical connectors longer than the first plurality of electrical connectors at the top surface of the first package component;

a first device die over the first package component and bonded to the first plurality of electrical connectors, wherein the second plurality of electrical connectors has a length greater than a thickness of the first device die;

a second package component over the first package component and the first device die, wherein the second package component comprises;

a third plurality of electrical connectors at a bottom surface of the second package component, wherein the third plurality of electrical connectors is bonded to the second plurality of electrical connectors; and

a fourth plurality of electrical connectors at a bottom surface of the second package component, wherein the fourth plurality of electrical connectors comprises a second non-solder metallic material, and wherein the second plurality of electrical connectors comprises first stud bumps, and the fourth plurality of electrical connectors comprises second stud bumps; and

a third package component under the first package component, wherein the third package component is bonded to the fourth plurality of electrical connectors, and wherein the fourth plurality of electrical connectors has a length greater than a sum of the thickness of the first device die and a thickness of the first package component.

17. The package of claim 16, wherein the second plurality of electrical connectors comprises first bond balls and first bond wires overlying and connected to respective ones of the first bond balls.

18. The package of claim 17, wherein the fourth plurality of electrical connectors comprises second bond balls and second bond wires underlying and connected to respective ones of the second bond balls.

19. The package of claim 16, wherein the first package component comprises a second device die, and the second package component comprises a third device die.

20. The package of claim 16, wherein the third package component comprises a package substrate.