Radiation-emitting component
First Claim
1. A radiation-emitting component havinga metallic carrier body, which comprises at least two connection locations for making electrical contact with the component,a laser diode chip, which is fixed to the metallic carrier body and is electrically conductively connected to the at least two connection locations,a housing, which surrounds the metallic carrier body in places, the housing having a bottom face, a side face and a further side face, the side faces running transversely with respect to the bottom face and with respect to each other, anda radiation exit window at the further side face of the housing, the radiation exit window facing a radiation exit face of the laser diode chip, and the radiation exit window running transversely with respect to the bottom face,whereinan axis of a beam cone of the electromagnetic radiation generated by the component during operation runs transversely with respect to a respective mounting direction of the connection locations,the housing is formed with a plastic,the connection locations extend in each case at least in places along the bottom face and the side face of the housing,the component is surface-mountable by means of the connection locations in such a way that the bottom face or the side face forms a mounting face of the component,the component is mountable in two orientations at a target location in such a way that the beam cone is larger perpendicularly to the target location than in directions parallel to the target location in a first orientation, and smaller perpendicularly to the target location than in directions parallel to the target location in a second orientation,the radiation exit window, at least in the region of a radiation passage of the electromagnetic radiation generated by the laser diode chip during operation, is transmissive to the radiation, andthe housing is not present in the region of the radiation exit window or the further side face is lowered relative to other side faces of the housing and is adjoined by the radiation exit window.
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Accused Products
Abstract
A radiation-emitting component is specified, having a metallic carrier body (1), which comprises at least two connection locations (1a, 1b) for making electrical contact with the component, a laser diode chip (2), which is fixed to the metallic carrier body (1) and is electrically conductively connected to the at least two connection locations (1a, 1b), a housing (3), which surrounds the metallic carrier body (1) in places, wherein the housing (3) is formed with a plastic, the connection locations (1a, 1b) extend in each case at least in places along a bottom face (3a) and a side face (3b) of the housing (3), said side face running transversely with respect to the bottom face, and the component is surface-mountable by means of the connection locations (1a, 1b) in such a way that the bottom face (3a) or the side face (3b) forms a mounting face of the component.
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Citations
11 Claims
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1. A radiation-emitting component having
a metallic carrier body, which comprises at least two connection locations for making electrical contact with the component, a laser diode chip, which is fixed to the metallic carrier body and is electrically conductively connected to the at least two connection locations, a housing, which surrounds the metallic carrier body in places, the housing having a bottom face, a side face and a further side face, the side faces running transversely with respect to the bottom face and with respect to each other, and a radiation exit window at the further side face of the housing, the radiation exit window facing a radiation exit face of the laser diode chip, and the radiation exit window running transversely with respect to the bottom face, wherein an axis of a beam cone of the electromagnetic radiation generated by the component during operation runs transversely with respect to a respective mounting direction of the connection locations, the housing is formed with a plastic, the connection locations extend in each case at least in places along the bottom face and the side face of the housing, the component is surface-mountable by means of the connection locations in such a way that the bottom face or the side face forms a mounting face of the component, the component is mountable in two orientations at a target location in such a way that the beam cone is larger perpendicularly to the target location than in directions parallel to the target location in a first orientation, and smaller perpendicularly to the target location than in directions parallel to the target location in a second orientation, the radiation exit window, at least in the region of a radiation passage of the electromagnetic radiation generated by the laser diode chip during operation, is transmissive to the radiation, and the housing is not present in the region of the radiation exit window or the further side face is lowered relative to other side faces of the housing and is adjoined by the radiation exit window.
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11. A radiation-emitting component having
a metallic carrier body, which comprises at least two connection locations for making electrical contact with the component, a laser diode chip, which is fixed to the metallic carrier body and is electrically conductively connected to the at least two connection locations, a housing, which surrounds the metallic carrier body in places, the housing having a bottom face and a side face, the side face running transversely with respect to the bottom face, a radiation exit window at a further side face of the housing, wherein the radiation exit window faces a radiation exit face of the laser diode chip, wherein the housing is formed with a plastic, the connection locations extend in each case at least in places along the bottom face and the side face of the housing, the component is surface-mountable by means of the connection locations in such a way that the bottom face or the side face forms a mounting face of the component, the radiation exit window, at least in the region of a radiation passage of the electromagnetic radiation generated by the laser diode chip during operation, is transmissive to the radiation, and the further side face is lowered towards the bottom face, relative to all other side faces of the housing and is adjoined by the radiation exit window.
Specification