Driver assembly for solid state lighting

• US 9,380,653 B1
• Filed: 10/31/2014
• Issued: 06/28/2016
• Est. Priority Date: 10/31/2014
• Status: Expired due to Fees

• Current Assignee: Dale Stepps, Jose Suarez
• Original Assignee: Dale Stepps, Jose Suarez
• Inventors: Suarez, Jose, Stepps, Dale
• Primary Examiner(s): Owens, Douglas W
• Assistant Examiner(s): Chen, Jiani
• Application Number:
  US14/529,365
• Time in Patent Office: 606 Days
• Field of Search: 315/32, 315/33, 315/51
• US Class Current: 1/1
• CPC Class Codes: H05B 45/30 Driver circuits

Abstract

A driver assembly for solid state lighting that includes at least one LED which includes a base element having an upper surface, a lower surface, an outer peripheral edge extending about a periphery thereof and a perimeter region defined adjacent to the outer peripheral edge. A plurality of operative components are secured to the base element and are collectively operative at least 40 watts in order control current flow to the LED. The plurality of operative components include primary heat generating components and heat sensitive components, with the primary heat generating components disposed on the perimeter region of the base element and the heat sensitive component disposed in spaced relation from the peripheral region at which the primary heat generating components are disposed. The primary heat generating components are disposed in a vertical orientation wherein a vertical surface that extends away from the base element has a greater surface area than a horizontal surface that confronts the base element. Further provided is a heat sink which has a pair of vertical elements formed of a thermally conductive material, the vertical elements extending upward along part of the outer peripheral edge of the base element in confronting, heat receiving relation to the vertical surfaces of the primary heat generating components.

Claims

1. A driver assembly for solid state lighting that includes at least one LED comprising:

a base element;

said base element including an upper surface and a lower surface, and an outer peripheral edge extending about a periphery thereof;

said base element further comprising a perimeter region adjacent to said outer peripheral edge;

a plurality of operative components secured to said base element, said plurality of operative components collectively operative at least 40 watts and structured to control current flow to the at least one LED;

said plurality of operative components comprising at least two primary heat generating components and at least one heat sensitive component;

said primary heat generating components disposed on said perimeter region of said base element and said at least one heat sensitive component disposed in spaced relation from said outer peripheral edge adjacent said peripheral region in which said primary heat generating components are disposed;

said primary heat generating components further disposed in a vertical orientation wherein a vertical surface that extends away from said base element has a greater surface area than a horizontal surface that confronts said base element;

a heat sink, said heat sink including at least one vertical element formed of a thermally conductive material; and

said at least one vertical element extending along at least a portion of said outer peripheral edge of said base element in confronting, heat receiving relation to said vertical surface of at least some of said primary heat generating components.

2. A driver assembly as recited in claim 1 wherein said outer peripheral edge of said base element is less than 4 inches long in any directional axis.

3. A driver assembly as recited in claim 2 wherein a maximum vertical dimension of said operative components is less than 1.5 inches.

4. A driver assembly as recited in claim 1 wherein said base element, said operative components and said heat sink are structured to be contained within a 4 inch junction box.

5. A driver assembly as recited in claim 1 further comprising an encapsulation layer structured to pott said base element, said operative components and said heat sink and contain any source of ignition or flammability.

6. A driver assembly as recited in claim 5 wherein said encapsulation layer is fluid impervious and is further structured to prevent liquid from contacting said operative components.

7. A driver assembly as recited in claim 1 wherein said base element comprises a printed circuit board.

8. A driver assembly as recited in claim 1 wherein said outer peripheral edge comprising two pairs of substantially parallel opposing edges.

9. A driver assembly as recited in claim 8 wherein one of said pair of substantially parallel opposing edges comprise hot edges, said at least one vertical element of said heat sink disposed adjacent at least one of said hot edges.

10. A driver assembly as recited in claim 9 wherein said perimeter region further comprises at least two hot regions, each of said hot regions disposed adjacent said hot edges.

11. A driver assembly as recited in claim 10 wherein said primary heat generating components are disposed in said hot regions.

12. A driver assembly as recited in claim 11 wherein said heat sink comprises a pair of said vertical elements, said vertical elements disposed adjacent both of said hot edges so as to direct heat generated by said primary heat generating components towards said hot edges and away from said heat sensitive component.

13. A driver assembly as recited in claim 12 wherein at least one of said primary heat generating components comprises a hot carrier diode.

14. A driver assembly as recited in claim 12 wherein at least one of said primary heat generating components comprises a diode bridge.

15. A driver assembly as recited in claim 12 wherein at least one of said primary heat generating components comprises a MOSFET.

16. A driver assembly as recited in claim 12 wherein said heat sink further comprises a planar element, said planar element secured in confronting, heat receiving relation to said lower surface of said base element.

17. A driver assembly as recited in claim 1 wherein said operative components are structured to achieve a power output range and said heat sensitive component comprises at least a microprocessor, said microprocessor structured to calibrate a power output of said operative components within said power output range so as to achieve a precise customized power output.

18. A driver assembly as recited in claim 17 further comprising an encapsulation layer structured to pott said base element, said operative components and said heat sink and contain any source of ignition or flammability.

19. A driver assembly as recited in claim 18 wherein said microprocessor comprises at least one control element, said control element extending through said encapsulation layer and structured to provide exterior programming access to said microprocessor so as to define said power output of said operative components within said power output range, without requiring replacement of any of said operative components.

20. A driver assembly as recited in claim 17 wherein said plurality of operative components collectively operative at least 100 watts.

21. A driver assembly as recited in claim 17 wherein said plurality of operative components collectively operative at least 200 watts.

22. A driver assembly as recited in claim 1 wherein said operative components further comprise an input inductor and an output inductor, both of said inductors being disposed on said base element, and at least one of said inductors being magnetically shielded so as to prevent magnetic interference between said inductors.

23. A driver assembly as recited in claim 22 wherein said output inductor is fully magnetically shielded.