Card de-bowing mechanism

• US 9,381,695 B2
• Filed: 05/23/2013
• Issued: 07/05/2016
• Est. Priority Date: 05/23/2013
• Status: Active Grant

• Current Assignee: Entrust Corp.
• Original Assignee: Entrust Datacard Corporation (Entrust Corp.)
• Inventors: Zaborowski, Alexander Kelly, Wickstrom, David E., Juriasingani, Rajesh Kalachand
• Primary Examiner(s): Osele, Mark A
• Application Number:
  US13/900,840
• Publication Number:
  US 20140345787A1
• Time in Patent Office: 1,139 Days
• US Class Current: 1/1
• CPC Class Codes: B29C 53/18 of plates or sheets
• CPC Class Codes: B29L 2017/006 Memory cards, chip cards
• CPC Class Codes: B32B 2037/0061 the apparatus being an office laminator
• CPC Class Codes: B32B 2425/00 Cards, e.g. identity cards, credit cards
• CPC Class Codes: B32B 37/0015 to avoid warp or curl
• CPC Class Codes: B32B 37/14 characterised by the properties of the layers
• CPC Class Codes: B32B 38/145 Printing
• CPC Class Codes: B65H 2301/512565 involving tri-roller arrangement
• CPC Class Codes: B65H 2701/1914 Cards, e.g. telephone, credit and identity cards
• CPC Class Codes: B65H 29/70 Article bending or stiffening arrangements
• CPC Class Codes: Y10T 156/1002 with permanent bending or reshaping or surface deformation of self sustaining lamina

Abstract

A substrate de-bowing mechanism, system and method are described. The mechanism can include a substrate support, one or more stationary contact members, and one or more dynamic or movable contact members that are adapted to contact the substrate and bend the substrate in a desired direction to reduce or eliminate bowing of the substrate. The mechanism is controlled by a CPU or other controller that can adjust the de-bow parameters of the de-bowing mechanism based on input settings that can be dynamic and/or static settings. The mechanism can be used to de-bow a variety of substrates including plastic cards, passports, and passport pages.

Claims

1. A substrate de-bowing mechanism, comprising:

a substrate support having a substrate travel path;

a first, stationary substrate contact member mounted on the substrate support and positioned to engage a surface of a substrate during de-bowing;

a first, movable substrate contact member rotatably mounted on the substrate support for rotation about a rotation axis, and the first, movable substrate contact member is rotatable between a first home position that is on one side of the substrate travel path to permit engagement of the first, movable substrate contact member with a first surface of the substrate and a second home position that is on a second, opposite side of the substrate travel path to permit engagement of the first, movable substrate contact member with a second surface of the substrates;

a second, movable substrate contact member rotatably mounted on the substrate support for rotation about a rotation axis, and the second, movable substrate contact member is rotatable between a first home position that is on the one side of the substrate travel path to permit engagement of the second, movable substrate contact member with the first surface of the substrate and a second home position that is on the second, opposite side of the substrate travel path to permit engagement of the second, movable substrate contact member with the second surface of the substrate;

the first, movable substrate contact member is disposed on a first axial side of the first, stationary substrate contact member and the second, movable substrate contact member is disposed on a second axial side of the first, stationary substrate contact member, and the first, stationary substrate contact member is located between the first and second movable substrate contact members; and

the rotation axes of the first and second movable substrate contact members are located axially between the first and second movable substrate contact members, and the rotation axes are perpendicular to a substrate transport direction.

2. The substrate de-bowing mechanism of claim 1, further comprising:

a second, stationary substrate contact member mounted on the substrate support, the second, stationary substrate contact member is positioned relative to the first, stationary substrate contact member to engage a surface of a substrate during de-bowing that is opposite the surface engaged by the first, stationary substrate contact member.

3. The substrate de-bowing mechanism of claim 2, wherein the first, stationary substrate contact member is disposed opposite of and faces the second, stationary substrate contact member and define a nip therebetween.

4. The substrate de-bowing mechanism of claim 2, wherein the first, stationary substrate contact member comprises an idler roller, the second, stationary substrate contact member comprises a driven roller, and the first, stationary substrate contact member and the second, stationary substrate contact member are not movable toward each other.

5. The substrate de-bowing mechanism of claim 1, wherein the first, movable substrate contact member and the second, movable substrate contact member each comprises a single contact member having a first end, a second end, and a length between the first end and the second end;

the first end of each single contact member has a frustoconical shape that extends toward the second end;

the second end of each single contact member has a frustoconical shape that extends toward the first end; and

the length is equal to or greater than a height of the substrate to be de-bowed.

6. The substrate de-bowing mechanism of claim 1, wherein the first, movable substrate contact member and the second, movable substrate contact member each comprises first and second contact portions that are not directly connected to one another, each contact portion having a first end fixed to a support structure that is rotatable about the respective rotation axis, a second free end, the first and second contact portions extend toward one another, and each of the first and second contact portions has a frustoconical shape;

and a distance from the first end of the first contact portion to the first end of the second contact portion is equal to or greater than a height of the substrate to be de-bowed.

7. The substrate de-bowing mechanism of claim 1, further comprising a drive mechanism for rotating the first and second movable substrate contact members about the respective rotation axes.

8. The substrate de-bowing mechanism of claim 7, wherein the drive mechanism comprises one of the following:

a single drive mechanism mechanically connected to each of the first and second movable substrate contact members that rotates each of the first and second movable substrate contact members about the respective rotation axes;

or

a first drive mechanism mechanically connected to the first, movable substrate contact member that rotates the first, movable substrate contact member about its rotation axes, and a second drive mechanism mechanically connected to the second, movable substrate contact member that rotates the second, movable substrate contact member about its rotation axes.

9. The substrate de-bowing mechanism of claim 1, wherein each of the first and second movable substrate contact members has a longitudinal axis, and each of the first and second movable substrate contact members is rotatable about its respective longitudinal axis.

10. The substrate de-bowing mechanism of claim 1, wherein an axial distance between the first and second movable card contact members when the first and second movable card contact members are at their first home position is equal to or less than the length of the substrate to be de-bowed.

11. The substrate de-bowing mechanism of claim 1, wherein the substrate comprises a plastic card, a passport or a page of a passport.

12. A substrate processing system that includes the substrate de-bowing mechanism of claim 1.

13. A substrate de-bowing mechanism, comprising:

a substrate support having a substrate travel path;

a first, stationary substrate contact member mounted on the substrate support and positioned to engage a surface of a substrate during de-bowing;

a first, movable substrate contact member rotatably mounted on the substrate support for rotation about a rotation axis, and the first, movable substrate contact member is rotatable between a first home position that is on one side of the substrate travel path to permit engagement of the first, movable substrate contact member with a first surface of the substrate and a second home position that is on a second, opposite side of the substrate travel path to permit engagement of the first, movable substrate contact member with a second surface of the substrate; and

means for heating the substrate.

14. The substrate de-bowing mechanism of claim 13, wherein the means for heating the substrate is positioned to heat the substrate prior to the substrate reaching the substrate support, or the means for heating the substrate is positioned to heat the substrate while the substrate is supported on the substrate support.

15. A substrate de-bowing mechanism, comprising:

a substrate support having a substrate travel path;

a first, stationary substrate contact member mounted on the substrate support and positioned to engage a surface of a substrate during de-bowing;

a first, movable substrate contact member rotatably mounted on the substrate support for rotation about a rotation axis, and the first, movable substrate contact member is rotatable between a first home position that is on one side of the substrate travel path to permit engagement of the first, movable substrate contact member with a first surface of the substrate and a second home position that is on a second, opposite side of the substrate travel path to permit engagement of the first, movable substrate contact member with a second surface of the substrate; and

means for detecting bowing in the substrate.

16. A method of de-bowing a substrate, comprising:

inserting a substrate to be de-bowed onto a substrate support and into a nip between a first, stationary substrate contact member and a second, stationary substrate contact member so that the first, stationary substrate contact member contacts a first side surface of the substrate and the second, stationary substrate contact member contacts a second side surface of the substrate approximate a center of the substrate;

engaging a first, movable substrate contact member with the second side surface of the substrate adjacent to a first end of the substrate, and engaging a second, movable substrate contact member with the second side surface of the substrate adjacent to a second end of the substrate;

rotating the first, movable substrate contact member and the second, movable substrate contact member in opposite directions to cause the substrate to bend about the first, stationary substrate contact member.

17. The method of claim 16, wherein rotating the first, movable substrate contact member and the second, movable substrate contact member in opposite directions comprises rotating the first, movable substrate contact member and the second, movable substrate contact member towards one another.

18. The method of claim 16, wherein rotating the first, movable substrate contact member and the second, movable substrate contact member in opposite directions comprises rotating the first, movable substrate contact member and the second, movable substrate contact member away from one another.

19. The method of claim 16, further comprising heating the substrate prior to rotating the first, movable substrate contact member and the second, movable substrate contact member in opposite directions.

20. The method of claim 16, further comprising detecting a bow in the substrate prior to rotating the first, movable substrate contact member and the second, movable substrate contact member in opposite directions.

21. The method of claim 16, wherein the substrate comprises a plastic card, a passport or a page of a passport.

22. The method of claim 16, further comprising controlling rotation of the first, movable substrate contact member and the second, movable substrate contact member based on control parameters.

23. The method of claim 22, wherein the control parameters are dynamic parameters that are input by a user or from a sensor.