System and method for thermal mitigation for tire pressure measurement electronics

• US 9,381,779 B2
• Filed: 07/09/2012
• Issued: 07/05/2016
• Est. Priority Date: 07/09/2012
• Status: Active Grant

• Current Assignee: Meggitt Safety Systems, Inc. (Meggitt PLC)
• Original Assignee: Meggitt Incorporated (Amphenol Corporation)
• Inventors: Smith, Gary Thomas
• Primary Examiner(s): Jagan, Mirellys
• Application Number:
  US13/544,186
• Publication Number:
  US 20140010264A1
• Time in Patent Office: 1,457 Days
• Field of Search: 374/143, 374/153, 374/141, 374/208
• US Class Current: 1/1
• CPC Class Codes: B60C 2200/02 for aircrafts
• CPC Class Codes: B60C 23/0498 for rim attachments B60C23/0494, B60C23/0496 take precedence
• CPC Class Codes: B64C 25/36 Arrangements or adaptations of wheels, tyres or axles in general
• CPC Class Codes: G01K 1/12 for preventing damage due to heat overloading
• CPC Class Codes: G01K 13/08 in rotary movement

Abstract

A thermal pressure measurement assembly coupled to a rim of an aircraft wheel. A housing is configured to be fastened to a wheel face. An electronics enclosure is positioned in the housing. Electronics are positioned in the electronics enclosure and configured to process a signal received from a remote sensor that measures tire pressure and temperature. Internal insulation is positioned in an interior of the housing. The internal insulation is configured to reduce the temperature of the electronics sufficiently to permit use of low temperature electronics rated to 125 degrees C.

Claims

1. A thermal pressure measurement assembly coupled to a wheel of a tire, comprising:

a housing configured to be fastened to a wheel face;

an electronics enclosure positioned in an interior of the housing;

electronics positioned in the electronics enclosure and configured to process a signal received from a remote sensor that measures the tire pressure and temperature;

internal insulation positioned in the interior of the housing and comprising a bottom wall spaced apart from and parallel to the wheel face and a sidewall adjacent to the bottom wall wherein the sidewall of the internal insulation is located between the electronics enclosure and the housing and the bottom wall is located between the electronics enclosure and the wheel face;

and,

a thermally conductive spacer extending between the electronics enclosure and the interior of the housing opposite the wheel face.

2. The assembly of claim 1, wherein the internal insulation is of a quantity and position to provide that an interior temperature of the electronics enclosure does not exceed 125 degrees C.

3. The assembly of claim 1, further comprising a top cap spaced apart from and parallel to the bottom wall and enclosing the interior of the housing.

4. The assembly of claim 1, wherein the insulation has a thermal resistance greater than a thermal resistance of a material used for the housing.

5. The assembly of claim 1, wherein the internal insulation is in the form of a ring.

6. The assembly of claim 1, wherein the internal insulation retards a transfer of heat by radiation, conduction and convection, from the housing, the wheel, and brakes, into the electronics.

7. The assembly of claim 1, wherein at least a portion of the internal insulation is positioned between a housing main body and a housing cover.

8. The assembly of claim 1, wherein the remote sensor is a piezoresistive, piezoelectric or MEMS sensor.

9. The assembly of claim 1, wherein at least a portion of the internal insulation includes collet insulation.

10. The assembly of claim 1, wherein the remote sensor is coupled to a rim of the wheel and is electrically coupled to the electronics.

11. The assembly of claim 10, wherein the remote sensor is coupled to the electronics with a conduit.

12. The assembly of claim 1, wherein the electronics include an ASIC that conditions a signal generated by the remote sensor to obtain a first analog pressure output signal.

13. The assembly of claim 12, wherein the electronics include an analog signal line coupled to a corresponding pressure input port of an ECU microprocessor.

14. The assembly of claim 1, wherein the housing includes a top cap.

15. The assembly of claim 14, wherein the thermally conductive spacer is between the top cap and the electronics enclosure.

16. The assembly of claim 15, wherein the thermally conductive path passes through the thermally conductive spacer and the top cap.

17. The assembly of claim 1, further comprising external insulation positioned at an external surface of the housing.

18. The assembly of claim 17, wherein the internal and external insulation are of a quantity and position to provide that an interior temperature of the electronics enclosure does not exceed 125 degrees C.

19. The assembly of claim 17, wherein the internal insulation and external insulation are provided on a lower housing body element coupled to the housing via fasteners.

20. The assembly of claim 19, wherein the fasteners are thermally isolated from the electronics.

21. The assembly of claim 17, wherein the internal insulation includes, a ring, one or more insulator collets and an insulator positioned at an intermediate housing body element.

22. The assembly of claim 17, wherein the thermal pressure measurement assembly is positioned over an axial opening of the wheel.