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Nested through glass via transformer

  • US 9,384,883 B2
  • Filed: 01/14/2014
  • Issued: 07/05/2016
  • Est. Priority Date: 01/14/2014
  • Status: Active Grant
First Claim
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1. A three-dimensional (3D) nested transformer, comprising:

  • a substrate having a first surface and an opposing second surface, the substrate having a plurality of through substrate vias daisy chained together with a plurality of traces, at least some of the plurality of through substrate vias having first and second conductive regions, in which the first conductive regions comprise inner cores of the plurality of through substrate vias and the second conductive regions comprise outer shells of the plurality of through substrate vias, each of the inner cores separated from the outer shells by an isolation layer; and

    the plurality of traces including a first trace of a first set of traces corresponding to a primary winding coupling together, on each of the first surface and the second surface of the substrate, an inner core of a first through substrate via of the plurality of through substrate vias to an inner core of a second through substrate via, and a second trace of a second set of traces corresponding to a secondary winding coupling together, on each of the first surface and the second surface of the substrate, an outer shell of the first through substrate via to an outer shell of the second through substrate via.

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