Particle-optical systems and arrangements and particle-optical components for such systems and arrangements

• US 9,384,938 B2
• Filed: 09/23/2011
• Issued: 07/05/2016
• Est. Priority Date: 09/28/2010
• Status: Active Grant

• Current Assignee: Applied Materials Israel Limited (Applied Materials Incorporated), Carl Zeiss Microscopy GmbH (Carl-Zeiss-Stiftung)
• Original Assignee: Applied Materials Israel Limited (Applied Materials Incorporated), Carl Zeiss Microscopy GmbH (Carl-Zeiss-Stiftung)
• Inventors: Zeidler, Dirk, Kemen, Thomas, Anger, Pascal, Casares, Antonio, Riedesel, Christof
• Primary Examiner(s): STOFFA, WYATT A
• Application Number:
  US13/825,820
• Publication Number:
  US 20130187046A1
• Time in Patent Office: 1,747 Days
• Field of Search: 250/310, 250/307, 250/306, 250/311, 250/492.2, 250/492.1, 250/492.3, 250/440.11
• US Class Current: 1/1
• CPC Class Codes: B82Y 10/00 Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
• CPC Class Codes: B82Y 40/00 Manufacture or treatment of nanostructures
• CPC Class Codes: H01J 2237/0453 multiple apertures
• CPC Class Codes: H01J 2237/0458 movable, i.e. for changing between differently sized apertures
• CPC Class Codes: H01J 2237/0492 Lens systems
• CPC Class Codes: H01J 2237/1205 Microlenses
• CPC Class Codes: H01J 37/09 Diaphragms; Shields associated with electron or ion-optical arrangements; Compensation of disturbing fields
• CPC Class Codes: H01J 37/21 Means for adjusting the focus
• CPC Class Codes: H01J 37/28 with scanning beams H01J37/268, H01J37/292, H01J37/2955 take precedence
• CPC Class Codes: H01J 37/3177 Multi-beam, e.g. fly's eye, comb probe

Abstract

The present invention concerns a charged-particle multi-beamlet system that comprises a source of charged particles (301); a first multi-aperture plate (320) having plural apertures disposed in a charged particle beam path of the system downstream of the source; a first multi-aperture selector plate (313) having plural apertures; a carrier (340), wherein the first multi-aperture selector plate is mounted on the carrier; and an actuator (350) configured to move the carrier such that the first multi-aperture selector plate is disposed in the charged particle beam path of the system downstream of the source in a first mode of operation of the system, and such that the first multi-aperture selector plate is disposed outside of the charged particle beam path in a second mode of operation of the system. The source, the first multi-aperture plate and the carrier of the system are arranged such that a first number of charged particle beamlets is generated at a position downstream of both the first multi-aperture plate and the first multi-aperture selector plate in the first mode of operation, and that a second number of charged particle beamlets is generated at the position in the second mode of operation, wherein the first number of beamlets differs from the second number of beamlets.

Claims

1. A charged-particle multi-beamlet system comprising:

a source of charged particles;

a multi-aperture plate having plural apertures disposed in a charged particle beam path of the system downstream of the source;

a multi-aperture selector plate having plural apertures arranged in a first multi-aperture array;

a carrier, wherein the multi-aperture selector plate is mounted on the carrier;

an actuator configured to move the carrier such that the first multi-aperture array is disposed in the charged particle beam path of the system downstream of the source in a first mode of operation of the system, and such that the first multi-aperture array is disposed outside of the charged particle beam path in a second mode of operation of the system;

an objective lens disposed in a beam path downstream of both the multi-aperture plate and the multi-aperture selector plate;

a stage for mounting an object in an object plane disposed downstream of the focusing lens; and

a field-separating electrode having an aperture disposed in the charged particle beam path downstream of the objective lens and upstream of the object plane;

wherein the source, the multi-aperture plate and the carrier are arranged such that a first number of one or more charged particle beamlets is generated at a position downstream of both the multi-aperture plate and the multi-aperture selector plate in the first mode of operation, and that a second number of one or more charged particle beamlets is generated at the position in the second mode of operation, wherein the first number of beamlets differs from the second number of beamlets;

wherein the aperture of the field-separating electrode has a diameter such that it is traversed by the first number of beamlets in the first mode of operation and by the second number of beamlets in the second mode of operation; and

wherein the objective lens is configured to focus each charged particle beamlet traversing the aperture of the field separating electrode in the object plane.

2. The charged-particle multi-beamlet system according to claim 1, wherein the objective lens has bore diameter, and wherein at least one of the following relations is fulfilled:

Db/De>

2, Db/De>

5, Db/De>

10 and Db/De>

20, wherein

Db is the bore diameter of the objective lens, and

De is a diameter of the aperture of the field-separating electrode.

3. The charged-particle multi-beamlet system according to claim 1, wherein a distance of the field-separating electrode from the object plane is smaller than at least one of:

2.0 mm, 1.2 mm, 0.8 mm, 0.5 mm, 0.3 mm and 0.2 mm, and/or wherein the diameter of the aperture of the field-separating electrode is smaller than at least one of;

2.0 mm, 1.5 mm, 1.0 mm, 0.8 mm, 0.6 mm and 0.4 mm.

4. The charged-particle multi-beamlet system according to claim 1, wherein the apertures of the first multi-aperture array are arranged in a regular pattern.

5. The charged-particle multi-beamlet system according to claim 1, wherein the apertures of the first multi-aperture array are arranged in a regular pattern including at least one of a hexagonal pattern and a rectangular pattern.

6. The charged-particle multi-beamlet system according to claim 1, further comprising a detector arranged to detect charged particles emanating from the object plane.

7. The charged-particle multi-beamlet system according to claim 1, further comprising a detector arranged to detect charged particles emanating from the object plane, the detector comprising a plurality of detector elements with the system being configured such that each of the detector elements receives charged particles generated on the object by one beamlet.

17. A method, comprising:

directing a first number of charged particle beamlets onto an object while an electric field applied to a surface of the object has a first field strength; and

directing a second number of charged particle beamlets onto the object while the electric field applied to the surface of the object has a second field strength;

wherein the first number is smaller than the second number and wherein the first electric field strength is smaller than the second electric field strength; and

wherein the method is performed using the charged-particle multi-beamlet system according to claim 1.

8. A charged-particle multi-beamlet system comprising:

a source of charged particles;

a multi-aperture plate having plural apertures disposed in a charged particle beam path of the system downstream of the source;

a multi-aperture selector plate having plural apertures;

a carrier, wherein the—

multi-aperture selector plate is mounted on the carrier;

an actuator configured to move the carrier such that the first multi-aperture array is disposed in the charged particle beam path of the system downstream of the source in a first mode of operation of the system, and such that the first multi-aperture array is disposed outside of the charged particle beam path in a second mode of operation of the system;

an objective lens disposed in a beam path downstream of both the multi-aperture plate and the multi-aperture selector plate;

a stage for mounting an object in an object plane disposed downstream of the focusing lens;

a field-separating electrode having an aperture disposed in the charged particle beam path downstream of the objective lens and upstream of the object plane;

a first voltage supply configured to supply a first voltage to the multi-aperture plate such that charged particle beamlets traversing the apertures of the multi-aperture plate each have a beamlet focus at a distance downstream of the multi-aperture plate;

a second voltage supply configured to supply a second voltage to the field-separating electrode;

a third voltage supply configured to supply a third voltage to the object; and

a controller configured to control the actuator and the second and third voltage supplies;

wherein the source, the first multi-aperture plate and the carrier are arranged such that a first number of one or more charged particle beamlets is generated at a position downstream of both the multi-aperture plate and the multi-aperture selector plate in the first mode of operation, and that a second number of one or more charged particle beamlets is generated at the position in the second mode of operation, and wherein the first number of beamlets in the first mode of operation is smaller than the second number of beamlets in the second mode of operation;

wherein the aperture of the field-separating electrode has a diameter such that it is traversed by the first number of beamlets in the first mode of operation and by the second number of beamlets in the second mode of operation; and

wherein the objective lens is configured such that the focus of each beamlet is imaged onto the object plane.

9. The charged-particle multi-beamlet system according to claim 8, wherein the controller is configured to control the second and third voltage supplies such that a first voltage difference exists between the second voltage and the third voltage in the first mode of operation, and such that a second voltage difference exists between the second voltage and the third voltage in the second mode of operation, and wherein the first voltage difference is different from the second voltage difference.

10. The charged-particle multi-beamlet system according to claim 8, wherein the controller is configured to control the second and third voltage supplies such that a first voltage difference exists between the second voltage and the third voltage in the first mode of operation, and such that a second voltage difference exists between the second voltage and the third voltage in the second mode of operation, and wherein the first voltage difference is smaller than the second voltage difference.

11. The charged-particle multi-beamlet system according to claims 8, wherein the controller is configured to control the second and third voltage supplies such that a first electrical field strength exists at the object plane in the first mode of operation, and such that a second electrical field strength exists at the object plane in the second mode of operation, and wherein the first electrical field strength is different from the second electrical field strength.

12. The charged-particle multi-beamlet system according to claims 8, wherein the controller is configured to control the second and third voltage supplies such that a first electrical field strength exists at the object plane in the first mode of operation, and such that a second electrical field strength exists at the object plane in the second mode of operation, and wherein the first electrical field strength is smaller than the second electrical field strength.

13. The charged-particle multi-beamlet system according to claim 8, wherein the objective lens comprises magnetic pole pieces and at least one coil for generating a focusing magnetic field between the pole pieces.

14. The charged-particle multi-beamlet system according to claim 8, wherein the objective lens comprises magnetic pole pieces and at least one coil for generating a focusing magnetic field between the pole pieces, and wherein the controller is configured to control the focusing magnetic field such that the focusing magnetic field is a same field in both the first and second modes of operation.

15. The charged-particle multi-beamlet system according to claim 8, wherein the objective lens comprises at least one pair of electrodes and a voltage supply to generate a focusing electric field between the pair of electrodes.

16. The charged-particle multi-beamlet system according to claim 8, wherein the objective lens comprises at least one pair of electrodes and a voltage supply to generate a focusing electric field between the pair of electrodes, and wherein the controller is configured to control the focusing electric field such that the focusing electric field is a same field in both the first and second modes of operation.

18. A method, comprising:

directing a first number of charged particle beamlets onto an object while an electric field applied to a surface of the object has a first field strength; and

directing a second number of charged particle beamlets onto the object while the electric field applied to the surface of the object has a second field strength;

wherein the first number is smaller than the second number and wherein the first electric field strength is smaller than the second electric field strength; and

wherein the method is performed using the charged-particle multi-beamlet system according to claim 8.