Dry-etch selectivity

• US 9,384,997 B2
• Filed: 01/22/2015
• Issued: 07/05/2016
• Est. Priority Date: 11/20/2012
• Status: Active Grant

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Ren, He, Yang, Jang-Gyoo, Baek, Jonghoon, Wang, Anchuan, Park, Soonam, Garg, Saurabh, Chen, Xinglong, Ingle, Nitin K.
• Primary Examiner(s): Deo, Duy
• Assistant Examiner(s): ANGADI, MAKI A
• Application Number:
  US14/602,835
• Publication Number:
  US 20150132968A1
• Time in Patent Office: 530 Days
• Field of Search: 438/724, 216/37, 216/67
• US Class Current: 1/1
• CPC Class Codes: H01J 37/32357 Generation remote from the workpiece, e.g. down-stream
• CPC Class Codes: H01L 21/31116 by dry-etching

Abstract

A method of etching exposed patterned heterogeneous structures is described and includes a remote plasma etch formed from a reactive precursor. The plasma power is pulsed rather than left on continuously. Plasma effluents from the remote plasma are flowed into a substrate processing region where the plasma effluents selectively remove one material faster than another. The etch selectivity results from the pulsing of the plasma power to the remote plasma region, which has been found to suppress the number of ionically-charged species that reach the substrate. The etch selectivity may also result from the presence of an ion suppression element positioned between a portion of the remote plasma and the substrate processing region.

Claims

1. A method of etching a patterned substrate in a substrate processing region of a substrate processing chamber, wherein the patterned substrate has an exposed silicon nitride region and an exposed second material region, the method comprising:

flowing a fluorine-containing precursor into a remote plasma region fluidly coupled to the substrate processing region while forming a plasma in the plasma region to produce plasma effluents;

pulsing a power of the plasma at a plasma frequency with a plasma duty cycle;

flowing the plasma effluents through a showerhead separating the remote plasma region from the substrate processing region; and

etching the exposed silicon nitride region, wherein the substrate processing region is maintained substantially plasma free during the etching operation, and wherein the patterned substrate is maintained substantially unbiased during the etching operation.

2. The method of claim 1 wherein the plasma frequency is between about 50 Hz and about 200 kHz.

3. The method of claim 1 wherein the plasma duty cycle is greater than or about 20% and less than 80%.

4. The method of claim 1 wherein a temperature of the patterned substrate is greater than or about −

30°

C. and less than or about 150°

C.

5. The method of claim 1 wherein a pressure within the substrate processing region is below or about 50 Torr and above or about 0.1 Torr.

6. The method of claim 1 wherein forming the plasma in the plasma region to produce plasma effluents comprises applying RF power between about 10 W and about 15,000 W to the plasma region.

7. The method of claim 1 wherein the plasma is a capacitively-coupled plasma.

8. The method of claim 1 wherein flowing a fluorine-containing precursor into the remote plasma region further comprises flowing an oxygen-containing precursor into the remote plasma region.

9. The method of claim 8 wherein the oxygen-containing precursor comprises at least one of O₂, O₃, N₂O or NO₂.

10. The method of claim 8 wherein flowing each of the fluorine-containing precursor and the oxygen-containing precursor into the remote plasma region comprises maintaining an O:

F atomic flow ratio above or about 0.5;

1 and below or about 10;

1.

11. The method of claim 1 wherein the exposed second material region is an exposed silicon oxide region and the selectivity of the etching operation (exposed silicon nitride region:

exposed silicon oxide region) is greater than or about 40;

1.

12. The method of claim 1 wherein the exposed second material region is an exposed silicon region and the selectivity of the etching operation (exposed silicon nitride region:

exposed silicon region) is greater than or about 10;

1.

13. The method of claim 1 wherein the fluorine-containing precursor comprises a precursor selected from the group consisting of NF₃, hydrogen fluoride, atomic fluorine, diatomic fluorine, nitrogen trifluoride, carbon tetrafluoride and xenon difluoride.

14. The method of claim 1 wherein the fluorine-containing precursor and the plasma effluents are essentially devoid of hydrogen.

15. The method of claim 1 wherein there is essentially no concentration of ionized species and free electrons within the substrate processing region while etching the exposed silicon nitride region.

16. The method of claim 1 wherein pulsing the power of the plasma comprises pulsing the power for at least 1000 pulses.

17. The method of claim 1 wherein pulsing the power of the plasma comprises applying no plasma power between a pair of pulses.

18. The method of claim 1 wherein the minimum ID of the through-holes in the showerhead is between about 0.2 mm and about 5 mm.

19. A method of etching a patterned substrate in a substrate processing region of a semiconductor processing chamber, the method comprising:

flowing a first precursor into a remote plasma region of a semiconductor processing chamber separated from the substrate processing region by a showerhead;

pulsing a power for a plasma generated within the remote plasma region;

etching the patterned substrate with plasma effluents produced by the pulsed plasma, wherein the patterned substrate is maintained substantially unbiased during the etching operation.

20. The method of claim 19, wherein the first precursor comprises a fluorine-containing precursor.