Image sensor and image processing device
First Claim
1. An image sensor comprising a plurality of unit pixels, each of the unit pixels comprising:
- a semiconductor layer having an upper surface and an opposing lower surface;
a first organic photoelectric conversion portion disposed on the upper surface of the semiconductor layer, that receives incident light, and converts a first color component of the incident light into a corresponding first electrical signal;
a transistor layer disposed on the lower surface of the semiconductor layer and including a pixel circuit that receives the first electrical signal;
a first penetration wiring that laterally penetrates a first side surface of the semiconductor layer between the upper and lower surfaces, and that electrically connects the first organic photoelectric conversion portion with the pixel circuit to communicate the first electrical signal;
a second organic photoelectric conversion portion disposed on the first organic photoelectric conversion portion, that receives the incident light, and converts a second color component of the incident light into a corresponding second electrical signal; and
a second penetration wiring that laterally penetrates a second side surface of the semiconductor layer between the upper and lower surfaces, and that electrically connects the second organic photoelectric conversion portion with the pixel circuit to communicate the second electrical signal.
1 Assignment
0 Petitions
Accused Products
Abstract
An image sensor includes a semiconductor layer, an organic photoelectric conversion portion disposed on an upper surface of the semiconductor layer and that converts a color component of incident light into a corresponding electrical signal, a transistor layer disposed on a lower surface of the semiconductor layer and including a pixel circuit that receives the electrical signal, and penetration wiring that laterally penetrates a side surface of the semiconductor layer between the upper and lower surfaces and that electrically connects the organic photoelectric conversion portion with the pixel circuit to communicate the electrical signal.
-
Citations
17 Claims
-
1. An image sensor comprising a plurality of unit pixels, each of the unit pixels comprising:
-
a semiconductor layer having an upper surface and an opposing lower surface; a first organic photoelectric conversion portion disposed on the upper surface of the semiconductor layer, that receives incident light, and converts a first color component of the incident light into a corresponding first electrical signal; a transistor layer disposed on the lower surface of the semiconductor layer and including a pixel circuit that receives the first electrical signal; a first penetration wiring that laterally penetrates a first side surface of the semiconductor layer between the upper and lower surfaces, and that electrically connects the first organic photoelectric conversion portion with the pixel circuit to communicate the first electrical signal; a second organic photoelectric conversion portion disposed on the first organic photoelectric conversion portion, that receives the incident light, and converts a second color component of the incident light into a corresponding second electrical signal; and a second penetration wiring that laterally penetrates a second side surface of the semiconductor layer between the upper and lower surfaces, and that electrically connects the second organic photoelectric conversion portion with the pixel circuit to communicate the second electrical signal. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
-
-
12. An image sensor comprising a plurality of unit pixels, each of the unit pixels comprising:
-
a semiconductor layer having an upper surface and an opposing lower surface; a first organic photoelectric conversion portion disposed on the upper surface of the semiconductor layer, that receives incident light, and converts a first color component of the incident light into a corresponding first electrical signal; a transistor layer disposed on the lower surface of the semiconductor layer and including a pixel circuit that receives the first electrical signal; a first penetration wiring that laterally penetrates a first side surface of the semiconductor layer between the upper and lower surfaces, and that electrically connects the first organic photoelectric conversion portion with the pixel circuit to communicate the first electrical signal; a photodetector disposed on the lower surface of the semiconductor layer; a color filter layer disposed on the upper surface of the semiconductor layer that passes a second color component of the incident light different from the first color component, such that the second color component is incident onto and is absorbed by the photodetector, and the photodetector accumulates electrical charge in proportion to the absorbed second color component and generates a corresponding second electrical signal communicated to the pixel circuit; and a lens layer disposed on the first organic photoelectric conversion portion that focuses the incident light through the first organic photoelectric conversion portion towards the photodetector. - View Dependent Claims (13, 14, 15)
-
-
16. An image sensor comprising an array of unit pixels, each of the unit pixels comprising:
-
a semiconductor layer having an upper surface and an opposing lower surface; an organic photoelectric conversion portion disposed on the upper surface of the semiconductor layer, that receives incident light, and converts a color component of the incident light into a corresponding electrical signal; a transistor layer disposed on the lower surface of the semiconductor layer and including a pixel circuit that receives the electrical signal; and a penetration wiring that laterally penetrates an external side surface of the semiconductor layer between the upper and lower surfaces as formed by application of a deep-trench isolation technique, and that electrically connects the organic photoelectric conversion portion with the pixel circuit to communicate the electrical signal, and that is formed at a boundary region with an adjacent unit pixel, wherein the penetration wiring blocks introduction of incident light coming from a direction of the adjacent unit pixel in the array of pixel units and blocks electrical charge passing from the adjacent unit pixel in the array of unit pixels, and wherein the penetration wiring comprises; an outer portion formed of a dielectric material having a lower refractive index than material used to form the semiconductor layer; and an inner portion formed of a conductive material that communicates the electrical signal from the organic photoelectric conversion portion to the pixel circuit. - View Dependent Claims (17)
-
Specification