Fluid handling device

• US 9,387,477 B2
• Filed: 06/05/2015
• Issued: 07/12/2016
• Est. Priority Date: 06/16/2014
• Status: Active Grant

• Current Assignee: Enplas Corporation
• Original Assignee: Enplas Corporation
• Inventors: Ono, Koichi, Kitamoto, Ken
• Primary Examiner(s): Sines, Brian J
• Application Number:
  US14/731,491
• Publication Number:
  US 20150360223A1
• Time in Patent Office: 403 Days
• Field of Search: 422/50, 422/68.1, 422/502, 422/503, 422/504, 422/551, 422/552, 422/553, 422/554, 422/547, 436/43, 436/180
• US Class Current: 1/1
• CPC Class Codes: B01L 2200/0689 Sealing
• CPC Class Codes: B01L 2200/12 Specific details about manufacturing devices
• CPC Class Codes: B01L 2300/0645 Electrodes
• CPC Class Codes: B01L 2300/0816 Cards, e.g. flat sample carriers usually with flow in two horizontal directions
• CPC Class Codes: B01L 2300/0887 Laminated structure
• CPC Class Codes: B01L 2300/123 Flexible; Elastomeric
• CPC Class Codes: B01L 2300/16 Surface properties and coatings
• CPC Class Codes: B01L 2300/18 Means for temperature control
• CPC Class Codes: B01L 2300/1827 using resistive heater
• CPC Class Codes: B01L 2400/0406 capillary forces
• CPC Class Codes: B01L 3/502707 characterised by the manufacture of the container or its components by shaping or joining plastic parts B29C59/00, B29C65/00; by laminating B32B37/00; manufacture of microstructural devices in general B81C
• CPC Class Codes: B01L 3/502715 characterised by interfacing components, e.g. fluidic, electrical, optical or mechanical interfaces

Abstract

A fluid handling device includes a substrate, a film and a conductive layer. The substrate includes a through hole or a recess. The film includes first, second and third regions. The conductive layer is disposed on one surface of the film across the first, second and third regions. The first region of the film is bonded to one surface of the substrate such that one of openings of the through hole or an opening of the recess is closed to form a housing part, and that a part of the conductive layer is exposed to the inside of the housing part. The second region of the film is bent such that the conductive layer is located on an outside. The third region of the film is bonded to the first region of the film such that the conductive layer is exposed to the exterior.

Claims

1. A fluid handling device comprising:

a substrate including a through hole or a recess;

a film including a first region, a second region adjacent to the first region and a third region adjacent to the second region; and

a conductive layer disposed on one surface of the film across the first region, the second region and the third region, the conductive layer being configured to conduct electricity or heat, wherein

the first region of the film is bonded to one surface of the substrate such that one of openings of the through hole or an opening of the recess is closed to form a housing part for housing liquid, and that a part of the conductive layer is exposed to an inside of the housing part,

the second region of the film is bent such that the conductive layer is located on an outside, and

the third region of the film is bonded to the first region of the film such that the conductive layer is exposed to an exterior.

2. The fluid handling device according to claim 1, wherein the substrate includes a cutout part at a position facing the second region of the film.

3. The fluid handling device according to claim 1, wherein the housing part includes a channel through which liquid moves by capillarity.

4. The fluid handling device according to claim 2, wherein the housing part includes a channel through which liquid moves by capillarity.

5. The fluid handling device according to claim 1, wherein the conductive layer is a metal thin film or a conductive ink layer.

6. The fluid handling device according to claim 2, wherein the conductive layer is a metal thin film or a conductive ink layer.

7. The fluid handling device according to claim 3, wherein the conductive layer is a metal thin film or a conductive ink layer.

8. The fluid handling device according to claim 4, wherein the conductive layer is a metal thin film or a conductive ink layer.