Stacked assembly of light emitting devices

• US 9,388,951 B2
• Filed: 02/20/2014
• Issued: 07/12/2016
• Est. Priority Date: 02/21/2013
• Status: Active Grant

• Current Assignee: Nichia Corporation
• Original Assignee: Nichia Corporation
• Inventors: Yamada, Motokazu
• Primary Examiner(s): Ward, Eric
• Application Number:
  US14/184,842
• Publication Number:
  US 20140231835A1
• Time in Patent Office: 873 Days
• US Class Current: 1/1
• CPC Class Codes: F21K 9/90 Methods of manufacture
• CPC Class Codes: F21V 31/005 Sealing arrangements therefor
• CPC Class Codes: F21Y 2103/10 comprising a linear array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: G02F 1/133603 with LEDs
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/09063 Holes or slots in insulating substrate not used for electrical connections
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/2054 Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics

Abstract

A stacked assembly of light emitting devices includes a first light emitting device, a second light emitting device and a sealing member. The first light emitting device includes a first substrate member extending in a longitudinal direction and defining a plurality of through-holes, and a plurality of first light emitting elements arranged on the first substrate member. The second light emitting device is arranged to overlap with the first light emitting device. The second light emitting device includes a second substrate member extending in the longitudinal direction, and a plurality of second light emitting elements arranged on the second substrate and exposed respectively through the through-holes. The sealing member seals the first light emitting elements and the second light emitting elements.

Claims

1. A stacked assembly of light emitting devices comprising:

a first light emitting device including

a first substrate member extending in a longitudinal direction and defining a plurality of through-holes, and

a plurality of first light emitting elements arranged on an upper surface of the first substrate member; and

a second light emitting device arranged to overlap with the first light emitting device, the second light emitting device including

a second substrate member extending in the longitudinal direction, and

a plurality of second light emitting elements arranged on an upper surface of the second substrate and exposed respectively through the through-holes; and

a sealing member sealing the first light emitting elements and the second light emitting elements, the sealing member including a first sealing member sealing the first light emitting elements and a second sealing member sealing the second light emitting elements, the second sealing member being disposed continuously over a part of the upper surface of the second substrate member, which is exposed through a corresponding one of the through-holes, and a part of the upper surface of the first substrate member adjacent to the corresponding one of the through-holes.

2. The stacked assembly of light emitting devices according to claim 1, wherein

a sum of weights of the first substrate member, the first light emitting elements, and the first sealing members is 1 g or less per 1 cm² of a main surface of the first substrate member.

3. The stacked assembly of light emitting devices according to claim 1, wherein

a number of the first light emitting elements per 1 cm² of a main surface of the first substrate member is 0.05 or greater and 10 or below.

4. The stacked assembly of light emitting devices according to claim 1, wherein

brightness of the first light emitting elements at a color temperature 20,000 K is 9,000 lm or greater.

5. The stacked assembly of light emitting devices according to claim 1, wherein

the first substrate member includes

a flexible base member,

a plurality of wiring portions disposed on a main surface of the base member, and

a covering layer disposed on the wiring portions and defining a plurality of openings through which a part of each of the wiring portions is respectively exposed,

the wiring portions covering 50% or greater of an area of the main surface of the base member.

6. The stacked assembly of light emitting devices according to claim 1, wherein

the first substrate member includes

a flexible base member,

a plurality of wiring portions disposed on a main surface of the base member, and

a covering layer disposed on the wiring portions and defining a plurality of openings through which a part of each of the wiring portions is respectively exposed,

the flexible base member having a thickness of 10 μ

m to 100 μ

m.

7. The stacked assembly of light emitting devices according to claim 1, wherein

a length of the first substrate member in the longitudinal direction is in a range of 5 times or greater and 200 times or less with respect to a length of the first substrate member in a lateral direction which is perpendicular to the longitudinal direction.

8. The stacked assembly of light emitting devices according to claim 1, wherein

the first light emitting elements are configured and arranged to emit lights having a different color from lights emitted from the second light emitting elements.

9. A stacked assembly of light emitting devices comprising:

a first light emitting device including

a first flexible substrate member defining a plurality of through-holes, and

a plurality of first light emitting elements arranged on an upper surface of the first flexible substrate member; and

a second light emitting device arranged to overlap with the first light emitting device, the second light emitting device including

a second flexible substrate member, and

a plurality of second light emitting elements arranged on an upper surface of the second flexible substrate member and exposed respectively through the through-holes; and

a sealing member sealing the first light emitting elements and the second light emitting elements, the sealing member including a first sealing member sealing the first light emitting elements and a second sealing member sealing the second light emitting elements, the second sealing member being disposed continuously over a part of the upper surface of the second flexible substrate member, which is exposed through a corresponding one of the through-holes, and a part of the upper surface of the first flexible substrate member adjacent to the corresponding one of the through-holes.

10. The stacked assembly of light emitting devices according to claim 9, wherein

a sum of weights of the first flexible substrate member, the first light emitting elements, and the first sealing members is 1 g or less per 1 cm² of a main surface of the first flexible substrate member.

11. The stacked assembly of light emitting devices according to claim 9, wherein

a number of the first light emitting elements per 1 cm² of a main surface of the first flexible substrate member is 0.05 or greater and 10 or below.

12. The stacked assembly of light emitting devices according to claim 9, wherein

brightness of the first light emitting elements at a color temperature 20,000 K is 9,000 lm or greater.

13. The stacked assembly of light emitting devices according to claim 9, wherein

the first flexible substrate member includes

a flexible base member,

a plurality of wiring portions disposed on a main surface of the base member, and

a covering layer disposed on the wiring portions and defining a plurality of openings through which a part of each of the wiring portions is respectively exposed,

the wiring portions covering 50% or greater of an area of the main surface of the base member.

14. The stacked assembly of light emitting devices according to claim 9, wherein

the first flexible substrate member includes

a flexible base member,

a plurality of wiring portions disposed on a main surface of the base member, and

a covering layer disposed on the wiring portions and defining a plurality of openings through which a part of each of the wiring portions is respectively exposed,

the flexible base member having a thickness of 10 μ

m to 100 μ

m.

15. The stacked assembly of light emitting devices according to claim 9, wherein

a length of the first flexible substrate member in a longitudinal direction is in a range of 5 times or greater and 200 times or less with respect to a length of the first flexible substrate member in a lateral direction which is perpendicular to the longitudinal direction.