System and method for lithography with leveling sensor

• US 9,389,520 B2
• Filed: 02/03/2012
• Issued: 07/12/2016
• Est. Priority Date: 02/03/2012
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Chen, Li-Jui
• Primary Examiner(s): RIDDLE, CHRISTINA A
• Application Number:
  US13/365,845
• Publication Number:
  US 20130201463A1
• Time in Patent Office: 1,621 Days
• Field of Search: 355/52, 355/53, 355/55, 355 67- 77, 250/492.1, 250/492.2, 250/492.22, 250/548, 430/5, 430/8, 430/22, 430/30, 430/311, 430/312, 356/4.01, 356/4.08, 356/601, 356/609, 356/614, 356/624, 356/496, 356/498, 356/500, 356/508, 356/509, 356/510, 356/511, 356/516
• US Class Current: 1/1
• CPC Class Codes: G03F 7/7085 Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
• CPC Class Codes: G03F 9/7034 Leveling

Abstract

Disclosed is a lithography system. The lithography system includes a radiation source for providing radiation energy; a reticle stage configured to hold a reticle; an imaging lens module configured to direct the radiation energy onto a substrate to form an image of the reticle; and a leveling sensor configured to receive a leveling signal from an exposure field of the reticle secured on the reticle stage.

Claims

1. A lithography system, comprising:

a radiation source for providing radiation energy;

a reticle stage configured to hold a reticle;

a substrate stage configured to hold a substrate and operable to move relative to the reticle stage;

an imaging lens module configured to direct the radiation energy onto the substrate to form an image of the reticle;

a leveling signal source configured to direct and scan a leveling signal to an exposure field of the reticle secured on the stage, wherein the leveling signal source is secured to the substrate stage such that the leveling signal source moves with the substrate stage relative to the reticle stage;

a leveling sensor configured to receive the leveling signal from the exposure field of the reticle secured on the reticle stage, wherein the leveling sensor is secured to the substrate stage such that the leveling sensor moves with the substrate stage relative to the reticle stage;

a leveling analysis module operable to receive the leveling signal from the leveling sensor, calculate at least one of a reticle flatness measurement and a reticle overlay error measurement for the reticle based on the received leveling signal, generate a first control parameter associated with a focus length based on at least one of the reticle flatness measurement and the reticle overlay error measurement, and generate a second control parameter associated with a tilt angle of the reticle based on at least one of the reticle flatness measurement and the reticle overlay error measurement;

a control module operable to receive the first and second control parameters from the leveling analysis module and move the reticle stage based on the first control parameter and tilt the reticle stage based on the second control parameter; and

wherein the leveling signal source and the leveling sensor are secured to an upper surface of the substrate stage.

2. The lithography system of claim 1, wherein the leveling sensor includes a plurality of sensing units configured in an array.

3. The lithography system of claim 1, wherein the leveling signal source is a laser source.

4. The lithography system of claim 1, wherein the imaging lens module includes a projection lens module configured between the reticle stage and the substrate stage.

5. The lithography system of claim 4, wherein the leveling signal source and the leveling sensor are configured such that the leveling signal from the leveling signal source is directed to the leveling sensor through the projection lens module.

6. The lithography system of claim 1, wherein the leveling signal source and the leveling sensor are configured such that the leveling signal is directly reflected from the reticle to the leveling sensor.

7. The lithography system of claim 1, wherein the reticle is secured on the reticle stage by an e-chuck clamp.

8. The lithography system of claim 1, wherein the reticle is secured on the reticle stage by a vacuum clamp.

9. The lithography system of claim 1, wherein the control module is operable to move the reticle stage based on the first control parameter along a first axis and tilt the reticle stage based on the second control parameter along a second axis that is different than the first axis.

10. A lithography system, comprising:

a radiation source for providing radiation energy;

a reticle stage configured to hold a reticle having a circuit pattern within an exposure field;

a substrate stage configured to secure a substrate to an upper surface of the substrate stage;

an optical module configured to direct the radiation energy onto the substrate to form an image of the circuit pattern;

a leveling signal source to provide a first leveling signal that includes a first beam and a second beam, the leveling signal source configured to direct the first beam to the exposure field of the reticle and configured to direct the second beam directly at a leveling sensor;

the leveling sensor configured to receive the first beam reflected from the reticle and the second beam directly from the leveling signal source, wherein the leveling sensor recombines the first and second beams to form a second leveling signal, wherein the leveling signal source and the leveling sensor are secured to the upper surface of the substrate stage; and

a leveling analysis module operable to analyze the second leveling signal for reticle leveling; and

a control module coupled to the leveling analysis module and configured to control the reticle stage for tilting and focusing according to feedback from the leveling analysis module.

11. The lithography system of claim 10, wherein the leveling signal source is a laser source and the leveling signal is a coherent light.

12. The lithography system of claim 11, further comprising

a leveling optical module to split the coherent light from the leveling signal source, generating the first beam and the second beam;

and

wherein the leveling optical module is operable to direct the first beam to the leveling sensor, and direct the second beam to the reticle and then to the sensor such that an interference pattern is formed between the first and second beams, and

wherein the leveling analysis module is operable to extract the leveling data of the reticle from the interference pattern.

13. The lithography system of claim 10, wherein the leveling analysis module is operable to generate a first control parameter associated with a focus length and a second control parameter associated with a tilt angle of the reticle based on the second leveling signal;

and

wherein the control module is operable to move the reticle stage based on the first control parameter and tilt the reticle stage based on the second control parameter.

14. A method for a lithography system, comprising:

securing a reticle on a reticle stage of the lithography system, wherein the reticle includes a circuit pattern within an exposure field;

after securing the reticle on the reticle stage, scanning the reticle using a leveling signal over the exposure field of the reticle for reticle leveling while the reticle is secured on the reticle stage, wherein scanning the reticle using the leveling signal includes moving a leveling signal source producing the leveling signal while scanning the reticle, wherein the leveling signal source is operable to move in a first direction and is also operable to move in a second direction perpendicular to the first direction;

after scanning the reticle, generating a first control parameter associated with a focus length and a second control parameter associated with a tilt angle of the reticle based on the leveling signal;

moving the reticle stage based on the first control parameter and tilting the reticle stage based on the second control parameter; and

after moving the reticle stage based on the first control parameter and tilting the reticle stage based on the second control parameter, applying radiation energy from a radiation source of the lithography system to form an image of the circuit pattern of the reticle within the exposure field on a substrate.

15. The method of claim 14, wherein the applying radiation energy from a radiation source includes scanning the radiation energy over the exposure field of the reticle;

and

wherein the moving the reticle stage based on the first control parameter includes moving the reticle stage dynamically during the scanning radiation energy over the exposure field of the reticle.

16. The method of claim 14, further comprising receiving the leveling signal directed from the reticle by a leveling sensor.

17. The method of claim 14, wherein the scanning of the reticle using a leveling signal over the exposure field of the reticle is implemented while the reticle stage is positioned on one of a reticle transfer path and a reticle exposure location.

18. The method of claim 14, wherein moving the reticle stage based on the first control parameter includes moving the reticle stage along an axis, and

wherein tilting the reticle stage based on the second control parameter includes tilting the reticle stage around the axis.

19. The method of claim 14, wherein moving the reticle stage based on the first control parameter includes moving the reticle stage along a first axis, and

wherein tilting the reticle stage based on the second control parameter includes tilting the reticle stage around a second axis that is different than the first axis.

20. The method of claim 14, wherein scanning the reticle using the leveling signal includes moving a leveling sensor while the level sensor receives the leveling signal from the exposure field of the reticle.