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Transponder chip module with coupling frame on a common substrate for secure and non-secure smartcards and tags

  • US 9,390,364 B2
  • Filed: 11/24/2014
  • Issued: 07/12/2016
  • Est. Priority Date: 08/08/2011
  • Status: Active Grant
First Claim
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1. A capacitive coupling enhanced (CCE) transponder chip module (TCM) comprising:

  • a module tape (MT);

    an area for mounting an RFID chip (IC) on the module tape (MT); and

    a module antenna (MA, PA) disposed on the module tape (MT);

    characterized by;

    a conductive coupling frame (CF) disposed on the module tape (MT) having an opening (OP) defined by an inner edge (IE), an outer edge (OE) and a discontinuity comprising a slit (S) or a non-conductive stripe (NCS) extending from the opening (OP) to the outer edge (OE);

    wherein the opening (OP) is disposed surrounding and closely adjacent to the module antenna (MA);

    wherein;

    the coupling frame (CF) is formed from a conductive layer (CL) on the module tape (MT) which is one of the (i) conductive layer used to form contact pads (CP) on the face-up side of the module tape (MT) and (ii) the conductive layer used to form the module antenna on the face-down side of the module tape (MT).

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