Transponder chip module with coupling frame on a common substrate for secure and non-secure smartcards and tags

• US 9,390,364 B2
• Filed: 11/24/2014
• Issued: 07/12/2016
• Est. Priority Date: 08/08/2011
• Status: Active Grant

• Current Assignee: AmaTech Group Limited (Paragon Group Limited)
• Original Assignee: Féinics AmaTech Teoranta (Paragon Group Limited)
• Inventors: Molloy, Darren, Finn, David, Lotya, Mustafa
• Primary Examiner(s): LY, TOAN C
• Application Number:
  US14/551,376
• Publication Number:
  US 20150136858A1
• Time in Patent Office: 596 Days
• Field of Search: 235/492
• US Class Current: 1/1
• CPC Class Codes: B23K 2101/40 Semiconductor devices
• CPC Class Codes: B23K 2103/50 Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
• CPC Class Codes: B23K 26/361 for deburring or mechanical trimming B23K26/351 takes precedence
• CPC Class Codes: B23K 26/362 Laser etching
• CPC Class Codes: B23K 26/40 taking account of the properties of the material involved
• CPC Class Codes: G06K 19/07722 the record carrier being multilayered, e.g. laminated sheets flat articles in general, see B32B37/00
• CPC Class Codes: G06K 19/07747 at least one of the integrated circuit chips being mounted as a module
• CPC Class Codes: G06K 19/07754 the connection being galvanic
• CPC Class Codes: G06K 19/07794 the record carrier comprising a booster or auxiliary antenna in addition to the antenna connected directly to the integrated circuit
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop

Abstract

A capacitive coupling enhanced (CCE) transponder chip module (TCM) comprises an RFID chip (CM, IC), optionally contact pads (CP), a module antenna (MA), and a coupling frame (CF), all on a common substrate or module tape (MT). The coupling frame (CF, 320A) may be in the form of a ring, having an inner edge (IE), an outer edge IE, 324) and a central opening (OP), disposed closely adjacent to and surrounding the module antenna (MA). A slit (S) may extend from the inner edge (IE) to the outer edge (OE) of the coupling frame (CF) so that the coupling frame (CF) is “open loop”. An RFID device may comprise a transponder chip module (TCM) having a module antenna (MA), a device substrate (DS), and an antenna structure (AS) disposed on the device substrate (DS) and connected with the module antenna (MA). A portion of a conductive layer (CL, 904) remaining after etching a module antenna (MA) may be segmented to have several smaller isolated conductive structures.

Claims

1. A capacitive coupling enhanced (CCE) transponder chip module (TCM) comprising:

a module tape (MT);

an area for mounting an RFID chip (IC) on the module tape (MT); and

a module antenna (MA, PA) disposed on the module tape (MT);

characterized by;

a conductive coupling frame (CF) disposed on the module tape (MT) having an opening (OP) defined by an inner edge (IE), an outer edge (OE) and a discontinuity comprising a slit (S) or a non-conductive stripe (NCS) extending from the opening (OP) to the outer edge (OE);

wherein the opening (OP) is disposed surrounding and closely adjacent to the module antenna (MA);

wherein;

the coupling frame (CF) is formed from a conductive layer (CL) on the module tape (MT) which is one of the (i) conductive layer used to form contact pads (CP) on the face-up side of the module tape (MT) and (ii) the conductive layer used to form the module antenna on the face-down side of the module tape (MT).

2. The capacitive coupling enhanced (CCE) transponder chip module (TCM) of claim 1, wherein:

the coupling frame (CF) is disposed on the same side of the module tape (MT) as the module antenna (MA, PA).

3. The capacitive coupling enhanced (CCE) transponder chip module (TCM) of claim 1, wherein:

the coupling frame (CF) is disposed on an opposite side of the module tape (MT) from the module antenna (MA, PA).

4. The capacitive coupling enhanced (CCE) transponder chip module (TCM) of claim 1, wherein:

the coupling frame (CF) comprises wire (EW) embedded in the module tape (MT).

5. The capacitive coupling enhanced (CCE) transponder chip module (TCM) of claim 1, wherein:

the module antenna (MA) comprises an etched planar antenna (PA) having a number of tracks (traces) separated by spaces;

wherein;

a track width is less than 100 μ

m; and

a spacing between adjacent tracks is less than 75 μ

m.

6. The capacitive coupling enhanced (CCE) transponder chip module (TCM) of claim 1, wherein:

the module antenna (MA) comprises two antenna structures (PA-1, PA-2).

7. The capacitive coupling enhanced (CCE) transponder chip module (TCM) of claim 1, further comprising:

a capacitor (CAP) connected with the module antenna (MA).

8. The capacitive coupling enhanced (CCE) transponder chip module (TCM) of claim 1, wherein:

there are two coupling frames (CF-1, CF-2), one disposed on a face-up side of the module tape (MT) the other disposed on a face-down side of the module tape (MT).

9. The capacitive coupling enhanced (CCE) transponder chip module (TCM) of claim 1, wherein:

the coupling frame (CF) is disposed around the module antenna (MA) with its opening (OP) surrounding the module antenna (MA) and closely adjacent thereto.

10. The capacitive coupling enhanced (CCE) transponder chip module (TCM) of claim 1, wherein:

the coupling frame (CF) overlaps at least a portion of the module antenna (MA).

11. The capacitive coupling enhanced (CCE) transponder chip module (TCM) of claim 1, wherein:

the coupling frame (CF) extends a few millimeters beyond the module antenna (MA) on one side thereof, and extends a few centimeters beyond the module antenna (MA) on an opposite side thereof.

12. The capacitive coupling enhanced (CCE) transponder chip module (TCM) of claim 1, wherein:

the coupling frame (CF) has a geometry defined by a shape of its outer edge (OE) which is different than a geometry of the transponder chip module (TCM).

13. The capacitive coupling enhanced (CCE) transponder chip module (TCM) of claim 1, further comprising:

a plating line (PL) extending from outside of the coupling frame (CF), through the slit (S) in the coupling frame (CF) to the module antenna (MA).

14. The capacitive coupling enhanced (CCE) transponder chip module (TCM) of claim 1, further comprising:

conductive traces (CT) extending between at least some contact pads (CP) and connection bridges (CBR) of the contact pad array (CPA).

15. A capacitive coupling enhanced transponder chip module (CCE-TCM, 400) comprising:

a module tape (MT);

an RFID chip (IC) disposed on the module tape (MT);

an etched module antenna (MA) disposed on the module tape (MT); and

a coupling frame (CF) disposed on the module tape (MT), closely adjacent to the module antenna (MA), having an opening (OP) aligned with the module antenna (MA) and a slit (S) extending from the opening (OP) to an outer edge (OE) of the coupling frame (CF) so that the coupling frame (CF) is an open loop;

wherein;

the coupling frame (CF) is formed from a conductive layer (CL) on the module tape (MT) which is one of the (i) conductive layer used to form contact pads (CP) on the face-up side of the module tape (MT) and (ii) the conductive layer used to form the module antenna on the face-down side of the module tape (MT).

16. The capacitive coupling enhanced transponder chip module (CCE-TCM) of claim 15, further comprising:

contact pads (CP) so that the capacitive coupling enhanced transponder chip module (CCE-TCM) can function with dual interfaces (contactless and contact).