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Methods of etching films comprising transition metals

  • US 9,390,940 B2
  • Filed: 03/12/2014
  • Issued: 07/12/2016
  • Est. Priority Date: 03/13/2013
  • Status: Active Grant
First Claim
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1. A method of etching a substrate, the method comprising:

  • activating a substrate surface comprising a transition metal, wherein activation of the substrate surface comprises exposing the substrate surface to heat, a plasma, an oxidizing environment, or a halide transfer agent to provide an activated substrate surface; and

    exposing the activated substrate surface to a reagent comprising a Lewis base or pi acid to provide a vapor phase coordination complex comprising one or more atoms of the transition metal coordinated to one or more ligands from the reagentwherein the Lewis base or pi acid comprises a chelating amine selected from the group consisting of N,N,N′

    ,N′

    -tetramethylethylene diamine, ethylene diamine, N,N′

    -dimethylethylenediamine, 2-(aminomethyl)pyridine, 2- [(alkylamino)methyl]pyridine, and 2-[(dialkylamino)methyl]pyridine, wherein the alkyl group is C1-C6 alkyl.

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