Methods of etching films comprising transition metals
First Claim
1. A method of etching a substrate, the method comprising:
- activating a substrate surface comprising a transition metal, wherein activation of the substrate surface comprises exposing the substrate surface to heat, a plasma, an oxidizing environment, or a halide transfer agent to provide an activated substrate surface; and
exposing the activated substrate surface to a reagent comprising a Lewis base or pi acid to provide a vapor phase coordination complex comprising one or more atoms of the transition metal coordinated to one or more ligands from the reagentwherein the Lewis base or pi acid comprises a chelating amine selected from the group consisting of N,N,N′
,N′
-tetramethylethylene diamine, ethylene diamine, N,N′
-dimethylethylenediamine, 2-(aminomethyl)pyridine, 2- [(alkylamino)methyl]pyridine, and 2-[(dialkylamino)methyl]pyridine, wherein the alkyl group is C1-C6 alkyl.
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Abstract
Provided are methods for etching films comprising transition metals. Certain methods involve activating a substrate surface comprising at least one transition metal, wherein activation of the substrate surface comprises exposing the substrate surface to heat, a plasma, an oxidizing environment, or a halide transfer agent to provide an activated substrate surface; and exposing the activated substrate surface to a reagent comprising a Lewis base or pi acid to provide a vapor phase coordination complex comprising one or more atoms of the transition metal coordinated to one or more ligands from the reagent. Certain other methods provide selective etching from a multi-layer substrate comprising two or more of a layer of Co, a layer of Cu and a layer of Ni.
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Citations
17 Claims
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1. A method of etching a substrate, the method comprising:
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activating a substrate surface comprising a transition metal, wherein activation of the substrate surface comprises exposing the substrate surface to heat, a plasma, an oxidizing environment, or a halide transfer agent to provide an activated substrate surface; and exposing the activated substrate surface to a reagent comprising a Lewis base or pi acid to provide a vapor phase coordination complex comprising one or more atoms of the transition metal coordinated to one or more ligands from the reagent wherein the Lewis base or pi acid comprises a chelating amine selected from the group consisting of N,N,N′
,N′
-tetramethylethylene diamine, ethylene diamine, N,N′
-dimethylethylenediamine, 2-(aminomethyl)pyridine, 2- [(alkylamino)methyl]pyridine, and 2-[(dialkylamino)methyl]pyridine, wherein the alkyl group is C1-C6 alkyl. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 14, 15, 16)
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12. A method of etching a multi-layer substrate, the method comprising:
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providing a multi-layer substrate comprising two or more of a layer of Co, a layer of Cu and a layer of Ni; activating a surface of the layer of Co, layer of Cu or layer of Ni, wherein activation of the substrate surface comprises exposing the substrate surface to heat, a plasma or a halide transfer agent to provide an activated substrate surface; and exposing the activated substrate surface to a chelating amine at a first temperature such that the chelating amine will only form a volatile metal coordination complex with one of Co, Cu or Ni at the first temperature. - View Dependent Claims (13)
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17. A method of etching a substrate, the method comprising:
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activating a substrate surface comprising cobalt or copper, wherein activation of the substrate surface comprises exposing the substrate surface to Br2 to provide an activated substrate surface; and exposing the activated substrate surface to a reagent comprising TMEDA to provide a vapor phase coordination complex comprising one or more atoms of the cobalt or copper coordinated to one or more ligands from the reagent.
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Specification