Fault tolerant light emitters, systems incorporating fault tolerant light emitters and methods of fabricating fault tolerant light emitters

• US 9,391,118 B2
• Filed: 01/22/2008
• Issued: 07/12/2016
• Est. Priority Date: 01/22/2007
• Status: Active Grant

• Current Assignee: Creeled Incorporated
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Negley, Gerald H., Van De Ven, Antony Paul
• Primary Examiner(s): Zhu, Sheng
• Application Number:
  US12/017,558
• Publication Number:
  US 20080179602A1
• Time in Patent Office: 3,094 Days
• Field of Search: 257/88, 257/93
• US Class Current: 1/1
• CPC Class Codes: H01L 21/2654 in AIIIBV compounds
• CPC Class Codes: H01L 27/156 two-dimensional arrays
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

There is provided a light emitter comprising light emitting devices (for example, light emitting diodes) which are electrically interconnected to provide an array of at least two serially connected subsets of parallel connected light emitting devices, each subset comprising at least three light emitting devices. In some embodiments, the light emitting devices are from a contiguous region of a wafer. There is also provided a light emitter, comprising light emitting devices, means for mechanically interconnecting the light emitting devices and means for electrically interconnecting the light emitting devices to provide serially connected subsets interconnected in parallel, each subset comprising at least three light emitting devices. Also, methods of fabricating light emitters.

Claims

1. A light emitter, comprising:

a plurality of light emitting devices mechanically interconnected by a common substrate on which the light emitting devices are formed; and

a plurality of fuse links,

wherein;

the light emitting devices are electrically interconnected on the common substrate to provide an array of at least two serially connected subsets of parallel connected light emitting devices, each subset comprising at least three light emitting devices, the light emitter comprising at least first and second subsets of light emitting devices, the first subset comprising at least first, second and third light emitting devices, the second subset comprising at least fourth, fifth and sixth light emitting devices, and

a first fuse link electrically connected in series with the first light emitting device, the second fuse link electrically connected in series with the second light emitting device, the third fuse link electrically connected in series with the third light emitting device, the fourth fuse link electrically connected in series with the fourth light emitting device, the fifth fuse link electrically connected in series with the fifth light emitting device, the sixth fuse link electrically connected in series with the sixth light emitting device.

2. A method of fabricating a light emitter, comprising:

forming a plurality of light emitting devices on a substrate, the plurality of light emitting devices comprising at least first and second light emitting devices;

electrically connecting the light emitting devices on the substrate to provide an array of at least two serially connected subsets of parallel connected light emitting devices, each subset comprising at least three light emitting devices; and

connecting at least a first fuse link in series with the first light emitting device and at least a second fuse link in series with the second light emitting device and electrically in parallel with the first fuse link.

3. A light emitter, comprising:

a plurality of light emitting devices mechanically interconnected by a common substrate on which the light emitting devices are formed;

wherein;

the plurality of light emitting devices comprises at least a first n-type layer and at least a first p-type layer,

at least some of the light emitting devices are electrically interconnected on the common substrate by at least a first interconnect portion to provide an array of at least two serially connected subsets of parallel connected light emitting devices, each subset comprising at least three light emitting devices,

the plurality of light emitting devices comprises at least first and second light emitting devices,

the first light emitting device comprises a first region of the first n-type layer,

the first light emitting device comprises a first region of the first p-type layer,

the second light emitting device comprises a second region of the first n-type layer,

the second light emitting device comprises a second region of the first p-type layer,

the first light emitting device and the second light emitting device are isolated from one another by at least a first insulating region,

the first interconnect portion is electrically connected to at least one of (1) the first region of the first n-type layer and (2) the first region of the first p-type layer by a first via,

the first via extends through at least a portion of the first insulating region.